GB2016807A – Isc-shaped semiconductor compenent
– Google Patents
GB2016807A – Isc-shaped semiconductor compenent
– Google Patents
Isc-shaped semiconductor compenent
Info
Publication number
GB2016807A
GB2016807A
GB7908049A
GB7908049A
GB2016807A
GB 2016807 A
GB2016807 A
GB 2016807A
GB 7908049 A
GB7908049 A
GB 7908049A
GB 7908049 A
GB7908049 A
GB 7908049A
GB 2016807 A
GB2016807 A
GB 2016807A
Authority
GB
United Kingdom
Prior art keywords
compenent
isc
shaped semiconductor
semiconductor
shaped
Prior art date
1978-03-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7908049A
Other versions
GB2016807B
(en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1978-03-10
Filing date
1979-03-07
Publication date
1979-09-26
1979-03-07
Application filed by Licentia Patent Verwaltungs GmbH
filed
Critical
Licentia Patent Verwaltungs GmbH
1979-09-26
Publication of GB2016807A
publication
Critical
patent/GB2016807A/en
1982-07-21
Application granted
granted
Critical
1982-07-21
Publication of GB2016807B
publication
Critical
patent/GB2016807B/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/02—Containers; Seals
H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/13—Discrete devices, e.g. 3 terminal devices
H01L2924/1301—Thyristor
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/30—Technical effects
H01L2924/35—Mechanical effects
H01L2924/351—Thermal stress
GB7908049A
1978-03-10
1979-03-07
Isc-shaped semiconductor compenent
Expired
GB2016807B
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
DE2810416A
DE2810416C2
(en)
1978-03-10
1978-03-10
Semiconductor component with plastic coating
Publications (2)
Publication Number
Publication Date
GB2016807A
true
GB2016807A
(en)
1979-09-26
GB2016807B
GB2016807B
(en)
1982-07-21
Family
ID=6034077
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB7908049A
Expired
GB2016807B
(en)
1978-03-10
1979-03-07
Isc-shaped semiconductor compenent
Country Status (6)
Country
Link
US
(1)
US4240099A
(en)
JP
(1)
JPS54124973A
(en)
DE
(1)
DE2810416C2
(en)
FR
(1)
FR2419587A1
(en)
GB
(1)
GB2016807B
(en)
SE
(1)
SE435771B
(en)
Cited By (3)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB2134029A
(en)
*
1982-11-22
1984-08-08
Olin Corp
Adhesion primers for encapsulating epoxies
US4521469A
(en)
*
1982-11-22
1985-06-04
Olin Corporation
Casing for electronic components
US4582556A
(en)
*
1982-11-22
1986-04-15
Olin Corporation
Adhesion primers for encapsulating epoxies
Families Citing this family (9)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
DE2915862C2
(en)
*
1979-04-19
1985-04-25
Siemens AG, 1000 Berlin und 8000 München
Semiconductor component with a disc-shaped housing
JPS57143849A
(en)
*
1981-03-02
1982-09-06
Toshiba Corp
Flat semiconductor element
DE4227063A1
(en)
*
1992-08-15
1994-02-17
Abb Research Ltd
High-performance semiconductor component that can be switched off
US6703707B1
(en)
*
1999-11-24
2004-03-09
Denso Corporation
Semiconductor device having radiation structure
US7145254B2
(en)
*
2001-07-26
2006-12-05
Denso Corporation
Transfer-molded power device and method for manufacturing transfer-molded power device
US7132698B2
(en)
*
2002-01-25
2006-11-07
International Rectifier Corporation
Compression assembled electronic package having a plastic molded insulation ring
KR20040006636A
(en)
*
2002-07-13
2004-01-24
천기완
The soft cooling jacket for water cooling of the electronics and buffer jacket using of it
US7382059B2
(en)
*
2005-11-18
2008-06-03
Semiconductor Components Industries, L.L.C.
Semiconductor package structure and method of manufacture
JP5126278B2
(en)
*
2010-02-04
2013-01-23
株式会社デンソー
Semiconductor device and manufacturing method thereof
Family Cites Families (11)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB555876A
(en)
*
1942-04-27
1943-09-10
Percy Archibald Sporing
Improvements in or relating to electric terminals
GB737855A
(en)
*
1952-12-19
1955-10-05
Philips Nv
Improvements in or relating to bodies comprising a synthetic resin mass having a metal article partly embedded therein
FR1531714A
(en)
*
1966-06-03
1968-07-05
Westinghouse Electric Corp
Disc-type semiconductor device
US3437887A
(en)
*
1966-06-03
1969-04-08
Westinghouse Electric Corp
Flat package encapsulation of electrical devices
GB1191232A
(en)
*
1968-02-14
1970-05-13
Westinghouse Brake & Signal
Semiconductor Devices and Their Manufacture
US3559001A
(en)
*
1968-08-21
1971-01-26
Motorola Inc
Semiconductor housing assembly
JPS4826675B1
(en)
*
1968-10-16
1973-08-14
DE2014289A1
(en)
*
1970-03-25
1971-10-14
Semikron Gleichrichterbau
Disc-shaped semiconductor component and method for its manufacture
US3831067A
(en)
*
1972-05-15
1974-08-20
Int Rectifier Corp
Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring
DE2364728A1
(en)
*
1973-12-27
1975-07-03
Licentia Gmbh
DISC-SHAPED SEMI-CONDUCTOR COMPONENT HIGH-PERFORMANCE WITH PLASTIC COATING
US4008486A
(en)
*
1975-06-02
1977-02-15
International Rectifier Corporation
Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring
1978
1978-03-10
DE
DE2810416A
patent/DE2810416C2/en
not_active
Expired
1979
1979-03-01
FR
FR7905400A
patent/FR2419587A1/en
active
Granted
1979-03-06
SE
SE7902014A
patent/SE435771B/en
not_active
IP Right Cessation
1979-03-07
JP
JP2570379A
patent/JPS54124973A/en
active
Granted
1979-03-07
GB
GB7908049A
patent/GB2016807B/en
not_active
Expired
1979-03-12
US
US06/019,607
patent/US4240099A/en
not_active
Expired – Lifetime
Cited By (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB2134029A
(en)
*
1982-11-22
1984-08-08
Olin Corp
Adhesion primers for encapsulating epoxies
US4521469A
(en)
*
1982-11-22
1985-06-04
Olin Corporation
Casing for electronic components
US4525422A
(en)
*
1982-11-22
1985-06-25
Olin Corporation
Adhesion primers for encapsulating epoxies
US4582556A
(en)
*
1982-11-22
1986-04-15
Olin Corporation
Adhesion primers for encapsulating epoxies
Also Published As
Publication number
Publication date
GB2016807B
(en)
1982-07-21
SE7902014L
(en)
1979-09-11
DE2810416C2
(en)
1983-09-01
FR2419587B1
(en)
1985-03-15
SE435771B
(en)
1984-10-15
US4240099A
(en)
1980-12-16
JPS6136710B2
(en)
1986-08-20
JPS54124973A
(en)
1979-09-28
FR2419587A1
(en)
1979-10-05
DE2810416A1
(en)
1979-09-13
Similar Documents
Publication
Publication Date
Title
JPS54109780A
(en)
1979-08-28
Semiconductor
JPS54129886A
(en)
1979-10-08
Semiconductor
GB2034520B
(en)
1983-06-15
Semiconductor assembly
GB2019091B
(en)
1982-07-07
Semiconductor store
GB2029103B
(en)
1983-03-09
Mos-integrated semiconductor store
GB2020489B
(en)
1982-05-12
Semi-conductor arrangement
GB2016807B
(en)
1982-07-21
Isc-shaped semiconductor compenent
GB2014362B
(en)
1982-02-24
Semiconductor devices
JPS5555554A
(en)
1980-04-23
Semiconductor element
JPS5524495A
(en)
1980-02-21
Thyristor
GB2026240B
(en)
1982-12-01
Semiconductor devices
GB2038088B
(en)
1983-05-25
Semiconductor structures
JPS5526698A
(en)
1980-02-26
Thyristor
JPS5588373A
(en)
1980-07-04
Thyristor
GB2027272B
(en)
1983-03-23
Semiconductor devices
JPS5494284A
(en)
1979-07-25
Mis semiconductor
GB2014364B
(en)
1982-08-25
Semiconductor arrangement
JPS5573995A
(en)
1980-06-04
Digital semiconductor dcircuit
JPS55105355A
(en)
1980-08-12
Semiconductor element
GB2014363B
(en)
1982-06-03
Semiconductor devices
JPS5452479A
(en)
1979-04-25
Semiconductor
JPS54128673A
(en)
1979-10-05
Semiconductor
JPS54115083A
(en)
1979-09-07
Semiconductor
JPS54123880A
(en)
1979-09-26
Semiconductor
JPS54105463A
(en)
1979-08-18
Semiconductor
Legal Events
Date
Code
Title
Description
1990-09-26
732
Registration of transactions, instruments or events in the register (sect. 32/1977)
1999-03-31
PE20
Patent expired after termination of 20 years
Effective date:
19990306
