GB1586265A – Solder bonding of surfaces
– Google Patents
GB1586265A – Solder bonding of surfaces
– Google Patents
Solder bonding of surfaces
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Publication number
GB1586265A
GB1586265A
GB37515/77A
GB3751577A
GB1586265A
GB 1586265 A
GB1586265 A
GB 1586265A
GB 37515/77 A
GB37515/77 A
GB 37515/77A
GB 3751577 A
GB3751577 A
GB 3751577A
GB 1586265 A
GB1586265 A
GB 1586265A
Authority
GB
United Kingdom
Prior art keywords
solder
pressure
metallic
tinned
dielectric
Prior art date
1976-09-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB37515/77A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Standard Electric Corp
Original Assignee
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1976-09-22
Filing date
1977-09-08
Publication date
1981-03-18
1977-09-08
Application filed by International Standard Electric Corp
filed
Critical
International Standard Electric Corp
1981-03-18
Publication of GB1586265A
publication
Critical
patent/GB1586265A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
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Classifications
B—PERFORMING OPERATIONS; TRANSPORTING
B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
B23K1/00—Soldering, e.g. brazing, or unsoldering
B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
B23K1/0016—Brazing of electronic components
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K3/341—Surface mounted components
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/02—Details
H05K1/03—Use of materials for the substrate
H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/09—Shape and layout
H05K2201/09009—Substrate related
H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
H05K2203/1178—Means for venting or for letting gases escape
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K3/3457—Solder materials or compositions; Methods of application thereof
H05K3/3473—Plating of solder
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
PATENT SPECIFICATION
e I 1 ( 21) Application No 37515/77 ( 22) Filed 8 Sept 1977 ( 19) ( 31) Convention Application No 725204 ( 32) Filed 22 Sept 1976 in ^= ( 33) United States of America (US)
0: ( 44) Complete Specification published 18 March 1981
1 j”: ( 51) INT CL B 23 K 1/20 O ( 52) Index at acceptance B 3 R 24 26 A ( 54) SOLDER BONDING OF SURFACES ( 71) We, INTERNATIONAL STANDARD ELECTRIC CORPORATION a Corporation organised and existing under the Laws of the State of Delaware, United States of America of 320 Park Avenue, New York 22, State of New York, United States of America, do hereby declare the invention, for which we pray that a patent may be granted to us, and the method by which it is to be performed, to be particularly described in and by the following statement:-
The present invention relates to solder bonding of surfaces particularly but not exclusively in the construction of printed circuit assemblies.
In the past it has been the practice of plating the surface of the substrate to be bonded to a surface of the carrier with a metal and then tinning both of these surfaces separately with solder The tinned surfaces are separately cleaned to remove undesirable voids in both of the tinned surfaces A flux is applied to both of the cleaned tinned surfaces separately and both of the fluxed cleaned tinned surfaces are placed in contact with each other Heat and pressure is then simultaneously applied to both of the substrate and the carrier until the solder of both of the fluxed cleaned tinned surfaces flows.
Both of the bodies are then allowed to cool in a natural manner to room temperature while still applying the pressure to bond the substrate to the carrier.
A disadvantage of this method of bonding a substrate to a carrier in printed circuit assemblies is that intimate contact between the bonded surfaces may not be achieved due to trapped flux and additionally excess solder will flow out onto undesirable areas of the substrate and carrier, such as the outer surface of the substrate and the carrier adjacent the bonded joint.
According to the present invention there is provided a method of soldering a dielectric body to a metallic body, the method including plating a surface of said dielectric body with a metal, forming a plurality of vents in the metal body, tinning the plated surface and a surface of the metallic body with solder, cleaning the two surfaces to remove undesirable voids, applying a flux to the surfaces, placing the fluxed surfaces in contact with each other, applying heat and pressure until the solder flows, and allowing the bodies to cool to room temperature while still 55 applying the pressure to solder bond said dielectric body to said metallic body, the plurality of vent means removing excess flux and solder from the contact surfaces during the step of applying heat and pressure 60 to provide an intimate bonded contact between both surfaces.
According to a further aspect of the present invention there is provided a method of soldering a first body of a given material 65 to a second body of a material different than said given material, the method including forming a plurality of vents in a surface of one of said bodies, tinning said surface with solder, plating one surface of the other 70 body with a metal and tinning that surface with solder, cleaning said tinned surfaces separately to remove undesirable voids in both of said tinned surfaces; applying a flux to both of said cleaned tinned surfaces 75 separately; placing both of said fluxed cleaned tinned surfaces in contact with each other; applying heat and pressure simultaneously to both of said first and second bodies until said solder of both of said fluxed cleaned 80 tinned surfaces flows; and allowing both of said bodies to cool to room temperature while still applying said pressure to solder said first body to said second body; said plurality of vent means removing excess 85 flux and solder from the contact surface during said step of applying heat and pressure to provide an intimate soldered contact between both of said surfaces.
So the invention can be clearly understood, 90 reference will now be made to the accompanying drawing, in which:
Fig 1 is a cross-sectional view of a printed circuit assembly employing the method of bonding the dielectric substrate to the 95 metallic carrier in accordance with an embodiment of the present invention with the thickness of the various components of the assembly and the diameter of the vent holes being greatly exaggerated for clarity; 100 and ( 11) 1 586 265 Fig 2 is a cross-sectional view along lines 2-2 of Fig 1.
Referring to Figs 1 and 2, a surface 1 of dielectric substrate 2 is plated with a metallic plating material 3 The dielectric substrate 2 may be any known dielectric material but as a preferred embodiment is composed of alumina (A 1203) The metallic plating material 3 may be any suitable metallic material easily applied to surface 1 In the preferred embodiment plating material 3 is gold which may be placed on surface 1 by well known vaporizing techniques Surface 1 of substrate 2 is to be bonded to surface 5 of metallic carrier 4 Metallic carrier 4 may be composed of any suitable metal and in the preferred embodiment carrier 4 is composed of aluminium Due to the difficulty of soldering aluminium, a metallic plating material 6 is vaporized upon surface 5 of carrier 4.
As with plating material 3, plating material 6 may be any suitable metal, however, in the preferred embodiment the metal employed is gold The plating of surface 5 may be eliminated if the metal of carrier 4 can be easily tinned Vent holes 7 are formed in carrier 4 by drilling a plurality of holes from surface 5 through carrier 4 to surface 8 parallel to surface 5 Vent holes 7 may be drilled in carrier 4 by employing a drilling jig with as many drills having the desired spacing therebetween as the number of desired vent holes 7.
Plating material 3 of substrate 2 and plating material 6 of carrier 4 are tinned by applying flux and solder to materials 3 and 6 with substrate 2 and carrier 4 separated from each other Substrate 2 and carrier 4 are then separately heated to a temperature of approximately 150 ‘C (centigrade) at which temperature the solder will flow Substrate 2 and carrier 4 are then allowed to separately cool in a natural manner to room temperature.
The cooled separated substrate 2 and carrier 4 have the tinned surfaces thereof cleaned to remove undesirable voids in the tinned surfaces The cleaning process includes the step of dipping each of the tinned surfaces separately into water, wiping the water’ from each of the tinned surfaces separately with a tissue, dipping each of the tinned surfaces separately in a halocarbon solvent and wiping the solvent from each of the tinned surfaces separately with a tissue.
A flux is then applied to both of the cleaned tinned surfaces separately and the cleaned tinned surfaces are then placed in contact with each other Heat and pressure is then simultaneously applied to substrate 2 and carrier 4 until the solder of both of the tinned surfaces flows The solder flows due to the applied heat at a temperature of approximately 1500 C and the pressure applied to the substrate 2 and carrier 4 is approximately 2 psi (pounds per square inch) At this point in the process substrate 2 and carrier 4 are allowed to cool in a natural manner to room temperature while still applying the pressure to cause a soldered bond between the plated surfaces 1 and 5 such as illustrated by bonding material 9 in the form of solder.
The printed circuit assembly is then completed by plating the desired metallic circuit on surface 11 of substrate 2 by well known printed circuit techniques.
The vent holes 7 remove excess flux to prevent the trapping of flux between plated surfaces 1 and 5 and thus provides an intimate soldered contact between plated surfaces 1 and 5 and remove solder to prevent the solder from flowing into undesirable areas, such as the outer surface of carrier 4 and substrate 2 adjacent the soldered joint.
Claims (13)
WHAT WE CLAIM IS:-
1 A method of soldering a dielectric body to a metallic body, the method including plating a surface of said dielectric 90 body with a metal, forming a plurality of vents in the metal body, tinning the plated surface and a surface of the metallic body with solder, cleaning the two surfaces to remove undesirable voids, applying a flux 95 to the surfaces, placing the fluxed surfaces in contact with each other, applying heat and pressure until the solder flows, and allowing the bodies to cool to room temperature while still applying the pressure to solder 100 bond said dielectric body to said metallic body, the plurality of vents removing excess flux and solder from the contact surfaces during the step of applying heat and pressure to provide an intimate solder bonded con 105 tact between both surfaces.
2 A method according to claim 1, wherein the dielectric body is a substrate of a printed circuit assembly, and the metallic body is a carrier for the substrate of a 110 printed circuit assembly.
3 A method according to claim 1 or 2, wherein the substrate is composed of alumina.
4 A method according to claim 1, 2, or 3, wherein the step of plating the dielectric 115 surface includes the step of vaporizing gold thereon.
A method according to any preceding claim wherein the step of forming said plurality of vents includes drilling a plurality 120 of holes through the metallic body.
6 A method according to any preceding claim, wherein the metallic body is composed of aluminium, the method further including the step of plating the metallic surface with 125 a metal prior to tinning.
7 A method according to any preceding claim -wherein the surface of the metallic body is plated by vaporizing gold thereon.
8 A method according to any preceding 130 1,586,265 1,586,265 claim, wherein the step of applying heat and pressure includes the step of heating said bodies simultaneously to a temperature of approximately 150 TC, and applying a pressure of approximately two pounds per square inch.
9 A method according to any preceding claim, wherein the step of cleaning includes dipping both of said tinned surfaces separately in water, wiping said water from both of said tinned surfaces separately, dipping both of said tinned surfaces separately in a halocarbon solvent, and wiping the halocarbon solvent from both of said surfaces separately.
10 A method of soldering a first body of a given material to a second body of material different than said given material, the method including forming a plurality of vents in a surface of one of said bodies, tinning said surface with solder, plating one surface of the other with solder, cleaning said tinned surfaces separately to remove undesirable voids in both of said tinned surfaces; applying a flux to both of said cleaned tinned surfaces separately; placing both of said fluxed cleaned tinned surfaces in contact with each other; applying heat and pressure simultaneously to both of said first and second bodies until said solder of both of said fluxed cleaned tinned surfaces flows; and allowing said bodies to cool to room temperature while still applying said pressure to solder said first body to said second body; said plurality of vents removing excess flux and solder from the contact surfaces during said step of applying heat and pressure to provide an intimate soldered contact between both of said surfaces.
11 A method of bonding a dielectric body to a metallic body, substantially as hereinbefore described with reference to the accompanying drawing.
12 Dielectric and metallic bodies bonded together by a method according to any of claims 1 to 9.
13 A dielectric body bonded to a metallic body, substantially as hereinbefore described with reference to and as illustrated in the accompanying drawing.
M C DENNIS, Chartered Patent Agent, For the Applicants.
Printed for Her Majesty’s Stationery Office by Burgess & Son (Abingdon), Ltd -1981.
Published at The Patent Office, 25 Southampton Buildings, London, WC 2 A l AY, from which copies may be obtained.
GB37515/77A
1976-09-22
1977-09-08
Solder bonding of surfaces
Expired
GB1586265A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US05/725,204
US4061263A
(en)
1976-09-22
1976-09-22
Method of bonding a dielectric substrate to a metallic carrier in a printed circuit assembly
Publications (1)
Publication Number
Publication Date
GB1586265A
true
GB1586265A
(en)
1981-03-18
Family
ID=24913577
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB37515/77A
Expired
GB1586265A
(en)
1976-09-22
1977-09-08
Solder bonding of surfaces
Country Status (2)
Country
Link
US
(1)
US4061263A
(en)
GB
(1)
GB1586265A
(en)
Families Citing this family (9)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US4365736A
(en)
*
1979-10-12
1982-12-28
Stumm James E
Method of manufacturing high stability joint
US4394953A
(en)
*
1981-03-12
1983-07-26
Schwarzkopf Development Corporation
Method of joining individual parts of an X-ray anode, in particular of a rotating anode
US4409278A
(en)
*
1981-04-16
1983-10-11
General Electric Company
Blister-free direct bonding of metals to ceramics and metals
US4889275A
(en)
*
1988-11-02
1989-12-26
Motorola, Inc.
Method for effecting solder interconnects
US6106923A
(en)
*
1997-05-20
2000-08-22
Fujitsu Limited
Venting hole designs for multilayer conductor-dielectric structures
DE19826023C2
(en)
*
1998-06-10
2001-01-25
Siemens Ag
Multi-layer electrical circuit arrangement
DE10131430A1
(en)
*
2001-06-29
2003-01-16
Bosch Gmbh Robert
Welding process
US6844522B1
(en)
*
2004-05-04
2005-01-18
General Motors Corporation
Method of metallurgically bonding articles and article therefor
JP7145068B2
(en)
*
2018-12-28
2022-09-30
新光電気工業株式会社
Wiring board and its manufacturing method
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Assignee
Title
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(en)
*
1931-01-29
1934-04-24
Krupp Ag
Tipped tool and working implement
US2149008A
(en)
*
1937-09-15
1939-02-28
Comb Eng Co Inc
Tube with metallic block and method of attaching latter
US3363308A
(en)
*
1962-07-30
1968-01-16
Texas Instruments Inc
Diode contact arrangement
US3390447A
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1963-07-09
1968-07-02
Buckbee Mears Co
Method of making laminar mesh
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1963-10-28
1966-11-08
North American Aviation Inc
Bonded metallic and metalized ceramic members and method of making
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Engelhard Ind Inc
Method of making spinnerettes
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(en)
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1964-06-29
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Aluminum Co Of America
Method of joining electrical contacts to aluminum parts
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Gen Dynamics Corp
Method for sealing microelectronic device packages
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*
1973-06-28
1975-11-25
Rca Corp
Method of bonding two bodies together
1976
1976-09-22
US
US05/725,204
patent/US4061263A/en
not_active
Expired – Lifetime
1977
1977-09-08
GB
GB37515/77A
patent/GB1586265A/en
not_active
Expired
Also Published As
Publication number
Publication date
US4061263A
(en)
1977-12-06
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Legal Events
Date
Code
Title
Description
1981-06-03
PS
Patent sealed [section 19, patents act 1949]
1981-09-30
746
Register noted ‘licences of right’ (sect. 46/1977)
1989-05-04
PCNP
Patent ceased through non-payment of renewal fee
