GB2014787A

GB2014787A – Mesa structure and manufacturing process
– Google Patents

GB2014787A – Mesa structure and manufacturing process
– Google Patents
Mesa structure and manufacturing process

Info

Publication number
GB2014787A

GB2014787A
GB7905545A
GB7905545A
GB2014787A
GB 2014787 A
GB2014787 A
GB 2014787A
GB 7905545 A
GB7905545 A
GB 7905545A
GB 7905545 A
GB7905545 A
GB 7905545A
GB 2014787 A
GB2014787 A
GB 2014787A
Authority
GB
United Kingdom
Prior art keywords
manufacturing process
mesa structure
mesa
manufacturing
Prior art date
1978-02-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Application number
GB7905545A
Other versions

GB2014787B
(en

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Vishay Siliconix Inc

Original Assignee
Siliconix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1978-02-17
Filing date
1979-02-16
Publication date
1979-08-30

1979-02-16
Application filed by Siliconix Inc
filed
Critical
Siliconix Inc

1979-08-30
Publication of GB2014787A
publication
Critical
patent/GB2014787A/en

1982-04-28
Application granted
granted
Critical

1982-04-28
Publication of GB2014787B
publication
Critical
patent/GB2014787B/en

Status
Expired
legal-status
Critical
Current

Links

Espacenet

Global Dossier

Discuss

238000004519
manufacturing process
Methods

0.000
title
1

Classifications

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor

H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor

H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched

H01L29/76—Unipolar devices, e.g. field effect transistors

H01L29/772—Field effect transistors

H01L29/78—Field effect transistors with field effect produced by an insulated gate

H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region

H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor

H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor

H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched

H01L29/76—Unipolar devices, e.g. field effect transistors

H01L29/772—Field effect transistors

H01L29/78—Field effect transistors with field effect produced by an insulated gate

H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region

H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors

H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor

H01L29/40—Electrodes ; Multistep manufacturing processes therefor

H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions

H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched

H01L29/41725—Source or drain electrodes for field effect devices

H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor

Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC

Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10S148/00—Metal treatment

Y10S148/028—Dicing

Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC

Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10S148/00—Metal treatment

Y10S148/051—Etching

Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC

Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10S148/00—Metal treatment

Y10S148/053—Field effect transistors fets

Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC

Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10S148/00—Metal treatment

Y10S148/085—Isolated-integrated

Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC

Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes

Y10S257/914—Polysilicon containing oxygen, nitrogen, or carbon, e.g. sipos

GB7905545A
1978-02-17
1979-02-16
Mesa structure and manufacturing process

Expired

GB2014787B
(en)

Applications Claiming Priority (1)

Application Number
Priority Date
Filing Date
Title

US05/878,685

US4219835A
(en)

1978-02-17
1978-02-17
VMOS Mesa structure and manufacturing process

Publications (2)

Publication Number
Publication Date

GB2014787A
true

GB2014787A
(en)

1979-08-30

GB2014787B

GB2014787B
(en)

1982-04-28

Family
ID=25372576
Family Applications (1)

Application Number
Title
Priority Date
Filing Date

GB7905545A
Expired

GB2014787B
(en)

1978-02-17
1979-02-16
Mesa structure and manufacturing process

Country Status (5)

Country
Link

US
(1)

US4219835A
(en)

JP
(1)

JPS54125987A
(en)

DE
(1)

DE2904769C2
(en)

FR
(1)

FR2417855A1
(en)

GB
(1)

GB2014787B
(en)

Cited By (4)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

FR2455799A1
(en)

*

1979-05-02
1980-11-28
Philips Nv

FIELD-EFFECT TRANSISTOR WITH INSULATED GRID ELECTRODE AND METHOD FOR MANUFACTURING THE SAME

EP0038994A2
(en)

*

1980-04-30
1981-11-04
Siemens Aktiengesellschaft
Contact for MIS semiconductor device and method of making the same

FR2511194A1
(en)

*

1981-08-04
1983-02-11
Siliconix Inc

FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURE

EP0747967A2
(en)

*

1995-06-07
1996-12-11
STMicroelectronics, Inc.
Vertical trench gate MOS device and a method of fabricating the same

Families Citing this family (40)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

DE2855972C2
(en)

*

1978-12-23
1984-09-27
SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg

Semiconductor arrangement with two integrated and anti-parallel connected diodes and process for their production

US4269636A
(en)

*

1978-12-29
1981-05-26
Harris Corporation
Method of fabricating self-aligned bipolar transistor process and device utilizing etching and self-aligned masking

US4502208A
(en)

*

1979-01-02
1985-03-05
Texas Instruments Incorporated
Method of making high density VMOS electrically-programmable ROM

DE2930780C2
(en)

*

1979-07-28
1982-05-27
Deutsche Itt Industries Gmbh, 7800 Freiburg

Method of manufacturing a VMOS transistor

JPS5681974A
(en)

*

1979-12-07
1981-07-04
Toshiba Corp
Manufacture of mos type semiconductor device

JPS56165360A
(en)

*

1980-05-23
1981-12-18
Matsushita Electronics Corp
Manufacture of semiconductor device

US4379305A
(en)

*

1980-05-29
1983-04-05
General Instrument Corp.
Mesh gate V-MOS power FET

GB2080616A
(en)

*

1980-07-21
1982-02-03
Siliconix Inc
Power semiconductor devices

GB2089119A
(en)

*

1980-12-10
1982-06-16
Philips Electronic Associated
High voltage semiconductor devices

DE3132955A1
(en)

*

1981-08-20
1983-03-03
Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt
Field-effect transistor and method for manufacturing it

JPS5868044U
(en)

*

1981-10-30
1983-05-09
日産自動車株式会社

MOS semiconductor device

DE3240162C2
(en)

*

1982-01-04
1996-08-01
Gen Electric

Method of fabricating a double-diffused source-based short-circuit power MOSFET

US4598461A
(en)

*

1982-01-04
1986-07-08
General Electric Company
Methods of making self-aligned power MOSFET with integral source-base short

US4503598A
(en)

*

1982-05-20
1985-03-12
Fairchild Camera & Instrument Corporation
Method of fabricating power MOSFET structure utilizing self-aligned diffusion and etching techniques

JPS598374A
(en)

*

1982-07-05
1984-01-17
Matsushita Electronics Corp
Insulated gate field-effect transistor

US4541001A
(en)

*

1982-09-23
1985-09-10
Eaton Corporation
Bidirectional power FET with substrate-referenced shield

US4636823A
(en)

*

1984-06-05
1987-01-13
California Institute Of Technology
Vertical Schottky barrier gate field-effect transistor in GaAs/GaAlAs

US4717681A
(en)

*

1986-05-19
1988-01-05
Texas Instruments Incorporated
Method of making a heterojunction bipolar transistor with SIPOS

FR2631488B1
(en)

*

1988-05-10
1990-07-27
Thomson Hybrides Microondes

PLANAR-TYPE INTEGRATED MICROWAVE CIRCUIT, COMPRISING AT LEAST ONE MESA COMPONENT, AND MANUFACTURING METHOD THEREOF

JPH0215652A
(en)

*

1988-07-01
1990-01-19
Mitsubishi Electric Corp
Semiconductor device and manufacture thereof

US5506421A
(en)

*

1992-11-24
1996-04-09
Cree Research, Inc.
Power MOSFET in silicon carbide

US5534106A
(en)

*

1994-07-26
1996-07-09
Kabushiki Kaisha Toshiba
Apparatus for processing semiconductor wafers

US5550399A
(en)

*

1994-11-03
1996-08-27
Kabushiki Kaisha Toshiba
Integrated circuit with windowed fuse element and contact pad

US5601687A
(en)

*

1995-09-11
1997-02-11
The United States Of America As Represented By The Secretary Of The Air Force
Mask design

US5719409A
(en)

*

1996-06-06
1998-02-17
Cree Research, Inc.
Silicon carbide metal-insulator semiconductor field effect transistor

US6214127B1
(en)

*

1998-02-04
2001-04-10
Micron Technology, Inc.
Methods of processing electronic device workpieces and methods of positioning electronic device workpieces within a workpiece carrier

US6380027B2
(en)

1999-01-04
2002-04-30
International Business Machines Corporation
Dual tox trench dram structures and process using V-groove

CN100365808C
(en)

*

1999-03-31
2008-01-30
精工爱普生株式会社
Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head

DE10040458B4
(en)

*

2000-08-18
2015-08-27
Infineon Technologies Ag

Vertical field effect transistor and method for its production

US6777745B2
(en)

*

2001-06-14
2004-08-17
General Semiconductor, Inc.
Symmetric trench MOSFET device and method of making same

JP4865166B2
(en)

*

2001-08-30
2012-02-01
新電元工業株式会社

Transistor manufacturing method, diode manufacturing method

US7323402B2
(en)

*

2002-07-11
2008-01-29
International Rectifier Corporation
Trench Schottky barrier diode with differential oxide thickness

US6855593B2
(en)

*

2002-07-11
2005-02-15
International Rectifier Corporation
Trench Schottky barrier diode

US20060286706A1
(en)

*

2005-06-21
2006-12-21
Salian Arvind S
Method of making a substrate contact for a capped MEMS at the package level

US7316965B2
(en)

*

2005-06-21
2008-01-08
Freescale Semiconductor, Inc.
Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level

JP2008078604A
(en)

*

2006-08-24
2008-04-03
Rohm Co Ltd
Mis field effect transistor and method for manufacturing the same

US8264047B2
(en)

*

2010-05-10
2012-09-11
Infineon Technologies Austria Ag
Semiconductor component with a trench edge termination

JP2013042117A
(en)

*

2011-07-15
2013-02-28
Semiconductor Energy Lab Co Ltd
Semiconductor device

CN103337523B
(en)

*

2013-06-19
2016-03-02
张家港凯思半导体有限公司
A kind of valley gutter Superpotential barrier rectification device and manufacture method thereof

US10134839B2
(en)

*

2015-05-08
2018-11-20
Raytheon Company
Field effect transistor structure having notched mesa

Family Cites Families (3)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

GB1301702A
(en)

*

1969-01-27
1973-01-04

US4092660A
(en)

*

1974-09-16
1978-05-30
Texas Instruments Incorporated
High power field effect transistor

US4145703A
(en)

*

1977-04-15
1979-03-20
Supertex, Inc.
High power MOS device and fabrication method therefor

1978

1978-02-17
US
US05/878,685
patent/US4219835A/en
not_active
Expired – Lifetime

1979

1979-02-08
DE
DE2904769A
patent/DE2904769C2/en
not_active
Expired

1979-02-16
JP
JP1714379A
patent/JPS54125987A/en
active
Pending

1979-02-16
GB
GB7905545A
patent/GB2014787B/en
not_active
Expired

1979-02-16
FR
FR7903985A
patent/FR2417855A1/en
active
Granted

Cited By (7)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

FR2455799A1
(en)

*

1979-05-02
1980-11-28
Philips Nv

FIELD-EFFECT TRANSISTOR WITH INSULATED GRID ELECTRODE AND METHOD FOR MANUFACTURING THE SAME

EP0038994A2
(en)

*

1980-04-30
1981-11-04
Siemens Aktiengesellschaft
Contact for MIS semiconductor device and method of making the same

EP0038994A3
(en)

*

1980-04-30
1982-01-27
Siemens Aktiengesellschaft Berlin Und Munchen
Contact for mis semiconductor device and method of making the same

FR2511194A1
(en)

*

1981-08-04
1983-02-11
Siliconix Inc

FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURE

EP0747967A2
(en)

*

1995-06-07
1996-12-11
STMicroelectronics, Inc.
Vertical trench gate MOS device and a method of fabricating the same

EP0747967A3
(en)

*

1995-06-07
1998-01-21
STMicroelectronics, Inc.
Vertical trench gate MOS device and a method of fabricating the same

US6069385A
(en)

*

1995-06-07
2000-05-30
Stmicroelectronics, Inc.
Trench MOS-gated device

Also Published As

Publication number
Publication date

US4219835A
(en)

1980-08-26

FR2417855B1
(en)

1982-06-11

JPS54125987A
(en)

1979-09-29

DE2904769C2
(en)

1984-04-05

DE2904769A1
(en)

1979-08-23

FR2417855A1
(en)

1979-09-14

GB2014787B
(en)

1982-04-28

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Legal Events

Date
Code
Title
Description

1986-10-08
PCNP
Patent ceased through non-payment of renewal fee

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