GB1555365A – Electronic watch module and its method of fabrication
– Google Patents
GB1555365A – Electronic watch module and its method of fabrication
– Google Patents
Electronic watch module and its method of fabrication
Info
Publication number
GB1555365A
GB1555365A
GB245979A
GB245979A
GB1555365A
GB 1555365 A
GB1555365 A
GB 1555365A
GB 245979 A
GB245979 A
GB 245979A
GB 245979 A
GB245979 A
GB 245979A
GB 1555365 A
GB1555365 A
GB 1555365A
Authority
GB
United Kingdom
Prior art keywords
fabrication
electronic watch
watch module
module
electronic
Prior art date
1975-05-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB245979A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1975-05-29
Filing date
1976-05-17
Publication date
1979-11-07
1975-05-29
Priority claimed from US05/581,604
external-priority
patent/US3986334A/en
1975-05-29
Priority claimed from US05/581,603
external-priority
patent/US3986335A/en
1976-05-17
Application filed by Texas Instruments Inc
filed
Critical
Texas Instruments Inc
1979-11-07
Publication of GB1555365A
publication
Critical
patent/GB1555365A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
G—PHYSICS
G04—HOROLOGY
G04G—ELECTRONIC TIME-PIECES
G04G17/00—Structural details; Housings
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
H01L23/495—Lead-frames or other flat leads
H01L23/49541—Geometry of the lead-frame
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
H01L2224/45001—Core members of the connector
H01L2224/45099—Material
H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
H01L2224/45144—Gold (Au) as principal constituent
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
H01L2224/4805—Shape
H01L2224/4809—Loop shape
H01L2224/48091—Arched
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
H01L2224/481—Disposition
H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
H01L2224/491—Disposition
H01L2224/4912—Layout
H01L2224/49171—Fan-out arrangements
GB245979A
1975-05-29
1976-05-17
Electronic watch module and its method of fabrication
Expired
GB1555365A
(en)
Applications Claiming Priority (3)
Application Number
Priority Date
Filing Date
Title
US58162075A
1975-05-29
1975-05-29
US05/581,604
US3986334A
(en)
1975-05-29
1975-05-29
Electronic watch and its method of fabrication
US05/581,603
US3986335A
(en)
1975-05-29
1975-05-29
Electronic watch module and its method of fabrication
Publications (1)
Publication Number
Publication Date
GB1555365A
true
GB1555365A
(en)
1979-11-07
Family
ID=27416361
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB245979A
Expired
GB1555365A
(en)
1975-05-29
1976-05-17
Electronic watch module and its method of fabrication
Country Status (1)
Country
Link
GB
(1)
GB1555365A
(en)
1976
1976-05-17
GB
GB245979A
patent/GB1555365A/en
not_active
Expired
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Legal Events
Date
Code
Title
Description
1980-01-23
PS
Patent sealed
1990-01-17
PCNP
Patent ceased through non-payment of renewal fee
