GB1462748A – Integrated circuit packages
– Google Patents
GB1462748A – Integrated circuit packages
– Google Patents
Integrated circuit packages
Info
Publication number
GB1462748A
GB1462748A
GB972075A
GB972075A
GB1462748A
GB 1462748 A
GB1462748 A
GB 1462748A
GB 972075 A
GB972075 A
GB 972075A
GB 972075 A
GB972075 A
GB 972075A
GB 1462748 A
GB1462748 A
GB 1462748A
Authority
GB
United Kingdom
Prior art keywords
bodies
rods
elements
support
members
Prior art date
1974-04-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB972075A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1974-04-19
Filing date
1975-03-07
Publication date
1977-01-26
1975-03-07
Application filed by International Business Machines Corp
filed
Critical
International Business Machines Corp
1977-01-26
Publication of GB1462748A
publication
Critical
patent/GB1462748A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K7/00—Constructional details common to different types of electric apparatus
H05K7/20—Modifications to facilitate cooling, ventilating, or heating
H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
1462748 Mounting semi-conductor devices INTERNATIONAL BUSINESS MACHINES CORP 7 March 1975 [19 April 1974] 9720/75 Heading H1K A plurality of I.C. or other semi-conductor bodies 1 are isolated from mechanical vibration by resiliently flexible support elements 3 each of which is attached to a support member 2. The elements 3 are electrically conductive, e.g. of Be/Cu and are connected to terminals on the bodies 1. As shown, the support members 2 are held on conductive rods 4 which contact terminal pads on the members 2 to which the elements 3 are also connected. The assembly is mounted within a finned casing 11 into which a coolant liquid is admitted. The support members 2 are annular to facilitate liquid flow around the bodies 1. An end member 2c slidingly engages a sleeve 18 within the housing 11 to allow for dimensional changes in the rods 4 as the temperature varies. An external connector 15 is connected to the rods 4 via flexible leads 20.
GB972075A
1974-04-19
1975-03-07
Integrated circuit packages
Expired
GB1462748A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US462461A
US3909678A
(en)
1974-04-19
1974-04-19
Packaging structure for a plurality of wafer type integrated circuit elements
Publications (1)
Publication Number
Publication Date
GB1462748A
true
GB1462748A
(en)
1977-01-26
Family
ID=23836492
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB972075A
Expired
GB1462748A
(en)
1974-04-19
1975-03-07
Integrated circuit packages
Country Status (7)
Country
Link
US
(1)
US3909678A
(en)
JP
(1)
JPS5243063B2
(en)
CA
(1)
CA1023837A
(en)
DE
(1)
DE2458846C2
(en)
FR
(1)
FR2268433B1
(en)
GB
(1)
GB1462748A
(en)
IT
(1)
IT1034378B
(en)
Families Citing this family (13)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
JPS538876U
(en)
*
1976-07-06
1978-01-25
US4103318A
(en)
*
1977-05-06
1978-07-25
Ford Motor Company
Electronic multichip module
DE2739242C2
(en)
*
1977-08-31
1979-10-04
Siemens Ag, 1000 Berlin Und 8000 Muenchen
High power converter
DE8230004U1
(en)
*
1982-10-26
1983-03-17
Inter Control Hermann Köhler Elektrik GmbH & Co KG, 8500 Nürnberg
Housing for heat-generating components, in particular electronic parts, such as modules, printed circuit boards and the like
DE3312810C2
(en)
*
1983-04-09
1986-06-19
Danfoss A/S, Nordborg
Equipment box for a converter arrangement
DE3642723A1
(en)
*
1986-12-13
1988-06-23
Grundfos Int
STATIC FREQUENCY INVERTER, ESPECIALLY FREQUENCY INVERTER FOR CONTROLLING AND / OR REGULATING THE PERFORMANCE SIZE OF AN ELECTRIC MOTOR
US4734045A
(en)
*
1987-03-27
1988-03-29
Masterite Industries, Inc.
High density connector
US5308920A
(en)
*
1992-07-31
1994-05-03
Itoh Research & Development Laboratory Co., Ltd.
Heat radiating device
DE19704226B4
(en)
*
1997-02-05
2004-09-30
Sew-Eurodrive Gmbh & Co. Kg
Klemmdeckelumrichter
US8137995B2
(en)
*
2008-12-11
2012-03-20
Stats Chippac, Ltd.
Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures
JP5581131B2
(en)
*
2010-06-30
2014-08-27
日立オートモティブシステムズ株式会社
Power module and power conversion device using the same
JP5520889B2
(en)
*
2011-06-24
2014-06-11
日立オートモティブシステムズ株式会社
Power semiconductor module and power converter using the same
KR20210132999A
(en)
*
2020-04-28
2021-11-05
엘지전자 주식회사
Power module assembly
Family Cites Families (7)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3066367A
(en)
*
1957-05-23
1962-12-04
Bishop & Babcock Corp
Panel mounting fastener
US3210745A
(en)
*
1962-08-31
1965-10-05
Burroughs Corp
Magnetic core memories
US3307087A
(en)
*
1963-01-03
1967-02-28
Machlett Lab Inc
Stacked solid state rectifier
US3418533A
(en)
*
1965-12-24
1968-12-24
Olivetti & Co Spa
Modular structure for electronic integrated circuits
US3403300A
(en)
*
1966-09-01
1968-09-24
Magnavox Co
Electronic module
US3800191A
(en)
*
1972-10-26
1974-03-26
Borg Warner
Expandible pressure mounted semiconductor assembly
US3798510A
(en)
*
1973-02-21
1974-03-19
Us Army
Temperature compensated zener diode for transient suppression
1974
1974-04-19
US
US462461A
patent/US3909678A/en
not_active
Expired – Lifetime
1974-12-12
DE
DE2458846A
patent/DE2458846C2/en
not_active
Expired
1975
1975-03-06
FR
FR7507776A
patent/FR2268433B1/fr
not_active
Expired
1975-03-07
GB
GB972075A
patent/GB1462748A/en
not_active
Expired
1975-03-17
JP
JP50031249A
patent/JPS5243063B2/ja
not_active
Expired
1975-03-18
IT
IT21378/75A
patent/IT1034378B/en
active
1975-03-27
CA
CA223,579A
patent/CA1023837A/en
not_active
Expired
Also Published As
Publication number
Publication date
JPS5243063B2
(en)
1977-10-28
CA1023837A
(en)
1978-01-03
FR2268433B1
(en)
1979-06-29
DE2458846C2
(en)
1986-12-18
DE2458846A1
(en)
1975-10-30
IT1034378B
(en)
1979-09-10
FR2268433A1
(en)
1975-11-14
JPS50137681A
(en)
1975-10-31
US3909678A
(en)
1975-09-30
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Legal Events
Date
Code
Title
Description
1977-06-22
PS
Patent sealed [section 19, patents act 1949]
1986-11-05
PCNP
Patent ceased through non-payment of renewal fee
