GB1466333A – Method of joining two bodies
– Google Patents
GB1466333A – Method of joining two bodies
– Google Patents
Method of joining two bodies
Info
Publication number
GB1466333A
GB1466333A
GB1041174A
GB1041174A
GB1466333A
GB 1466333 A
GB1466333 A
GB 1466333A
GB 1041174 A
GB1041174 A
GB 1041174A
GB 1041174 A
GB1041174 A
GB 1041174A
GB 1466333 A
GB1466333 A
GB 1466333A
Authority
GB
United Kingdom
Prior art keywords
adhesive
bodies
salt
oxide
films
Prior art date
1973-03-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1041174A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1973-03-08
Filing date
1974-03-08
Publication date
1977-03-09
1974-03-08
Application filed by Western Electric Co Inc
filed
Critical
Western Electric Co Inc
1977-03-09
Publication of GB1466333A
publication
Critical
patent/GB1466333A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
C—CHEMISTRY; METALLURGY
C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
C08J7/04—Coating
C08J7/06—Coating with compositions not containing macromolecular substances
C—CHEMISTRY; METALLURGY
C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
C—CHEMISTRY; METALLURGY
C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
C08J7/04—Coating
C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
C—CHEMISTRY; METALLURGY
C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/03—Conductive materials
H05K2201/0332—Structure of the conductor
H05K2201/0335—Layered conductors or foils
H05K2201/0355—Metal foils
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Abstract
1466333 Laminates WESTERN ELECTRIC CO Inc 8 March 1974 [8 March 1973] 10411/74 Heading B5N Two bodies are joined together by means of an adhesive layer by contacting the adhesive layer or a region of a surface of at least one of the bodies with a stable aqueous colloidal dispersion of an insoluble hydrous oxide formed by a hydrolysis reaction of a salt of an element selected from Be, Mg, Ti, Zr, V, Cr, Mo, W, Mn, Fe, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Hg, Al, In, Tl, Si, Ge, Sn, Pb, Bi, La, Ce, Th, U and mixtures thereof, the dispersion containing particles having a size from 10 to 10,000 and the formation of the dispersion comprising forming a dissolved salt of the element in an aqueous solvent and hydrolysing the salt, the pH value of the aqueous solvent preventing the initial formation of a precipitate or flocculate upon the addition of the salt, and bringing together the bodies with the adhesive layer therebetween so as to join them together. The insoluble hydrous oxide is an insoluble oxide, hydroxide, oxide-hydroxide or mixture of oxides and hydroxides. The colloidal dispersion may be applied to the body or adhesive by brushing, spraying or dipping. After the bodies have been brought into contact the adhesive bond may be strengthened, e.g. by cooling a hot melt adhesive, evaporating an organic cement, applying pressure to a pressure-sensitive adhesive or polymerizing in situ a thermosetting adhesive by heating or exposure to ultraviolet light. In the production of printed circuit boards the adherends may be a non-conductive organic polymer board and a conductive metal film. In the examples polyimide or polyethylene terephthalate films are bonded to aluminium plates using an epoxy adhesive, and polyimide, polyethylene terephthalate or hexafluoropropylene / tetrafluoroethylene copolymer films are bonded to synthetic rubber adhesive on a polyester backing. The films may be pretreated with aqueous NaOH.
GB1041174A
1973-03-08
1974-03-08
Method of joining two bodies
Expired
GB1466333A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US339459A
US3861978A
(en)
1973-03-08
1973-03-08
Method of joining two bodies after treatment with an inorganic colloid
Publications (1)
Publication Number
Publication Date
GB1466333A
true
GB1466333A
(en)
1977-03-09
Family
ID=23329084
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB1041174A
Expired
GB1466333A
(en)
1973-03-08
1974-03-08
Method of joining two bodies
Country Status (11)
Country
Link
US
(1)
US3861978A
(en)
JP
(1)
JPS5222787B2
(en)
BE
(1)
BE811990A
(en)
CA
(1)
CA991521A
(en)
CH
(1)
CH606373A5
(en)
DE
(1)
DE2410858C2
(en)
FR
(1)
FR2220705B1
(en)
GB
(1)
GB1466333A
(en)
IT
(1)
IT1011553B
(en)
NL
(1)
NL158214B
(en)
SE
(1)
SE409039B
(en)
Families Citing this family (12)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3968221A
(en)
*
1972-05-05
1976-07-06
Medi-Physics, Inc.
99M-Technetium labeled tin colloid radiopharmaceuticals
US3976274A
(en)
*
1975-05-27
1976-08-24
The United States Of America As Represented By The Secretary Of The Navy
Permanent attachment for suction cups
JPS5456564A
(en)
*
1977-10-13
1979-05-07
Kondo Giken Yuugen
Artificial hair
US4482418A
(en)
*
1983-08-17
1984-11-13
International Business Machines Corporation
Bonding method for producing very thin bond lines
DE267868T1
(en)
*
1986-11-12
1988-09-22
United Technologies Corp., Hartford, Conn., Us
PRE-TREATMENT METHOD OF AN AMORPHOUS HYDRATED METAL OXIDE PRIMER FOR ORGANIC ADHESIVE JOINTS.
US4888079A
(en)
*
1987-10-21
1989-12-19
United Technologies Corporation
Method for bonding joints with an organic adhesive using a water soluble amorphous hydrated metal oxide primer
US5742118A
(en)
*
1988-09-09
1998-04-21
Hitachi, Ltd.
Ultrafine particle film, process for producing the same, transparent plate and image display plate
US5189337A
(en)
*
1988-09-09
1993-02-23
Hitachi, Ltd.
Ultrafine particles for use in a cathode ray tube or an image display face plate
US4961971A
(en)
*
1988-12-19
1990-10-09
United Technologies Corporation
Method of making oxidatively stable water soluble amorphous hydrated metal oxide sized fibers
US5112418A
(en)
*
1989-12-13
1992-05-12
United Technologies Corporation
Method for bonding joints with an organic adhesive using a water soluble silane modified amorphous hydrated metal oxide primer
US6342434B1
(en)
1995-12-04
2002-01-29
Hitachi, Ltd.
Methods of processing semiconductor wafer, and producing IC card, and carrier
DE19609033A1
(en)
*
1996-03-08
1997-09-11
Beiersdorf Ag
Adhesive film
Family Cites Families (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB559075A
(en)
*
1942-04-09
1944-02-03
Meyer Hans
Improvements in or relating to the production of compound fabrics
US3361589A
(en)
*
1964-10-05
1968-01-02
Du Pont
Process for treating polyimide surface with basic compounds, and polyimide surface having thin layer of polyamide acid
US3657003A
(en)
*
1970-02-02
1972-04-18
Western Electric Co
Method of rendering a non-wettable surface wettable
US3767590A
(en)
*
1971-06-21
1973-10-23
Western Electric Co
Method of producing nondetergent aqueous wetting solutions
1973
1973-03-08
US
US339459A
patent/US3861978A/en
not_active
Expired – Lifetime
1973-10-17
CA
CA183,617A
patent/CA991521A/en
not_active
Expired
1974
1974-02-28
SE
SE7402685A
patent/SE409039B/en
not_active
IP Right Cessation
1974-03-06
NL
NL7403032.A
patent/NL158214B/en
not_active
IP Right Cessation
1974-03-07
BE
BE141742A
patent/BE811990A/en
not_active
IP Right Cessation
1974-03-07
IT
IT67648/74A
patent/IT1011553B/en
active
1974-03-07
DE
DE2410858A
patent/DE2410858C2/en
not_active
Expired
1974-03-08
CH
CH331274A
patent/CH606373A5/xx
not_active
IP Right Cessation
1974-03-08
FR
FR7408055A
patent/FR2220705B1/fr
not_active
Expired
1974-03-08
JP
JP49026456A
patent/JPS5222787B2/ja
not_active
Expired
1974-03-08
GB
GB1041174A
patent/GB1466333A/en
not_active
Expired
Also Published As
Publication number
Publication date
DE2410858C2
(en)
1984-05-10
FR2220705B1
(en)
1977-03-04
JPS508872A
(en)
1975-01-29
US3861978A
(en)
1975-01-21
NL7403032A
(en)
1974-09-10
CH606373A5
(en)
1978-10-31
IT1011553B
(en)
1977-02-10
SE409039B
(en)
1979-07-23
CA991521A
(en)
1976-06-22
DE2410858A1
(en)
1974-10-03
JPS5222787B2
(en)
1977-06-20
FR2220705A1
(en)
1974-10-04
BE811990A
(en)
1974-07-01
NL158214B
(en)
1978-10-16
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Legal Events
Date
Code
Title
Description
1977-07-20
PS
Patent sealed [section 19, patents act 1949]
1993-11-03
PCNP
Patent ceased through non-payment of renewal fee
Effective date:
19930308
