GB1565748A – Printed circuit boards
– Google Patents
GB1565748A – Printed circuit boards
– Google Patents
Printed circuit boards
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Publication number
GB1565748A
GB1565748A
GB30246/77A
GB3024677A
GB1565748A
GB 1565748 A
GB1565748 A
GB 1565748A
GB 30246/77 A
GB30246/77 A
GB 30246/77A
GB 3024677 A
GB3024677 A
GB 3024677A
GB 1565748 A
GB1565748 A
GB 1565748A
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit board
wireless component
electroconductive
figures
Prior art date
1976-07-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB30246/77A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1976-07-20
Filing date
1977-07-19
Publication date
1980-04-23
1976-07-20
Priority claimed from JP9715276U
external-priority
patent/JPS5315049U/ja
1976-07-20
Priority claimed from JP9715176U
external-priority
patent/JPS5315048U/ja
1976-07-20
Priority claimed from JP1976097150U
external-priority
patent/JPS5926614Y2/en
1977-07-19
Application filed by Matsushita Electric Industrial Co Ltd
filed
Critical
Matsushita Electric Industrial Co Ltd
1980-04-23
Publication of GB1565748A
publication
Critical
patent/GB1565748A/en
Status
Expired
legal-status
Critical
Current
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Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/02—Details
H05K1/11—Printed elements for providing electric connections to or between printed circuits
H05K1/111—Pads for surface mounting, e.g. lay-out
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K3/341—Surface mounted components
H05K3/3431—Leadless components
H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/09—Shape and layout
H05K2201/09209—Shape and layout details of conductors
H05K2201/09372—Pads and lands
H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/09—Shape and layout
H05K2201/09209—Shape and layout details of conductors
H05K2201/09372—Pads and lands
H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/09—Shape and layout
H05K2201/09209—Shape and layout details of conductors
H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 – H05K2201/095
H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/09—Shape and layout
H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 – H05K2201/09809
H05K2201/099—Coating over pads, e.g. solder resist partly over pads
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
H05K2201/10621—Components characterised by their electrical contacts
H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/04—Soldering or other types of metallurgic bonding
H05K2203/042—Remote solder depot on the PCB, the solder flowing to the connections from this depot
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
PATENT SPECIFICATION
( 11) 1 565 748 ( 21) Application No 30246/77 ( 22) Filed 19 Jul1977 ( 19) A, ( 31) Convention Application No’s 51/097150 U ( 32) Filed 20 Jul 1976 in 51/097152 U O 511097151 U I i ( 33) Japan (JP) / i ( 44) Complete Specification Published 23 Apr 1980 ( 51) INT CL 3 HOSK 1/00 ( 52) Index at Acceptance H 1 R AC ( 72) Inventors: HITOSHI SAWAIRI FUMINORI HIROSE KAORU KONISHIKAWA ( 54) IMPROVEMENTS IN OR RELATING TO PRINTED CIRCUIT BOARDS ( 71) We, MATSUSHITA ELECTRIC INDUSTRIAL CO LTD, a Japanese Body Corporate, of 1006, Oaza Kadoma, Kadoma-shi, Osaka-fu, Japan, do hereby declare the invention, for which we pray that a patent may be granted to us, and the method by which it is to be performed, to be particularly described in and by the follow-
ing statement:-
The present invention generally relates to a printed circuit board and, more particularly, to a printed circuit board, made of an electrically insulating board prepared from a paper-based laminated sheet of synthetic resin such as phenol or epoxy resin, having a plurality of electric and/or electronic wireIess components mounted thereon in electrically connected relation to electroconductive strips on at least one surface of the printed circuit board.
It is to be noted that in general the components do not require leads and the term “electric and/or electronic wireless component” or, simply, “wireless component” hereinafter referred to is, as shown in Figure 1 of the accompanying drawings, intended to mean an electric component, such as resistor or capacitor, of a type which has no lead wires extending outwardly therefrom for external electric connection, but which is constituted by a substantially cubic body 11 having its opposed areas applied with respective films or foils of electroconductive material which serve as terminal electrodes 12 More specifically, in the case of the wireless component being a resistor, the wireless component is constituted by a substantially cubic body of ceramic material having its surface applied with a film of resistance material and having its opposed area applied with separate terminal electrodes and, in the case of the wireless component being a capacitor, the wireless component is constituted by a substantially cubic body of dielectric material, such as barium titanate, and having its opposed ends formed with terminal electrodes which are made of films or foils of electroconductive material such as silver or palladium.
Mounting of the wireless component on the printed circuit board with its terminal electrodes electrically connected to respective electroconductive strips which are formed on at least one surface of the printed circuit board has heretofore been carried out in the manner which will now be described with particular reference to Figures 2 and 3 As best shown in Figure 2, for the purpose of electric connection of the electroconductive strips 13 on the printed circuit board 14 with the respective terminal electrodes 12 of the wireless component 10, each of the electroconductive strips 13 is provided with a broadened contact portion 13 a of a size two to three times larger than the size of the associated terminal electrode of the wireless component 10 The wireless component 10 is placed on the printed circuit board 14 with its terminal electrodes 12 held in contact with the respective broadened contact portions 13 a of the electroconductive strips 13, each of the areas of contact of the terminal electrodes 12 to the associated broadened contact portions 13 a being soldered to provide, as shown in Figure 3, a solder bead 15 through which the corresponding terminal electrode 12 is electrically and firmly connected to the associated portion 13 a of the electroconductive If) If 1 565 748 strips 13 on the printed circuit board 14.
According to the above described conventional method of mounting of the wireless component on the printed circuit board, where the printed circuit board 14 is made of an electrically insulating board prepared from a paper-based laminated sheet of synthetic resin such as phenol or epoxy resin which is flexible, the printed circuit board tends to deform upon receipt of an external load applied thereto, with bending stresses being consequently developed in the printed circuit board 14 In view of this, when the printed circuit board 14 is so deformed, the wireless component 10 so mounted on the printed circuit board 14 with its terminal electrodes 12 soldered to the electroconductive strips 13 through the solder beads 15 is susceptible to cracking, or other breakage, upon application of the external load.
Accordingly, the present invention has been made in view to substantially eliminating the above described disadvantages and inconvenience inherent in the conventional mounting of the wireless component on the printed circuit board.
According to the present invention there is provided a printed circuit board which comprises an electrically insulating substrate made of synthetic resin and having at least one pair of spaced electroconductive strips on at least one surface of the insulating substrate, each of said electroconductive strips having a broadened portion terminating in a contact portion and a component having at least one pair of spaced terminal electrodes soldered respectively to the contact portions of the associated electroconductive strips, at least one of said contact portions having adjoining one of the terminals an effective area equal to or smaller than the effective area of the respective terminal electrode.
The term ‘effective area’ is used in respect of the immediately adjacent areas of the electrode terminal and the contact portion to which the solder is capable of adhering.
These and other objects and features of the present invention will become apparent from the following description taken in conjunction with preferred embodiments thereof with reference to the accompanying drawings, in which:
Figure 1 is a schematic perspective view of a wireless component; Figure 2 is a schematic top plan view of a printed circuit board on which the wireless component is mounted according to the prior art mounting method;
Figure 3 is a cross sectional view of the printed circuit board shown in Figure 2; Figures 4 and 5 are views respectively similar to Figures 2 and 3 showing a first preferred embodiment of the present invention; Figure 6 is a graph illustrating the result of test in which the printed circuit board shown in Figures 4 and 5 was compared with the prior art printed circuit board;
Figures 7 and 8 are views respectively similar to Figures 2 and 3, showing a second preferred embodiment of the present invention; Figures 9 and 10 are views respectively similar to Figures 2 and 3, showing a third preferred embodiment of the present invention; Figure 11 is a perspective view of a portion of the printed circuit board shown in Figure 9, said portion being shown on an enlarged scale; Figure 12 is a graph illustrating the result of test in which the printed circuit board shown in Figures 9 to 11 was compared with the prior art printed circuit board;
Figures 13 and 14 are views respectively similar to Figures 2 and 3, showing a fourth preferred embodiment of the present invention; Figure 15 is a graph illustrating the result of test in which the printed circuit board shown in Figures 13 and 14 was compared with the prior art printed circuit board;
Figures 16 to 19 are diagrams showing various types of electroconductive strips which may be employed in the present invention; and Figures 20 and 21 are views respectively similar to Figures 2 and 3, showing a further preferred embodiment of the present invention.
Before the description of the present invention proceeds, it is to be noted that like parts are designated by like reference numerals throughout the accompanying drawings.
Referring to Figures 4 and 5, a printed circuit board 14, which is constituted by an electrically insulating board prepared from a paper-based laminated sheet of synthetic resin such as phenol or epoxy resin, is shown to have electroconductive strips 13 formed on one surface of said printed circuit board 14 A wireless component 10 is mounted on the printed circuit board 14 in a manner as will be described later.
The wireless component 10 is, so far illustrated, constituted by a substantially rectangular cubic body 11 of dielectric material having its opposed ends formed with respective terminal electrodes 12 which are so formed by applying, or otherwise depositing, films of an electroconductive material such as silver or palladium This wireless component 10 is placed on the printed circuit board 14 with the terminal electrodes 12 held in electric contact with respective broadened contact portions 13 b of the electroconductive strips 13, each of the areas of contact of the terminal electrodes 12 to the 1 565 748 broadened contact portions 13 b of the respective electroconductive strips 13 being soldered to provide a solder bead 15 Each of the broadened contact portions 13 b in the instance as shown in Figures 4 and 5 has a width and a surface area substantially equal to those of any one of the terminal electrodes 12 of the wireless component 10.
With the printed circuit board so constructed as hereinabove described, the soldering strength of the terminal electrodes 12 of the wireless component 10 relative to the associated broadened contact portions 13 b of the electroconductive strips 13 is rendered to be lower than the allowance of strength of the wireless component 10 relative to the amount of the external load.
Accordingly, whereas the wireless component soldered on the printed circuit board according to the prior art method tends to break when the printed circuit board is deformed about 1 mm as shown by the curve A in the graph of Figure 6, there is no possibility of breakage of the wireless component soldered on the printed circuit board according to the present invention, as shown by the curve B in the graph of Figure 6, even if the printed circuit board is deformed about 5 mm by the application of the external load thereto and, moreover, the possibility of breakage of the wireless component can, according to the present invention, be minimized by the utilization of the elasticity of soldered portions thereof.
The fact that the size of each of the broadened contact portions 13 b of the respective electroconductive strips 13, to which the terminal electrodes of the wireless component are respectively soldered, is made to be substantially equal to the size of the associated terminal electrode 12 of the wireless component with the solder strength reduced according to the present invention means that the amount of solder to be subsequently deposited can be reduced and the resultant solder bead is so capable of elongating prior to the wireless component being broken that the possibility of breakage of the wireless component, which may occur upon deformation of the printed circuit board, can be minimized.
In order to obtain the characteristics shown in Figure 6, variation of the capacitance of the wireless component, which was a capacitor constituted by a rectangular cubic body of dielectric material having its opposed ends formed with respective terminal electrodes which were not made of silver or palladium, was tested while the printed circuit board, wherein the electrically insulating board was made of a paperbased laminated sheet of epoxy resin and on which the above described capacitor was soldered, was supported at two points spaced 90 mm apart and the external load was applied thereto.
Although in the foregoing embodiment shown in Figures 4 and 5 each of the broadened contact portions 13 b of the electroconductive strips 13 on the printed circuit 70 board 14 has been described as having a size substantially equal to the size of any one of the terminal electrodes 12 of the wireless component 10, the former may be smaller than the latter should a satisfactory electric 75 connection be established between the terminal electrodes of the wireless components and the respective contact portions of the electroconductive strips on the printed circuit board In this case, a mechanical 80 connection of the wireless component 10 to the printed circuit board 14 can or may be effected by the use of a suitable bonding agent, preferably, a bonding agent of a type having a thermosetting resin as its principal 85 constituent.
Furthermore, in the foregoing embodiment of Figures 4 and 5, it has been described that each of the contact portions 13 b of the electroconductive strips 13 has a 90 size substantially equal to or smaller than that of any one of the terminal electrodes 12 of the wireless component However, even though each of the contact portions of the electroconductive strips 13 has a size larger 95 than that of any one of the terminal electrodes of the wireless component such as shown in Figures 2 and 3, the object of the present invention can equally be achieved.
This will now be described with reference to 100 Figures 7 and 8.
Referring now to Figures 7 and 8, a solder resist layer 16 is employed for each broadened contact portion 13 a of the electroconductive strips 13 The resist layer 16 105 has an opening 16 a defined therein of a size substantially equal to or smaller than the size of the terminal electrode 12 and is applied to the printed circuit board 14 while an area of the broadened contact portion 110 13 a, to which the corresponding terminal electrode 12 is to be soldered, is exposed to the outside through the opening 16 a in the resist layer 16 Therefore, it is clear that the solder bead 15, which electrically connects 115 the terminal electrode 12 to the broadened contact portion 13 a of the electroconductive strip 13, is deposited on the area of the broadened contact portion 13 a which is left open by the opening 16 a of the resist layer 16 120 for receiving such solder bead 16.
In the embodiment shown in Figures 9 to 11, there is illustrated the electroconductive strips 13 each having a constricted area 13 c of a width smaller than 125 that of the remaining portion of the electroconductive strip 13, which constricted area 13 c is positioned between the contact portion 13 b and a jumper portion 13 d Each of the constricted areas 13 c of the electrocon 130 1 565 748 ductive strips 13 is, as best shown in Figures 9 and 11, covered by a solder resist layer 16 ‘.
With the arrangement shown in Figures 9 S to 11, the disruptive strength of each of the constricted areas 13 c of the respective electroconductive strips 13 on the printed circuit board 14 can be rendered to be lower than the allowance of strength of the wireless component 10, soldered on the printed circuit board 14, relative to the amount of the external load.
Accordingly, whereas the wireless component soldered on the printed circuit board according to the prior art method tends to break when the printed circuit board is deformed about 1 mm as shown by the curve Aa in the graph of Figure 12, there is no possibility of breakage of the wireless component soldered on the printed circuit board according to the present invention, as shown by the curve Ba in the graph of Figure 12, even if the printed circuit board is deformed about 3 mm by the application of the external load thereto and, moreover, the possibility of breakage of the wireless component can, according to the present invention, be minimized by the utilization of the contricted areas 13 c of the respective electroconductive layers In other words, the provision of the constricted areas 13 c each between the contact portion 13 a and the jumper portion 13 d of the electroconductive strip 13 is advantageous in that the constricted area 13 c is, when the printed circuit board 14 is deformed, elongated a distance shown by At in Figure 11, thereby minimizing the possibility of breakage of the wireless component.
In order to obtain the characteristics shown in Figure 12, variation of the capacitance of the wireless component, which was a capacitor constituted by a rectangular cubic body of dielectric material having its opposed ends formed with respective terminal electrodes which were made of silver and palladium, was tested while the printed circuit board, wherein the electrically insulating board was made of a paper-based laminated sheet of epoxy resin and on which the above described capacitor was soldered at a central portion of the printed circuit board, was supported at two points spaced mm apart and the external load was applied thereto.
In the graph of Figure 12, the capacitance variation shown by the curve Aa was exhibited by the wireless component, that is, the capacitor, soldered on the printed circuit board according to the prior art wherein the width and the thickness of each of the electroconductive strips other than the broadened contact portion are 1,000 lrm and lim, respectively The capacitance variation shown by the curve Ba was exhibited by the wireless component soldered on the printed circuit board wherein the width and the thickness of each of the constricted areas of the respective electroconductive layers are 200 gm and 30 gtm, respectively The capacitance variation shown by the curve Ca was exhibited by the wireless component soldered on the printed circuit board wherein the width and the thickness of each of the constricted areas of the respective electroconductive layers are 700 ltm and 30 ltm, respectively The capacitance variation shown by the curve Da was exhibited by the wireless component soldered on the printed circuit board wherein the width of each of the electroconductive strips are 500 gim.
As can be understood from the graph of Figure 12, if the cross-sectional area of each of the constricted areas 13 c of the respective electroconductive layers 13 is not more than 0.02 mm 2, a satisfactory result can be appreciated In this test, the wireless components employed were dimensioned 1 5-2 mm X 3 5-4 mm X 05-1 mm.
It is to be noted that, if any one of the constricted areas 13 c of the electroconductive strips 13 is positioned far apart from the adjacent contact portion 13 b, no advantage will be appreciated Therefore, any one of the constricted areas 13 c is preferably positioned a predetermined distance, for example, 3 to 4 mm, apart from the adjacent contact portion 13 b, the length thereof being preferably within the range of 1 to 2 mm so that the elongation of the printed circuit board can be absorbed.
In the embodiment shown in Figures 9 to 11, the wireless component 10 is mechanically connected to the printed circuit board 14 by means of a deposit 17 of bonding agent positioned between the contact portions 13 b However, this may not be always necessary.
In the embodiment shown in Figures 13 and 14, each of the electroconductive strips 13 is shown to have an enlarged area 13 f defined at a substantially intermediate portion thereof, the contact portion 13 e being smaller in size than the size of the terminal electrode 12 of the wireless component 10.
The enlarged areas 13 f of the respective electroconductive layers 13 are of a substantially circular shape and serve as support bases for the support of major portions of the associated beads 15 which are subsequently deposited upon soldering of the terminal electrodes 12 to the round portions 13 e of the electroconductive strips 13.
In the arrangement shown in Figure 13, when the soldering is effected to connect the terminal electrodes 12 of the wireless component 10 to the contact portions 13 e of the electroconductive strips 13, each of solder deposits, which are ultimately formed into the solder beads 15 shown in Figure 14, is, 1 565 748 while in a molten state, attracted towards the adjacent enlarged area 13 f by the effect of its own surface tension so that a major portion 15 a of the solder bead 15 is formed on the enlarged area 13 f while the remaining portion 15 b of the same solder bead 15, which is integral with the major portion 15 a, but is smaller in size than the size of the major portion 15 a, is formed on the round portion 13 e Because of this, the solder strength of the terminal electrodes 12 of the wireless component 10 soldered to the respective contact portions 13 e can be rendered to be lower than the allowance of strength of the wireless component 10 relative to the amount of the external load applied thereto.
Accordingly, whereas the wireless component soldered on the printed circuit board according to the prior art method tends to break when the printed circuit board is deformed about 1 mm as shown by the curve Ab in the graph of Figure 15, there is no possibility of breakage of the wireless component soldered on the printed circuit board according to the present invention as shown by the curve Bb in the graph of Figure 15, even if the printed circuit board is deformed and, moreover, the possibility of breakage of the wireless component can, according to the present invention, be minimized by the utilization of the elasticity of the soldered portions thereof In other other words, by effecting the soldering in such a manner that the strength of the soldered portions between the terminal electrodes 12 and the elongated contact portions 13 e can be lower than the allowance of strength of the wireless component 10, stresses developed in the printed circuit board incident to deformation of the latter can be relieved by the elastic elongation of the soldered Portions prior to the wireless component being broken, thereby minimizing the possibility of breakage of the wireless component Furthermore, if the soldering is effected in the manner described above, the wireless component 10 can retain its strength by the time the printed circuit board 14 is broken, for example, as deformed about 9 mm Therefore, it is clear that the printed circuit board with the wireless component thereon according to the present invention can advantageously withstand any external load which may be applied thereto during installation thereof in a cabinet, insertion thereof into a storage container or test in which it is applied by a loading pin.
In order to obtain the characteristics shown in Figure 15, variation of the capacitance of the wireless component, which was a capacitor constituted by a square cubic body of dielectric material having its opposed ends formed with terminal electrodes which were made of silver and palladium, was tested while the printed circuit board, wherein the electrically insulating board was made of a paper-based laminated sheet of epoxy resin and on which the above described capacitor was soldered at a substantially central portion thereof, was supported at two points spaced 90 mm.
apart and the external load was applied thereto.
In the embodiment shown in Figures 14 and 15, it has been described that each of the enlarged areas 13 f is of a substantially circular shape However, each of the enlarged areas 13 f may be of a substantially elliptic shape as shown in Figure 16 or of a substantially square shape as shown in Figure 17 Alternatively, each of the electroconductive strips 13 may be so designed that the contact portion 13 e and the enlarged area 13 f form a substantially teardrop shape as shown in Figure 18 or a triangular shape as shown in Figure 19.
In the embodiment shown in Figures 20 and 21, instead of the employment of the solder resist layers 16 each having the opening 16 a of substantially semi-circular shape as shown in Figure 7, there is shown solder resist layers 16 ” each having a substantially V-shaped cutout 16 ‘a The solder resist layers 16 ” are respectively applied or placed on the broadened contact portions 13 a of the electroconductive layers 13 in such a manner than an acutely angled portion of each of the V-shaped cutouts 16 “a, which corresponds in position to the bottom of the shape of a figure “V”, is positioned adjacent the associated terminal electrode 12 of the wireless component 10.
It is clear that, when solder is deposited, the resultant beads 15 are formed in a manner as shown in Figure 21 and in a manner substantially similar to that in the embodiment of Figures 13 and 14 The printed circuit board with the wireless component thereon as shown in Figures 20 and 21 can exhibit its characteristic similar to that shown in Figures 13 and 14.
Claims (6)
WHAT WE CLAIM IS: 1 A printed circuit board which comprises an electrically insulating substrate made of synthetic resin and having at least one pair of spaced electro-conductive strips on at least one surface of the insulating substrate, each of said electroconductive strips having a broadened portion terminating in a contact portion and a component having at least one pair of spaced terminal electrodes soldered respectively to the contact portions of the associated electroconductive strips, at least one of said contact portions having adjoining one of the terminals an effective area equal to or smaller than the effective area of the respective terminal electrode.
1 565 748
2 A printed circuit board as claimed in claim 1, wherein a solder resist layer disposed on the contact portion, defines the effective area adjoining the terminal electrodes.
3 A printed circuit board as claimed in claim 1, wherein each of said electroconductive strips has a constricted portion adjacent the associated contact portion remote from the component.
4 A printed circuit board as claimed in claim 1, wherein the broadened portion of the electroconductive strips supports a major portion of the respective solder bead.
5 A printed circuit board substantially as hereinbefore described with reference to and as illustrated in Figures 4 to 21 of the accompanying drawings.
6 A method of mounting a component on a printed circuit board substantially as hereinbefore described with reference to and as illustrated in Figures 4 to 21 of the accompanying drawings.
MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD, Per: BOULT WADE & TENNANT, 34 Cursitor Street, London EC 4 A 1 PQ.
Chartered Patent Agents.
Printed for Her Majesty’s Stationery Office, by Croydon Printing Company Limited, Croydon, Surrey, 1980.
Published by The Patent Office, 25 Southampton Buildings, London, WC 2 A l AY, from which copies may be obtained.
GB30246/77A
1976-07-20
1977-07-19
Printed circuit boards
Expired
GB1565748A
(en)
Applications Claiming Priority (3)
Application Number
Priority Date
Filing Date
Title
JP9715276U
JPS5315049U
(en)
1976-07-20
1976-07-20
JP9715176U
JPS5315048U
(en)
1976-07-20
1976-07-20
JP1976097150U
JPS5926614Y2
(en)
1976-07-20
1976-07-20
printed wiring board
Publications (1)
Publication Number
Publication Date
GB1565748A
true
GB1565748A
(en)
1980-04-23
Family
ID=27308335
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB30246/77A
Expired
GB1565748A
(en)
1976-07-20
1977-07-19
Printed circuit boards
Country Status (3)
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Link
US
(1)
US4164778A
(en)
DE
(1)
DE2732529C2
(en)
GB
(1)
GB1565748A
(en)
Cited By (3)
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Publication date
Assignee
Title
DE3138987A1
(en)
*
1981-09-30
1983-04-14
Siemens AG, 1000 Berlin und 8000 München
DEVICE FOR PREVENTING DAMAGE TO MODULES OR Printed circuit boards on a printed circuit board
US4654750A
(en)
*
1984-05-24
1987-03-31
Canon Kabushiki Kaisha
Functional substrate and electronic circuit substrate using the same
EP0996322A2
(en)
*
1998-10-19
2000-04-26
Alps Electric Co., Ltd.
Electronic circuit unit useful for portable telephones or the like, and a method of manufacturing the same
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* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
JPS5726379Y2
(en)
*
1978-09-21
1982-06-08
US4573105A
(en)
*
1983-02-16
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Electronic circuit unit useful for portable telephone, etc., and a method of manufacturing the same
Also Published As
Publication number
Publication date
US4164778A
(en)
1979-08-14
DE2732529A1
(en)
1978-01-26
DE2732529C2
(en)
1984-10-25
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Legal Events
Date
Code
Title
Description
1980-07-09
PS
Patent sealed [section 19, patents act 1949]
1993-03-17
PCNP
Patent ceased through non-payment of renewal fee
Effective date:
19920719
