GB1081407A

GB1081407A – Improvements relating to the application of electrodes to semi-conductor devices
– Google Patents

GB1081407A – Improvements relating to the application of electrodes to semi-conductor devices
– Google Patents
Improvements relating to the application of electrodes to semi-conductor devices

Info

Publication number
GB1081407A

GB1081407A
GB4596964A
GB4596964A
GB1081407A
GB 1081407 A
GB1081407 A
GB 1081407A
GB 4596964 A
GB4596964 A
GB 4596964A
GB 4596964 A
GB4596964 A
GB 4596964A
GB 1081407 A
GB1081407 A
GB 1081407A
Authority
GB
United Kingdom
Prior art keywords
iron
nickel
semi
conductor devices
silicon body
Prior art date
1964-11-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Application number
GB4596964A
Inventor
Willi Gerlach
Werner Heidrich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Licentia Patent Verwaltungs GmbH

Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1964-11-11
Filing date
1964-11-11
Publication date
1967-08-31

1964-11-11
Application filed by Licentia Patent Verwaltungs GmbH
filed
Critical
Licentia Patent Verwaltungs GmbH

1964-11-11
Priority to GB4596964A
priority
Critical
patent/GB1081407A/en

1967-08-31
Publication of GB1081407A
publication
Critical
patent/GB1081407A/en

Status
Expired
legal-status
Critical
Current

Links

Espacenet

Global Dossier

Discuss

Classifications

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, «first-level» interconnects; Manufacturing methods related thereto

H01L2224/42—Wire connectors; Manufacturing methods related thereto

H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process

H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector

H01L2224/45001—Core members of the connector

H01L2224/45099—Material

H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof

H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

H01L2224/45124—Aluminium (Al) as principal constituent

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/0001—Technical content checked by a classifier

H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/01—Chemical elements

H01L2924/01005—Boron [B]

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/01—Chemical elements

H01L2924/01006—Carbon [C]

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/01—Chemical elements

H01L2924/01013—Aluminum [Al]

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/01—Chemical elements

H01L2924/01014—Silicon [Si]

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/01—Chemical elements

H01L2924/01019—Potassium [K]

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/01—Chemical elements

H01L2924/01029—Copper [Cu]

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/01—Chemical elements

H01L2924/01042—Molybdenum [Mo]

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/01—Chemical elements

H01L2924/01074—Tungsten [W]

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/01—Chemical elements

H01L2924/01082—Lead [Pb]

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/10—Details of semiconductor or other solid state devices to be connected

H01L2924/102—Material of the semiconductor or solid state bodies

H01L2924/1025—Semiconducting materials

H01L2924/10251—Elemental semiconductors, i.e. Group IV

H01L2924/10253—Silicon [Si]

Abstract

1,081,407. Semi-conductor devices. LICENTIA PATENT – VERWALTUNGS – G.m.b.H. Nov. 11, 1964, No. 45969/64. Heading H1K. An electrical connection to a silicon body comprises a wirelike lead provided at one end with a flat disc or strip having an aluminium surface which is ultrasonically welded to the silicon body. The lead wire may be of nickel and the disc or strip may be of tungsten, molybdenum, iron, nickel, iron-nickel alloy, or iron-nickelcobalt alloy, with an aluminium coating on the surface joined to the silicon body. The lead may comprise a wire of nickel, copper, iron, or iron-nickel alloy provided with an aluminium » head.» The invention may be utilized to form the gate electrode of an SCR.

GB4596964A
1964-11-11
1964-11-11
Improvements relating to the application of electrodes to semi-conductor devices

Expired

GB1081407A
(en)

Priority Applications (1)

Application Number
Priority Date
Filing Date
Title

GB4596964A

GB1081407A
(en)

1964-11-11
1964-11-11
Improvements relating to the application of electrodes to semi-conductor devices

Applications Claiming Priority (1)

Application Number
Priority Date
Filing Date
Title

GB4596964A

GB1081407A
(en)

1964-11-11
1964-11-11
Improvements relating to the application of electrodes to semi-conductor devices

Publications (1)

Publication Number
Publication Date

GB1081407A
true

GB1081407A
(en)

1967-08-31

Family
ID=10439292
Family Applications (1)

Application Number
Title
Priority Date
Filing Date

GB4596964A
Expired

GB1081407A
(en)

1964-11-11
1964-11-11
Improvements relating to the application of electrodes to semi-conductor devices

Country Status (1)

Country
Link

GB
(1)

GB1081407A
(en)

1964

1964-11-11
GB
GB4596964A
patent/GB1081407A/en
not_active
Expired

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