GB1128228A – Metallizing and bonding non-metallic refractory bodies
– Google Patents
GB1128228A – Metallizing and bonding non-metallic refractory bodies
– Google Patents
Metallizing and bonding non-metallic refractory bodies
Info
Publication number
GB1128228A
GB1128228A
GB45017/66A
GB4501766A
GB1128228A
GB 1128228 A
GB1128228 A
GB 1128228A
GB 45017/66 A
GB45017/66 A
GB 45017/66A
GB 4501766 A
GB4501766 A
GB 4501766A
GB 1128228 A
GB1128228 A
GB 1128228A
Authority
GB
United Kingdom
Prior art keywords
metal
brazing
metallic refractory
metallizing
active
Prior art date
1965-10-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB45017/66A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1965-10-18
Filing date
1966-10-07
Publication date
1968-09-25
1966-10-07
Application filed by General Electric Co
filed
Critical
General Electric Co
1968-09-25
Publication of GB1128228A
publication
Critical
patent/GB1128228A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
B—PERFORMING OPERATIONS; TRANSPORTING
B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
B23K35/0244—Powders, particles or spheres; Preforms made therefrom
C—CHEMISTRY; METALLURGY
C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
C—CHEMISTRY; METALLURGY
C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
C04B41/5133—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal with a composition mainly composed of one or more of the refractory metals
C—CHEMISTRY; METALLURGY
C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
C04B41/81—Coating or impregnation
C04B41/85—Coating or impregnation with inorganic materials
C04B41/88—Metals
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C24/00—Coating starting from inorganic powder
C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/02—Details
H05K1/09—Use of materials for the conductive, e.g. metallic pattern
H05K1/092—Dispersed materials, e.g. conductive pastes or inks
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/02—Details
H05K1/03—Use of materials for the substrate
H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T428/00—Stock material or miscellaneous articles
Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
Y10T428/2913—Rod, strand, filament or fiber
Y10T428/2918—Rod, strand, filament or fiber including free carbon or carbide or therewith [not as steel]
Abstract
1,128,228. Brazing. GENERAL ELECTRIC CO. 7 Oct., 1966 [18 Oct., 1965], No. 45017/66. Heading B3R. [Also in Divisions C7 and H1] A material, for metallizing or bonding non- metallic refractory bodies, e.g. either together or to a metal, in wire, rod or powder form, comprises composite metal particles having a core of an active metal selected from Ti, Hf, Th, Zr, V, Ta, W or mixtures or alloys thereof, coated with a brazing metal selected from Ag, Cu, Au, Ni, Fe, Mo, Cr, Pt, Co, Sn or mixtures or alloys thereof, wherein the proportion of active metal to brazing metal is greater than that in the lowest melting eutectic thereof. For example, composite metal particles 10-50 microns in size, comprising 85% Ti powder of 325 mesh (44 microns maximum) size and 15% Ni coating deposited by a fluidized bed process, are applied, e.g. by painting, spraying, silk screening, flow coating or dipping, in a suitable vehicle, e.g. toluene and amyl acetate solvent with iso-butylmethacrylate and nitrocellulose binder, to a non-metallic refractory body such as forsterite, which is then heated in a non-reactive atmosphere to above the lowest melting eutectic temperature of the Ti-Ni alloy to effect bonding. Areas desired to be metallized, such as a printed circuit pattern, may be provided with carbon residue material, e.g. from nitrocellulose solution in amyl acetate. The resultant residual carbon may react with the active alloy, e.g. to form a ductile Ti-Ni-C compound.
GB45017/66A
1965-10-18
1966-10-07
Metallizing and bonding non-metallic refractory bodies
Expired
GB1128228A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US496755A
US3410714A
(en)
1965-10-18
1965-10-18
Metallizing and bonding non-metallic bodies
Publications (1)
Publication Number
Publication Date
GB1128228A
true
GB1128228A
(en)
1968-09-25
Family
ID=23973991
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB45017/66A
Expired
GB1128228A
(en)
1965-10-18
1966-10-07
Metallizing and bonding non-metallic refractory bodies
Country Status (4)
Country
Link
US
(1)
US3410714A
(en)
DE
(1)
DE1508325A1
(en)
FR
(1)
FR1500503A
(en)
GB
(1)
GB1128228A
(en)
Cited By (2)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
EP0299238A2
(en)
*
1987-07-17
1989-01-18
Fried. Krupp Gesellschaft mit beschränkter Haftung
Process for coating titanium or titanium alloy prostheses
CN112621008A
(en)
*
2020-12-15
2021-04-09
北京科技大学顺德研究生院
Solder ball for low thermal stress chip packaging and preparation method thereof
Families Citing this family (15)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3620799A
(en)
*
1968-12-26
1971-11-16
Rca Corp
Method for metallizing a ceramic body
US3852877A
(en)
*
1969-08-06
1974-12-10
Ibm
Multilayer circuits
US3853582A
(en)
*
1970-02-02
1974-12-10
Raytheon Co
Metallized isotropic boron nitride body and method for making same
US3753757A
(en)
*
1970-05-15
1973-08-21
Union Carbide Corp
Two step porous boiling surface formation
US3711428A
(en)
*
1971-02-01
1973-01-16
Ibm
Electrical resistor paste containing a small amount of charcoal
US4278702A
(en)
*
1979-09-25
1981-07-14
Anthony J. Casella
Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate
US4340618A
(en)
*
1981-03-20
1982-07-20
International Business Machines Corporation
Process for forming refractory metal layers on ceramic substrate
US5853622A
(en)
*
1990-02-09
1998-12-29
Ormet Corporation
Transient liquid phase sintering conductive adhesives
US5376403A
(en)
*
1990-02-09
1994-12-27
Capote; Miguel A.
Electrically conductive compositions and methods for the preparation and use thereof
FR2676051B1
(en)
*
1991-05-03
1993-12-17
Snecma
CERAMIC COMPOSITE PIECE WITH METAL COATING, METHOD FOR PRODUCING SAME, AND POWDER COMPOSITION USED.
US20060162493A1
(en)
*
2002-09-10
2006-07-27
Ding Yuan
Ni-coated ti powders
CN104400249A
(en)
*
2014-09-24
2015-03-11
西安理工大学
Flux-cored wire for titanium-steel composite board dissimilar joint transition layer and manufacturing method of flux-cored wire
CN104741827A
(en)
*
2015-03-12
2015-07-01
西安理工大学
Ag-V welding wire for welding titanium-pipeline-steel composite plate and preparing method thereof
CN104741830A
(en)
*
2015-03-12
2015-07-01
西安理工大学
Ag-Mo welding wire for welding titanium-pipeline-steel composite plate and preparing method thereof
CN104741817A
(en)
*
2015-03-12
2015-07-01
西安理工大学
Ag-Ni welding wire for welding titanium-pipeline-steel composite plate and preparing method thereof
Family Cites Families (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB606891A
(en)
*
1944-06-14
1948-08-23
Polytechnic Inst Brooklyn
Improvements relating to attenuators for electric waves
US2857663A
(en)
*
1954-02-09
1958-10-28
Gen Electric
Metallic bond
US3254970A
(en)
*
1960-11-22
1966-06-07
Metco Inc
Flame spray clad powder composed of a refractory material and nickel or cobalt
US3338688A
(en)
*
1964-10-06
1967-08-29
Metco Inc
Low smoking nickel aluminum flame spray powder
1965
1965-10-18
US
US496755A
patent/US3410714A/en
not_active
Expired – Lifetime
1966
1966-10-06
DE
DE19661508325
patent/DE1508325A1/en
active
Pending
1966-10-07
GB
GB45017/66A
patent/GB1128228A/en
not_active
Expired
1966-10-18
FR
FR80361A
patent/FR1500503A/en
not_active
Expired
Cited By (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
EP0299238A2
(en)
*
1987-07-17
1989-01-18
Fried. Krupp Gesellschaft mit beschränkter Haftung
Process for coating titanium or titanium alloy prostheses
EP0299238A3
(en)
*
1987-07-17
1990-05-16
Fried. Krupp Gesellschaft Mit Beschrankter Haftung
Process for coating titanium or titanium alloy prostheses
CN112621008A
(en)
*
2020-12-15
2021-04-09
北京科技大学顺德研究生院
Solder ball for low thermal stress chip packaging and preparation method thereof
CN112621008B
(en)
*
2020-12-15
2022-06-24
北京科技大学顺德研究生院
Solder ball for low thermal stress chip packaging and preparation method thereof
Also Published As
Publication number
Publication date
US3410714A
(en)
1968-11-12
DE1508325A1
(en)
1969-10-30
FR1500503A
(en)
1967-11-03
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