GB1541647A – Double plug glass packaged semiconductor device
– Google Patents
GB1541647A – Double plug glass packaged semiconductor device
– Google Patents
Double plug glass packaged semiconductor device
Info
Publication number
GB1541647A
GB1541647A
GB38607/76A
GB3860776A
GB1541647A
GB 1541647 A
GB1541647 A
GB 1541647A
GB 38607/76 A
GB38607/76 A
GB 38607/76A
GB 3860776 A
GB3860776 A
GB 3860776A
GB 1541647 A
GB1541647 A
GB 1541647A
Authority
GB
United Kingdom
Prior art keywords
semiconductor device
packaged semiconductor
double plug
plug glass
glass packaged
Prior art date
1975-09-25
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB38607/76A
Inventor
John Thomas Robinson
Richard A Edwards
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1975-09-25
Filing date
1976-09-17
Publication date
1979-03-07
1976-09-17
Application filed by Texas Instruments Inc
filed
Critical
Texas Instruments Inc
1979-03-07
Publication of GB1541647A
publication
Critical
patent/GB1541647A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L24/10—Bump connectors ; Manufacturing methods related thereto
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/02—Containers; Seals
H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
H01L23/492—Bases or plates or solder therefor
H01L23/4924—Bases or plates or solder therefor characterised by the materials
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L24/10—Bump connectors ; Manufacturing methods related thereto
H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
H01L29/40—Electrodes ; Multistep manufacturing processes therefor
H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
H01L29/45—Ohmic electrodes
H01L29/456—Ohmic electrodes on silicon
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/02—Bonding areas; Manufacturing methods related thereto
H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/02—Bonding areas; Manufacturing methods related thereto
H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
H01L2224/04026—Bonding areas specifically adapted for layer connectors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
H01L2224/13001—Core members of the bump connector
H01L2224/13099—Material
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
H01L2224/13001—Core members of the bump connector
H01L2224/13099—Material
H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
H01L2224/13139—Silver [Ag] as principal constituent
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01006—Carbon [C]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01015—Phosphorus [P]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01019—Potassium [K]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01022—Titanium [Ti]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01023—Vanadium [V]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01029—Copper [Cu]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01032—Germanium [Ge]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01033—Arsenic [As]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01046—Palladium [Pd]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01047—Silver [Ag]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01079—Gold [Au]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01082—Lead [Pb]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/013—Alloys
H01L2924/0132—Binary Alloys
H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/013—Alloys
H01L2924/014—Solder alloys
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/102—Material of the semiconductor or solid state bodies
H01L2924/1025—Semiconducting materials
H01L2924/10251—Elemental semiconductors, i.e. Group IV
H01L2924/10253—Silicon [Si]
Abstract
A coaxial-lead, double-plug, glass-sealed semiconductor diode is provided with gold-germanium alloy contacts metallurgically bonded to Dumet alloy plugs.
GB38607/76A
1975-09-25
1976-09-17
Double plug glass packaged semiconductor device
Expired
GB1541647A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US05/616,718
US4042951A
(en)
1975-09-25
1975-09-25
Gold-germanium alloy contacts for a semiconductor device
Publications (1)
Publication Number
Publication Date
GB1541647A
true
GB1541647A
(en)
1979-03-07
Family
ID=24470683
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB38607/76A
Expired
GB1541647A
(en)
1975-09-25
1976-09-17
Double plug glass packaged semiconductor device
Country Status (4)
Country
Link
US
(1)
US4042951A
(en)
JP
(1)
JPS5240971A
(en)
DE
(1)
DE2643147A1
(en)
GB
(1)
GB1541647A
(en)
Families Citing this family (17)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
DE3122387A1
(en)
*
1981-06-05
1982-12-23
Deutsche Itt Industries Gmbh, 7800 Freiburg
Glass-encapsulated semiconductor diode and method of manufacturing it
US4878099A
(en)
*
1982-12-08
1989-10-31
International Rectifier Corporation
Metallizing system for semiconductor wafers
SE8306663L
(en)
*
1982-12-08
1984-06-09
Int Rectifier Corp
PROCEDURE FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
US4965173A
(en)
*
1982-12-08
1990-10-23
International Rectifier Corporation
Metallizing process and structure for semiconductor devices
JPS59213145A
(en)
*
1983-05-18
1984-12-03
Toshiba Corp
Semiconductor device and manufacture thereof
DE3402970A1
(en)
*
1984-01-28
1985-08-01
Philips Patentverwaltung Gmbh, 2000 Hamburg
CONTACTING SYSTEM FOR 2-POLE ELECTRONIC COMPONENTS, PARTICULARLY SEMICONDUCTOR COMPONENTS
US4663820A
(en)
*
1984-06-11
1987-05-12
International Rectifier Corporation
Metallizing process for semiconductor devices
NL8600021A
(en)
*
1986-01-08
1987-08-03
Philips Nv
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE APPLYING METALIZATION TO A SEMICONDUCTOR BODY
US4769882A
(en)
*
1986-10-22
1988-09-13
The Singer Company
Method for making piezoelectric sensing elements with gold-germanium bonding layers
US5160793A
(en)
*
1991-06-07
1992-11-03
Eastman Kodak Company
Shallow ohmic contacts to n-Alx Ga1-x As
US5248902A
(en)
*
1991-08-30
1993-09-28
General Instrument Corporation
Surface mounting diode
JP2579970Y2
(en)
*
1992-06-24
1998-09-03
株式会社小松製作所
Semiconductor device
US5851852A
(en)
*
1996-02-13
1998-12-22
Northrop Grumman Corporation
Die attached process for SiC
US6111316A
(en)
*
1997-08-29
2000-08-29
Motorola, Inc.
Electronic component encapsulated in a glass tube
JP4724355B2
(en)
*
2003-03-31
2011-07-13
ルネサスエレクトロニクス株式会社
Semiconductor device
TWI396771B
(en)
*
2009-08-25
2013-05-21
羅門哈斯電子材料有限公司
Enhanced method of forming nickel silicides
IT1402530B1
(en)
2010-10-25
2013-09-13
St Microelectronics Srl
INTEGRATED CIRCUITS WITH RE-METALLIZATION AND RELATED PRODUCTION METHOD.
Family Cites Families (13)
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Publication number
Priority date
Publication date
Assignee
Title
AT197436B
(en)
*
1955-06-13
1958-04-25
Philips Nv
Method for applying a contact to silicon
US3025439A
(en)
*
1960-09-22
1962-03-13
Texas Instruments Inc
Mounting for silicon semiconductor device
US3361592A
(en)
*
1964-03-16
1968-01-02
Hughes Aircraft Co
Semiconductor device manufacture
DE1283970B
(en)
*
1966-03-19
1968-11-28
Siemens Ag
Metallic contact on a semiconductor component
US3520720A
(en)
*
1966-12-13
1970-07-14
Hughes Aircraft Co
Dies and diode and method
US3458778A
(en)
*
1967-05-29
1969-07-29
Microwave Ass
Silicon semiconductor with metal-silicide heterojunction
US3409974A
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*
1967-07-07
1968-11-12
Alloys Unltd Inc
Process of making tungsten-based composite materials
NL6710184A
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*
1967-07-22
1969-01-24
US3508124A
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*
1968-03-11
1970-04-21
Sylvania Electric Prod
Semiconductor device and method of manufacture
US3716907A
(en)
*
1970-11-20
1973-02-20
Harris Intertype Corp
Method of fabrication of semiconductor device package
JPS5011779A
(en)
*
1973-06-04
1975-02-06
US3893229A
(en)
*
1973-10-29
1975-07-08
Gen Electric
Mounting for light-emitting diode pellet and method for the fabrication thereof
US3909929A
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*
1973-12-26
1975-10-07
Gen Electric
Method of making contacts to semiconductor light conversion elements
1975
1975-09-25
US
US05/616,718
patent/US4042951A/en
not_active
Expired – Lifetime
1976
1976-09-17
GB
GB38607/76A
patent/GB1541647A/en
not_active
Expired
1976-09-24
DE
DE19762643147
patent/DE2643147A1/en
not_active
Ceased
1976-09-24
JP
JP51114579A
patent/JPS5240971A/en
active
Pending
Also Published As
Publication number
Publication date
DE2643147A1
(en)
1977-04-07
US4042951A
(en)
1977-08-16
JPS5240971A
(en)
1977-03-30
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Legal Events
Date
Code
Title
Description
1979-05-23
PS
Patent sealed [section 19, patents act 1949]
1990-05-16
PCNP
Patent ceased through non-payment of renewal fee
