GB1292636A – Semiconductor devices and methods for their fabrication
– Google Patents
GB1292636A – Semiconductor devices and methods for their fabrication
– Google Patents
Semiconductor devices and methods for their fabrication
Info
Publication number
GB1292636A
GB1292636A
GB59854/69A
GB5985469A
GB1292636A
GB 1292636 A
GB1292636 A
GB 1292636A
GB 59854/69 A
GB59854/69 A
GB 59854/69A
GB 5985469 A
GB5985469 A
GB 5985469A
GB 1292636 A
GB1292636 A
GB 1292636A
Authority
GB
United Kingdom
Prior art keywords
flange
semi
heat sink
header assembly
fits
Prior art date
1968-12-09
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB59854/69A
Inventor
Richard J Desmond
Paul W Koenig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1968-12-09
Filing date
1969-12-08
Publication date
1972-10-11
1969-12-08
Application filed by General Electric Co
filed
Critical
General Electric Co
1972-10-11
Publication of GB1292636A
publication
Critical
patent/GB1292636A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
239000004065
semiconductor
Substances
0.000
title
abstract
5
238000004519
manufacturing process
Methods
0.000
title
1
238000000034
method
Methods
0.000
title
1
238000005538
encapsulation
Methods
0.000
abstract
2
239000002184
metal
Substances
0.000
abstract
2
239000006096
absorbing agent
Substances
0.000
abstract
1
239000002131
composite material
Substances
0.000
abstract
1
238000001816
cooling
Methods
0.000
abstract
1
239000012530
fluid
Substances
0.000
abstract
1
239000011521
glass
Substances
0.000
abstract
1
239000000463
material
Substances
0.000
abstract
1
230000035939
shock
Effects
0.000
abstract
1
229910000679
solder
Inorganic materials
0.000
abstract
1
239000007787
solid
Substances
0.000
abstract
1
229920003051
synthetic elastomer
Polymers
0.000
abstract
1
229920003002
synthetic resin
Polymers
0.000
abstract
1
239000000057
synthetic resin
Substances
0.000
abstract
1
239000005061
synthetic rubber
Substances
0.000
abstract
1
Classifications
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H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/06—Polymers
H01L2924/0665—Epoxy resin
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/12—Passive devices, e.g. 2 terminal devices
H01L2924/1203—Rectifying Diode
H01L2924/12036—PN diode
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/12—Passive devices, e.g. 2 terminal devices
H01L2924/1204—Optical Diode
H01L2924/12043—Photo diode
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/13—Discrete devices, e.g. 3 terminal devices
H01L2924/1301—Thyristor
H01L2924/13033—TRIAC – Triode for Alternating Current – A bidirectional switching device containing two thyristor structures with common gate contact
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
H01L2924/151—Die mounting substrate
H01L2924/156—Material
H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/30—Technical effects
H01L2924/301—Electrical effects
H01L2924/3011—Impedance
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/30—Technical effects
H01L2924/301—Electrical effects
H01L2924/3025—Electromagnetic shielding
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/30—Technical effects
H01L2924/35—Mechanical effects
H01L2924/351—Thermal stress
Abstract
1292636 Semi-conductor device GENERAL ELECTRIC CO 8 Dec 1969 [9 Dec 1968] 59854/69 Heading H1K An encapsulation for a semi-conductor device comprises an electrically conductive heat sink 104 on to which a semi-conductor wafer 112 is bonded, and a header assembly 136 which retains connecting leads 140, 142, 144 in their respective positions to contact flanges 124, 126 and 132 respectively, forming the contacts to the wafer 112, the whole then being encapsulated and enclosed in an insulating casing. The semi-conductor device, which may be a diode, thyristor or triac protected peripherally by a glass layer, is provided on opposite major faces with a composite metal layer comprising two metal sublayers separated by a sublayer of soft solder as a shock absorber, and is bonded by one major face to the heat sink, and has bonded to its other major face electrodes 108, 122, with upstanding portions 124, 126. The heat sink, which may be fixed to a cooling fin assembly, has an upstanding grooved flange 132 over which the header assembly 136 is fitted so that the flange projects through aperture 138 in the header and the central lead 142 fits in the groove 134 in the flange 132. Leads 140, 144 then contact flanges 124, 126 and are soldered thereto, lead 142 being soldered simultaneously to flange 132. The device is then encapsulated with a fluid impervious material such as a synthetic resin, rubber, or particulate dielectric, and the whole is enclosed in a moulded casing, Fig. 2, not shown. In an alternative embodiment, the lead 142 fits in a hole in flange 132, Fig. 14 (not shown). In further embodiments the leads are supported by a solid block header assembly which fits on to the heat sink by a tab and slot arrangement, Fig. 15 (not shown), or are supported rigidly by parallel strips which are removed after encapsulation thus dispensing with the need for a header assembly, Fig. 13 (not shown).
GB59854/69A
1968-12-09
1969-12-08
Semiconductor devices and methods for their fabrication
Expired
GB1292636A
(en)
Applications Claiming Priority (3)
Application Number
Priority Date
Filing Date
Title
US78208368A
1968-12-09
1968-12-09
US78208468A
1968-12-09
1968-12-09
US78218368A
1968-12-09
1968-12-09
Publications (1)
Publication Number
Publication Date
GB1292636A
true
GB1292636A
(en)
1972-10-11
Family
ID=27419773
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB59854/69A
Expired
GB1292636A
(en)
1968-12-09
1969-12-08
Semiconductor devices and methods for their fabrication
Country Status (5)
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Link
US
(2)
US3601667A
(en)
BE
(3)
BE742698A
(en)
DE
(2)
DE1961077A1
(en)
FR
(3)
FR2025720A1
(en)
GB
(1)
GB1292636A
(en)
Families Citing this family (20)
* Cited by examiner, † Cited by third party
Publication number
Priority date
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Title
US3849187A
(en)
*
1970-03-08
1974-11-19
Dexter Corp
Encapsulant compositions for semiconductors
FR2102512A5
(en)
*
1970-08-06
1972-04-07
Liaison Electr Silec
DE2107786C3
(en)
*
1971-02-18
1983-01-27
N.V. Philips’ Gloeilampenfabrieken, 5621 Eindhoven
Semiconductor component
JPS5116264B2
(en)
*
1971-10-01
1976-05-22
SE375881B
(en)
*
1972-11-17
1975-04-28
Asea Ab
US3832606A
(en)
*
1973-02-15
1974-08-27
Gen Motors Corp
Semiconductor diode package with protection fuse
US4190735A
(en)
*
1978-03-08
1980-02-26
Rca Corporation
Semiconductor device package
US4270138A
(en)
*
1979-03-02
1981-05-26
General Electric Company
Enhanced thermal transfer package for a semiconductor device
FR2462024A1
(en)
*
1979-07-17
1981-02-06
Thomson Csf
CONNECTION GRID SUPPORT PLATFORM, IN PARTICULAR FOR AN INTEGRATED CIRCUIT BOX, AND HOUSING COMPRISING SUCH A PLATFORM
DE2944180A1
(en)
*
1979-11-02
1981-05-07
Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt
METHOD FOR PRODUCING AN INSULATION LAYER COVERING A SEMICONDUCTOR BODY ON ONE SIDE
JPS5778173A
(en)
*
1980-11-04
1982-05-15
Hitachi Ltd
Semiconductor device and manufacture thereof
JPS5817626A
(en)
*
1981-07-13
1983-02-01
フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン
Method of mounting low temperature die
GB2102833B
(en)
*
1981-07-31
1984-08-01
Philips Electronic Associated
Lead-indium-silver alloy for use in semiconductor devices
US4818812A
(en)
*
1983-08-22
1989-04-04
International Business Machines Corporation
Sealant for integrated circuit modules, polyester suitable therefor and preparation of polyester
DE4143240A1
(en)
*
1991-10-30
1993-05-06
Stucki Kunststoffwerk Und Werkzeugbau Gmbh, 4902 Bad Salzuflen, De
TRANSPORT BOX
TW451535B
(en)
*
1998-09-04
2001-08-21
Sony Corp
Semiconductor device and package, and fabrication method thereof
US20070039826A1
(en)
*
2005-08-18
2007-02-22
Chia-Hua Chang
Thickening method of an electroforming shim
US8363861B2
(en)
*
2009-03-20
2013-01-29
Brian Hughes
Entertainment system for use during the operation of a magnetic resonance imaging device
JP2012199436A
(en)
*
2011-03-22
2012-10-18
Toshiba Corp
Semiconductor device and manufacturing method of the same
US9035448B2
(en)
*
2012-06-29
2015-05-19
Materion Corporation
Semiconductor packages having metal composite base plates
Family Cites Families (3)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
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Title
US3283224A
(en)
*
1965-08-18
1966-11-01
Trw Semiconductors Inc
Mold capping semiconductor device
DE1614364C3
(en)
*
1966-06-01
1979-04-05
Rca Corp., New York, N.Y. (V.St.A.)
Method for assembling a semiconductor crystal element
US3500136A
(en)
*
1968-01-24
1970-03-10
Int Rectifier Corp
Contact structure for small area contact devices
1968
1968-12-09
US
US782183A
patent/US3601667A/en
not_active
Expired – Lifetime
1968-12-09
US
US782083A
patent/US3559002A/en
not_active
Expired – Lifetime
1969
1969-12-05
BE
BE742698D
patent/BE742698A/xx
unknown
1969-12-05
BE
BE742701D
patent/BE742701A/xx
unknown
1969-12-05
DE
DE19691961077
patent/DE1961077A1/en
active
Pending
1969-12-05
BE
BE742699D
patent/BE742699A/xx
unknown
1969-12-06
DE
DE19691961314
patent/DE1961314A1/en
active
Pending
1969-12-08
GB
GB59854/69A
patent/GB1292636A/en
not_active
Expired
1969-12-09
FR
FR6942568A
patent/FR2025720A1/fr
not_active
Withdrawn
1969-12-09
FR
FR6942565A
patent/FR2025717A1/fr
not_active
Withdrawn
1969-12-09
FR
FR6942567A
patent/FR2025719A1/en
not_active
Withdrawn
Also Published As
Publication number
Publication date
FR2025719A1
(en)
1970-09-11
US3559002A
(en)
1971-01-26
BE742699A
(en)
1970-06-05
BE742698A
(en)
1970-06-05
DE1961314A1
(en)
1971-01-14
FR2025720A1
(en)
1970-09-11
US3601667A
(en)
1971-08-24
FR2025717A1
(en)
1970-09-11
DE1961077A1
(en)
1970-06-18
BE742701A
(en)
1970-06-05
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Legal Events
Date
Code
Title
Description
1973-02-21
PS
Patent sealed [section 19, patents act 1949]
1980-07-23
PCNP
Patent ceased through non-payment of renewal fee
