GB1226783A – – Google Patents
GB1226783A – – Google Patents
Info
Publication number
GB1226783A
GB1226783A
GB1226783DA
GB1226783A
GB 1226783 A
GB1226783 A
GB 1226783A
GB 1226783D A
GB1226783D A
GB 1226783DA
GB 1226783 A
GB1226783 A
GB 1226783A
Authority
GB
United Kingdom
Prior art keywords
copper
coating
solution
oct
contain
Prior art date
1967-10-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1967-10-26
Filing date
1968-10-28
Publication date
1971-03-31
1968-10-28
Application filed
filed
Critical
1971-03-31
Publication of GB1226783A
publication
Critical
patent/GB1226783A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
C—CHEMISTRY; METALLURGY
C01—INORGANIC CHEMISTRY
C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
C01G3/00—Compounds of copper
C01G3/04—Halides
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
C23C14/0694—Halides
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
C23C14/14—Metallic material, boron or silicon
C23C14/20—Metallic material, boron or silicon on organic substrates
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
C23C14/58—After-treatment
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
C23C14/58—After-treatment
C23C14/5846—Reactive treatment
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
C23C22/02—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using non-aqueous solutions
G—PHYSICS
G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
G03G5/00—Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
G03G5/10—Bases for charge-receiving or other layers
G03G5/104—Bases for charge-receiving or other layers comprising inorganic material other than metals, e.g. salts, oxides, carbon
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
Abstract
1,226,783. Coated surfaces. MATSUSHITA ELECTRIC INDUSTRIAL CO. Ltd. 28 Oct., 1968 [26 Oct., 1967], No. 51062/68. Heading B2E. [Also in Division C1] A copper iodide coating is formed by first vapour depositing a coating of copper on a substrate of e.g. glass, ceramic or organic polymers such as polyethylene, polypropylene, polyvinyl alcohol or chloride, polycarbonate, polyethylene terephthalate, polystyrene, regenerated cellulose, cellulose acetate or nitrate or polymethyl methacrylate and then contacting the copper with a solution of iodine. The solvent may be aromatic, aliphatic or halogenated hydrocarbons, alcohols, polyhydric alcohols, ethers. acetals, ketones or esters. The solution may also contain a resinous material e.g. polyvinyl acetate, butadiene-acrylonitrile copolymer, vinylchloride-vinylacetate copolymer, polymethyl methacrylate, boiled oil of unsaturated glyceride, alkyd, epoxy or polyurethane resins, and silicone resin, to provide a layer on the copper iodide. The solution may also contain a photoconductive substance to give three layers on the substrate. As shown in Fig. 4, a film with a vacuum evaporated coating 12 of copper is contacted with an iodine bath 18, and the film is dried in a chamber 19. The thickness of the coating can be controlled by a doctor blade (Fig. 5, not shown).
GB1226783D
1967-10-26
1968-10-28
Expired
GB1226783A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
JP7004867
1967-10-26
Publications (1)
Publication Number
Publication Date
GB1226783A
true
GB1226783A
(en)
1971-03-31
Family
ID=13420279
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB1226783D
Expired
GB1226783A
(en)
1967-10-26
1968-10-28
Country Status (5)
Country
Link
US
(1)
US3677816A
(en)
DE
(1)
DE1805201C3
(en)
FR
(1)
FR1604392A
(en)
GB
(1)
GB1226783A
(en)
NL
(1)
NL142514B
(en)
Cited By (1)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
CN114940684A
(en)
*
2022-05-24
2022-08-26
浙江大学温州研究院
White light luminescent copper halide complex and preparation method and application thereof
Families Citing this family (5)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3880657A
(en)
*
1974-07-08
1975-04-29
Eastman Kodak Co
Conducting layer for organic photoconductive element
NL166430C
(en)
*
1975-06-27
1981-08-17
Matsushita Electric Ind Co Ltd
METHOD FOR WHITENING COPPER (I) IODIDE, AND REGISTRATION SHEET, PROVIDED WITH ELECTRICALLY CONDUCTIVE LAYERS OF COPPER (I) IODIDE TREATED.
US5120628A
(en)
*
1989-12-12
1992-06-09
Xerox Corporation
Transparent photoreceptor overcoatings
US5108861A
(en)
*
1990-08-28
1992-04-28
Xerox Corporation
Evaporated cuprous iodide films as transparent conductive coatings for imaging members
US6811815B2
(en)
*
2002-06-14
2004-11-02
Avery Dennison Corporation
Method for roll-to-roll deposition of optically transparent and high conductivity metallic thin films
1968
1968-10-22
DE
DE1805201A
patent/DE1805201C3/en
not_active
Expired
1968-10-22
US
US769680A
patent/US3677816A/en
not_active
Expired – Lifetime
1968-10-25
NL
NL686815309A
patent/NL142514B/en
not_active
IP Right Cessation
1968-10-25
FR
FR1604392D
patent/FR1604392A/fr
not_active
Expired
1968-10-28
GB
GB1226783D
patent/GB1226783A/en
not_active
Expired
Cited By (1)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
CN114940684A
(en)
*
2022-05-24
2022-08-26
浙江大学温州研究院
White light luminescent copper halide complex and preparation method and application thereof
Also Published As
Publication number
Publication date
DE1805201A1
(en)
1970-03-05
DE1805201C3
(en)
1979-05-23
DE1805201B2
(en)
1978-09-21
US3677816A
(en)
1972-07-18
NL142514B
(en)
1974-06-17
NL6815309A
(en)
1969-04-29
FR1604392A
(en)
1971-11-08
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Legal Events
Date
Code
Title
Description
1971-08-11
PS
Patent sealed [section 19, patents act 1949]
1979-05-31
PCNP
Patent ceased through non-payment of renewal fee
