GB1439179A – Dielectric sheets
– Google Patents
GB1439179A – Dielectric sheets
– Google Patents
Dielectric sheets
Info
Publication number
GB1439179A
GB1439179A
GB2547073A
GB2547073A
GB1439179A
GB 1439179 A
GB1439179 A
GB 1439179A
GB 2547073 A
GB2547073 A
GB 2547073A
GB 2547073 A
GB2547073 A
GB 2547073A
GB 1439179 A
GB1439179 A
GB 1439179A
Authority
GB
United Kingdom
Prior art keywords
conductive material
apertures
sheet
resist
face
Prior art date
1972-06-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2547073A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1972-06-14
Filing date
1973-05-29
Publication date
1976-06-09
1973-05-29
Application filed by Westinghouse Electric Corp
filed
Critical
Westinghouse Electric Corp
1976-06-09
Publication of GB1439179A
publication
Critical
patent/GB1439179A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/0011—Working of insulating substrates or insulating layers
H05K3/0017—Etching of the substrate by chemical or physical means
H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
H05K3/146—By vapour deposition
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/02—Details
H05K1/03—Use of materials for the substrate
H05K1/0393—Flexible materials
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/01—Dielectrics
H05K2201/0137—Materials
H05K2201/0154—Polyimide
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/09—Shape and layout
H05K2201/09209—Shape and layout details of conductors
H05K2201/095—Conductive through-holes or vias
H05K2201/09509—Blind vias, i.e. vias having one side closed
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/05—Patterning and lithography; Masks; Details of resist
H05K2203/0548—Masks
H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Abstract
1439179 Printed circuits WESTING- HOUSE ELECTRIC CORP 29 May 1973 [14 June 1972] 25470/73 Heading H1R The basis for a printed circuit is formed from a dielectric sheet by coating both faces with conductive material by electron beam evaporation, applying photo-resist to the coated faces, forming apertures in the resist by photographic exposure and development, and then etching the thus exposed conductive material and subsequently the underlying dielectric by treatment in etchants specific to the respective materials, the areas of conductive material opposite the apertures remaining masked during the etching treatments so that one end of each etched hole is bridged by conductive material. As described the starting sheet, which is 5 mils thick and of polyimide, contains a number of small holes with larger holes punched in the corners. After conventional cleaning and degreasing the sheet is disposed with others on a frame which is rotated above an electron bombarded source of aluminium or copper in such a way that the metal lines the apertures to provide connections and uniformly coats the surfaces. The photoresist, which also serves to block the lined holes, is exposed through masks applied to it to expose the metal in two rows of circular areas at one edge of one face and two rows of square areas at the opposite edge of the other face. Successive immersions in a phosphoric-nitricacetic mix and hydrazine remove the exposed aluminium and polyimide respectively to yield the structure shown in cross-section in Fig. 18. The metal 129 on one face is patterned by etching through further photo-resist masking to form a pattern of conductors the ends of which overhang the edges of the larger apertures to engage bonding pads of device chips located therein, and the sheet secured by ultrasonic or thermo-compression bonding to conductive layer 131 at the bases of the smaller holes to a metallized alumina substrate.
GB2547073A
1972-06-14
1973-05-29
Dielectric sheets
Expired
GB1439179A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US26287172A
1972-06-14
1972-06-14
Publications (1)
Publication Number
Publication Date
GB1439179A
true
GB1439179A
(en)
1976-06-09
Family
ID=22999424
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB2547073A
Expired
GB1439179A
(en)
1972-06-14
1973-05-29
Dielectric sheets
Country Status (6)
Country
Link
JP
(1)
JPS4956175A
(en)
DE
(1)
DE2329380A1
(en)
FR
(1)
FR2188401B1
(en)
GB
(1)
GB1439179A
(en)
NL
(1)
NL7308181A
(en)
SE
(1)
SE403880B
(en)
Families Citing this family (3)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US4091138A
(en)
*
1975-02-12
1978-05-23
Sumitomo Bakelite Company Limited
Insulating film, sheet, or plate material with metallic coating and method for manufacturing same
US4501638A
(en)
*
1983-12-05
1985-02-26
E. I. Du Pont De Nemours And Company
Liquid chemical process for forming conductive through-holes through a dielectric layer
US4517050A
(en)
*
1983-12-05
1985-05-14
E. I. Du Pont De Nemours And Company
Process for forming conductive through-holes through a dielectric layer
Family Cites Families (1)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB1134632A
(en)
*
1965-02-13
1968-11-27
Elliott Brothers London Ltd
Improvements in or relating to the production of printed circuits
1973
1973-05-29
GB
GB2547073A
patent/GB1439179A/en
not_active
Expired
1973-06-08
DE
DE19732329380
patent/DE2329380A1/en
active
Pending
1973-06-13
NL
NL7308181A
patent/NL7308181A/xx
unknown
1973-06-13
SE
SE7308355A
patent/SE403880B/en
unknown
1973-06-14
FR
FR7321599A
patent/FR2188401B1/fr
not_active
Expired
1973-06-14
JP
JP6641873A
patent/JPS4956175A/ja
active
Pending
Also Published As
Publication number
Publication date
SE403880B
(en)
1978-09-04
JPS4956175A
(en)
1974-05-31
NL7308181A
(en)
1973-12-18
FR2188401A1
(en)
1974-01-18
DE2329380A1
(en)
1974-01-03
AU5577373A
(en)
1974-11-21
FR2188401B1
(en)
1978-02-10
Similar Documents
Publication
Publication Date
Title
US3849136A
(en)
1974-11-19
Masking of deposited thin films by use of a masking layer photoresist composite
US4312897A
(en)
1982-01-26
Buried resist technique for the fabrication of printed wiring
GB829789A
(en)
1960-03-09
Process of making improved printed wiring boards
US4978423A
(en)
1990-12-18
Selective solder formation on printed circuit boards
US3745094A
(en)
1973-07-10
Two resist method for printed circuit structure
US3772101A
(en)
1973-11-13
Landless plated-through hole photoresist making process
US3960561A
(en)
1976-06-01
Method for making electrical lead frame devices
US4394223A
(en)
1983-07-19
Tin and gold plating process
GB1441781A
(en)
1976-07-07
Electric circuit fabrication
US3700443A
(en)
1972-10-24
Flatpack lead positioning device
US3829316A
(en)
1974-08-13
Method for the preparation of metallic layers on a substrate
US6130027A
(en)
2000-10-10
Process for producing lead frames
GB1439179A
(en)
1976-06-09
Dielectric sheets
JPH01266786A
(en)
1989-10-24
Construction of conductor of hybrid integrated circuit and its manufacture
GB1077224A
(en)
1967-07-26
Method and apparatus for attaching an electrical component to a circuit
JPS61144396A
(en)
1986-07-02
Screen plate-making
US3880723A
(en)
1975-04-29
Method of making substrates for microwave microstrip circuits
JPH06268355A
(en)
1994-09-22
Printed wiring board and manufacture thereof
JPH05335719A
(en)
1993-12-17
Manufacture of wiring substrate
US5464725A
(en)
1995-11-07
Method of manufacturing a printed wiring board
JP4252227B2
(en)
2009-04-08
Manufacturing method of double-sided flexible circuit board
JPS5649541A
(en)
1981-05-06
Multilayer wiring structure for integrated circuit
JP2664409B2
(en)
1997-10-15
Manufacturing method of hybrid integrated circuit
JPH0537128A
(en)
1993-02-12
Manufacture of wiring substrate
JPH06252529A
(en)
1994-09-09
Manufacture of printed wiring board
Legal Events
Date
Code
Title
Description
1976-10-27
PS
Patent sealed
1979-01-04
PCNP
Patent ceased through non-payment of renewal fee
