GB1375121A – – Google Patents
GB1375121A – – Google Patents
Info
Publication number
GB1375121A
GB1375121A
GB5493372A
GB5493372A
GB1375121A
GB 1375121 A
GB1375121 A
GB 1375121A
GB 5493372 A
GB5493372 A
GB 5493372A
GB 5493372 A
GB5493372 A
GB 5493372A
GB 1375121 A
GB1375121 A
GB 1375121A
Authority
GB
United Kingdom
Prior art keywords
detector
mirror
information
scanning
circuit board
Prior art date
1972-05-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5493372A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1972-05-01
Filing date
1972-11-28
Publication date
1974-11-27
1972-11-28
Application filed
filed
Critical
1974-11-27
Publication of GB1375121A
publication
Critical
patent/GB1375121A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
G—PHYSICS
G01—MEASURING; TESTING
G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
G01N25/00—Investigating or analyzing materials by the use of thermal means
G01N25/72—Investigating presence of flaws
G—PHYSICS
G01—MEASURING; TESTING
G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R31/28—Testing of electronic circuits, e.g. by signal tracer
G01R31/302—Contactless testing
G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
Abstract
1375121 Measuring infrared radiation distribution VANZETTI INFRARED & COMPUTER SYSTEMS Inc 28 Nov 1972 [1 May 1972] 54933/72 Heading G1A A device having a plurality of I.R. radiating elements, or having a plurality of points at which I.R. measurements are to be made after activation by the injection of thermal energy by a coherent radiation source, is inspected by a system utilizing means to displace the device and to scan the field of view of an I.R. detector to provide co-ordinate scanning of the device, means for converting the output of the detector into machine readable information, and a memory sorting a standard profile of I.R. information which is compared with the information obtained from the device. As shown, Fig. 1, a printed circuit board 18 is mounted on a carriage 22 driven by a stepping motor 36 and is scanned transversely by means of a mirror 46 rotated by a torque motor 64 to direct radiation via a flat mirror 58 and a parabolic mirror 54 to an I.R. detector 48 which may be provided with a liquid N cooling system. The output of the detector is filtered and converted to a digital form form for subsequent processing. The torque motor 64 is provided with a shaft encoder 66 and the apparatus is connected to a computer which is programmed to control the scanning of the circuit board and to record the output of the detector at predetermined points, identified by their co-ordinates, corresponding to the locations of the individual components on the board. Two black body I.R. sources 38, 40 are fixed at the ends of the scan across the circuit board to provide reference levels which may be used to adjust the gain of the detector circuit. The mirror 46 may be of the polygonal type. The circuit board is powered during the test and boards awaiting test may also be powered to allow them to achieve thermal equilibrium. The recorded data is compared with stored standard data and an output is provided which may be in the form of a list of deviations from the norm or a complete side-by-side listing of the measurements and the standard data for comparison by the operator. The stored data may be obtained by listing the co-ordinates of the components on the board and the scanning a number of standard boards to obtain the normal I.R. radiation values at these points. This information may then be recorded on punched tape for use in subsequent testing of similar devices for which purpose the information is fed back in to the computer memory from the punched tape. The scanning system may be arranged to provide measurements in polar instead of cartesian co-ordinates. The system may also be applied to the testing of other objects (e.g. for integrity of bonding), by locally heating them by means of a laser beam. The laser beam may be scanned across the object immediately before the detector scan by reflecting the beam from the rotating mirror while it is turned away from the detector.
GB5493372A
1972-05-01
1972-11-28
Expired
GB1375121A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US00249058A
US3803413A
(en)
1972-05-01
1972-05-01
Infrared non-contact system for inspection of infrared emitting components in a device
Publications (1)
Publication Number
Publication Date
GB1375121A
true
GB1375121A
(en)
1974-11-27
Family
ID=22941884
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB5493372A
Expired
GB1375121A
(en)
1972-05-01
1972-11-28
Country Status (6)
Country
Link
US
(1)
US3803413A
(en)
JP
(1)
JPS4941855A
(en)
DE
(1)
DE2300436A1
(en)
FR
(1)
FR2186137A5
(en)
GB
(1)
GB1375121A
(en)
IT
(1)
IT976347B
(en)
Cited By (5)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
EP0105078A1
(en)
*
1982-09-30
1984-04-11
Vanzetti Systems, Inc.
Fiber optic scanning system for laser/thermal inspection
EP0265417A2
(en)
*
1986-10-17
1988-04-27
VOEST-ALPINE Eisenbahnsysteme Gesellschaft m.b.H.
Detecting device for unacceptably heated wheel bearings and/or tyres
GB2358466A
(en)
*
2000-01-18
2001-07-25
Cindy Maria Marcella Motmans
Testing interconnections in an electronic circuit assembly by thermal conduction detection.
DE102010053766A1
(en)
2010-12-08
2012-06-14
Acculogic Corporation
Test apparatus for thermal testing of unpopulated/populated printed circuit board electrically energized with electrical or electronic components such as integrated circuit, has pyrometric sensor moved for purpose of scanning
US8836354B2
(en)
2010-10-21
2014-09-16
Acculogic Corporation
Apparatus for thermal testing of a printed circuit board
Families Citing this family (56)
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Priority date
Publication date
Assignee
Title
JPS53121451U
(en)
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1977-03-07
1978-09-27
JPS5686367A
(en)
*
1979-12-14
1981-07-14
Nec Corp
Measuring method for characteristic of electronic circuit
JPS5798847A
(en)
*
1980-12-11
1982-06-19
Nec Corp
X-ray diffractometer
US4454585A
(en)
*
1981-05-28
1984-06-12
Ele John H
Printed wiring board inspection, work logging and information system
EP0089760B1
(en)
*
1982-03-18
1987-08-12
United Kingdom Atomic Energy Authority
Transient thermography
JPS5950349A
(en)
*
1982-09-16
1984-03-23
Shinku Riko Kk
Thermal constant measuring device
DE3303140A1
(en)
*
1983-01-31
1984-08-02
Bruker Analytische Meßtechnik GmbH, 7512 Rheinstetten
INFRARED SPECTROMETER
EP0129508B1
(en)
*
1983-05-25
1987-01-21
Battelle Memorial Institute
Examining and testing method of an electric device of the integrated or printed circuit type
JPS59218938A
(en)
*
1983-05-27
1984-12-10
Fujitsu Ltd
Method for testing wiring pattern of printed board
GB8422873D0
(en)
*
1984-09-11
1984-10-17
Secr Defence
Static stress measurement in object
US4644162A
(en)
*
1984-09-20
1987-02-17
General Electric Company
Cooling hole inspection
US4698587A
(en)
*
1985-03-28
1987-10-06
The United States Of America As Represented By The Secretary Of The Air Force
Method of characterizing critical timing paths and analyzing timing related failure modes in very large scale integrated circuits
EP0209650A3
(en)
*
1985-06-07
1989-07-05
Vanzetti Systems, Inc.
Method and apparatus for placing and electrically connecting components on a printed circuit board
JPS62134568A
(en)
*
1985-12-09
1987-06-17
Nippon Atom Ind Group Co Ltd
Apparatus for diagnosing deterioration of electronic circuit board
US4792683A
(en)
*
1987-01-16
1988-12-20
Hughes Aircraft Company
Thermal technique for simultaneous testing of circuit board solder joints
US4782299A
(en)
*
1987-03-09
1988-11-01
Itt Avionics, A Division Of Itt Corporation
Methods of arc and corona monitoring for high voltage generators
DE3722715A1
(en)
*
1987-07-09
1989-01-26
Siemens Ag
Method for checking the fitting of capacitors to circuit boards
US4814870A
(en)
*
1987-08-05
1989-03-21
Compix Incorporated
Portable infrared imaging apparatus
DE3813258A1
(en)
*
1988-04-20
1989-11-02
Siemens Ag
Method for the non-contact testing and non-destructive testing of absorptive materials, and device for carrying it out
US4854162A
(en)
*
1988-06-27
1989-08-08
Ford Motor Company
Method of locating friction generating defects in a multiple bearing assembly
US5208528A
(en)
*
1989-01-19
1993-05-04
Bull S.A.
Method for inspecting a populated printed circuit board, particularly for inspecting solder joints on the board and a system for working this method
DE3913474A1
(en)
*
1989-04-24
1990-10-25
Siemens Ag
PHOTOTHERMAL EXAMINATION METHOD, DEVICE FOR IMPLEMENTING IT AND USE OF THE METHOD
US4999499A
(en)
*
1989-09-21
1991-03-12
General Dynamics Corporation
Method of inspecting solder joints with a laser inspection system
US5264819A
(en)
*
1990-12-12
1993-11-23
Electric Power Research Institute, Inc.
High energy zinc oxide varistor
JPH0734367Y2
(en)
*
1991-11-14
1995-08-02
工業技術院長
Absorption center detector for infrared optical materials
US5407275A
(en)
*
1992-03-31
1995-04-18
Vlsi Technology, Inc.
Non-destructive test for inner lead bond of a tab device
US5246291A
(en)
*
1992-06-01
1993-09-21
Motorola, Inc.
Bond inspection technique for a semiconductor chip
US5580471A
(en)
*
1994-03-30
1996-12-03
Panasonic Technologies, Inc.
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JP3163909B2
(en)
*
1994-08-19
2001-05-08
株式会社富士通ゼネラル
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US5562842A
(en)
*
1994-10-17
1996-10-08
Panasonic Technologies, Inc.
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US5509597A
(en)
*
1994-10-17
1996-04-23
Panasonic Technologies, Inc.
Apparatus and method for automatic monitoring and control of a soldering process
US5504017A
(en)
*
1994-12-20
1996-04-02
Advanced Micro Devices, Inc.
Void detection in metallization patterns
US5733041A
(en)
*
1995-10-31
1998-03-31
General Electric Company
Methods and apparatus for electrical connection inspection
DE19542534C1
(en)
*
1995-11-15
1997-02-27
Phototherm Dr Petry Gmbh
Induced heat radiation generating and detecting apparatus radiation
EP0851221A1
(en)
*
1996-12-23
1998-07-01
European Atomic Energy Community (Euratom)
Measuring head for use in radiant energy flash measuring of the thermal diffusivity of heterogeneous samples
US5808303A
(en)
*
1997-01-29
1998-09-15
Art Aerospace Research Technologies Inc.
Infrared screening and inspection system
US6096997A
(en)
*
1997-08-29
2000-08-01
Trw Inc.
Method of assembling an igniter including infrared testing of heating element and welds
US6089750A
(en)
*
1997-09-30
2000-07-18
Sumitomo Electric Industries, Ltd.
Noncontact temperature distribution measuring apparatus
US6294923B1
(en)
*
1998-12-07
2001-09-25
Advanced Micro Devices, Inc.
Method and system for detecting faults utilizing an AC power supply
US6320895B1
(en)
*
1999-03-08
2001-11-20
Trw Inc.
Resonant galvanometer driven two dimensional gain scanner
US6340817B1
(en)
*
1999-04-23
2002-01-22
Creo S.R.L.
Inspection method for unpopulated printed circuit boards
GB0004214D0
(en)
*
2000-02-23
2000-04-12
Gibbs Leo M
Method and apparatus for isolated thermal fault finding in electronic components
US6812047B1
(en)
*
2000-03-08
2004-11-02
Boxer Cross, Inc.
Evaluating a geometric or material property of a multilayered structure
AU2002214889A1
(en)
*
2000-12-11
2002-06-24
Art Advanced Research Technologies, Inc / Art Recherches Et Technologies Avancees, Inc.
Method and apparatus for detection of defects using localized heat injection of short laser pulses
US6911349B2
(en)
*
2001-02-16
2005-06-28
Boxer Cross Inc.
Evaluating sidewall coverage in a semiconductor wafer
US6971791B2
(en)
*
2002-03-01
2005-12-06
Boxer Cross, Inc
Identifying defects in a conductive structure of a wafer, based on heat transfer therethrough
US6958814B2
(en)
*
2002-03-01
2005-10-25
Applied Materials, Inc.
Apparatus and method for measuring a property of a layer in a multilayered structure
US6963393B2
(en)
*
2002-09-23
2005-11-08
Applied Materials, Inc.
Measurement of lateral diffusion of diffused layers
US6878559B2
(en)
*
2002-09-23
2005-04-12
Applied Materials, Inc.
Measurement of lateral diffusion of diffused layers
US7026175B2
(en)
*
2004-03-29
2006-04-11
Applied Materials, Inc.
High throughput measurement of via defects in interconnects
DE102005002189B4
(en)
*
2005-01-17
2007-02-15
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Device for determining the angular position of a light beam and method for operating a device for determining the angular position of a light beam
US7989769B2
(en)
*
2008-08-21
2011-08-02
Rockwell Automation Technologies, Inc.
In-cabinet thermal monitoring method and system
US7859276B1
(en)
2008-12-02
2010-12-28
Lockheed Martin Corporation
Non-destructive validation of semiconductor devices
US9250134B2
(en)
*
2013-09-23
2016-02-02
Thermal Wave Imaging, Inc.
Nondestructive testing active thermography system and method for utilizing the same
US9546907B2
(en)
*
2014-04-18
2017-01-17
Quantum Focus Instruments Corporation
Dynamic differential thermal measurement systems and methods
US11525736B2
(en)
2020-01-15
2022-12-13
International Business Machines Corporation
Temperature monitoring for printed circuit board assemblies during mass soldering
1972
1972-05-01
US
US00249058A
patent/US3803413A/en
not_active
Expired – Lifetime
1972-11-28
GB
GB5493372A
patent/GB1375121A/en
not_active
Expired
1972-12-29
IT
IT71281/72A
patent/IT976347B/en
active
1973
1973-01-05
DE
DE2300436A
patent/DE2300436A1/en
active
Pending
1973-02-26
FR
FR7306786A
patent/FR2186137A5/fr
not_active
Expired
1973-05-01
JP
JP48047693A
patent/JPS4941855A/ja
active
Pending
Cited By (7)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
EP0105078A1
(en)
*
1982-09-30
1984-04-11
Vanzetti Systems, Inc.
Fiber optic scanning system for laser/thermal inspection
EP0265417A2
(en)
*
1986-10-17
1988-04-27
VOEST-ALPINE Eisenbahnsysteme Gesellschaft m.b.H.
Detecting device for unacceptably heated wheel bearings and/or tyres
EP0265417A3
(en)
*
1986-10-17
1990-08-08
VOEST-ALPINE Eisenbahnsysteme Gesellschaft m.b.H.
Detecting device for unacceptably heated wheel bearings and/or tyres
GB2358466A
(en)
*
2000-01-18
2001-07-25
Cindy Maria Marcella Motmans
Testing interconnections in an electronic circuit assembly by thermal conduction detection.
US8836354B2
(en)
2010-10-21
2014-09-16
Acculogic Corporation
Apparatus for thermal testing of a printed circuit board
DE102010053766A1
(en)
2010-12-08
2012-06-14
Acculogic Corporation
Test apparatus for thermal testing of unpopulated/populated printed circuit board electrically energized with electrical or electronic components such as integrated circuit, has pyrometric sensor moved for purpose of scanning
DE102010053766B4
(en)
2010-12-08
2019-05-23
Acculogic Corporation
Apparatus for thermal testing of printed circuit boards
Also Published As
Publication number
Publication date
US3803413A
(en)
1974-04-09
FR2186137A5
(en)
1974-01-04
JPS4941855A
(en)
1974-04-19
IT976347B
(en)
1974-08-20
DE2300436A1
(en)
1973-11-22
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Legal Events
Date
Code
Title
Description
1975-04-09
PS
Patent sealed [section 19, patents act 1949]
1988-07-20
PCNP
Patent ceased through non-payment of renewal fee
