GB1462001A – Method of electrolytically nodularizing a metal surface
– Google Patents
GB1462001A – Method of electrolytically nodularizing a metal surface
– Google Patents
Method of electrolytically nodularizing a metal surface
Info
Publication number
GB1462001A
GB1462001A
GB12675A
GB12675A
GB1462001A
GB 1462001 A
GB1462001 A
GB 1462001A
GB 12675 A
GB12675 A
GB 12675A
GB 12675 A
GB12675 A
GB 12675A
GB 1462001 A
GB1462001 A
GB 1462001A
Authority
GB
United Kingdom
Prior art keywords
bath
plated
nodular
gpl
jan
Prior art date
1974-01-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB12675A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Inc
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1974-01-07
Filing date
1975-01-02
Publication date
1977-01-19
1975-01-02
Application filed by Gould Inc
filed
Critical
Gould Inc
1977-01-19
Publication of GB1462001A
publication
Critical
patent/GB1462001A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
C—CHEMISTRY; METALLURGY
C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
C25D3/00—Electroplating: Baths therefor
C25D3/02—Electroplating: Baths therefor from solutions
C25D3/38—Electroplating: Baths therefor from solutions of copper
C—CHEMISTRY; METALLURGY
C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
C25D5/60—Electroplating characterised by the structure or texture of the layers
C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/03—Conductive materials
H05K2201/0332—Structure of the conductor
H05K2201/0335—Layered conductors or foils
H05K2201/0355—Metal foils
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/03—Metal processing
H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
H05K2203/0703—Plating
H05K2203/0723—Electroplating, e.g. finish plating
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
Abstract
1462001 Nodular copper electro-plate; zincate-treating aluminium GOULD Inc 2 Jan 1975 [7 Jan 1974] 126/75 Headings C7B and C7F A nodular Cu layer is plated on a metal substrate from an acidic bath of pH<1 containing 5-70 gpl Cu, 3-50 gpl NO 3 at 22-50‹C and a cathode c.d. of 50-300 ASF for 10-180 seconds. The bath may contain H 2 SO 4 and the NO 3 be associated with Cu, Na, K or NH 4 . The substrate may be Cu, an alloy thereof or Ni. A subsequent layer of Zn, In, brass, Ni, Co, Cr or stainless steel may be applied. In examples Al foil is Cu plated with a pyrophosphate or CN bath, nodular plated as above, chemically or mechanically stripped off the Al and finally built up to 1.4 mil thickness on its rear surface using the first bath. The Al may be zincated before Cu plating to facilitate chemical stripping thereof, using a bath containing NaOH, ZnO, Fe C13 and Rochelle salt.
GB12675A
1974-01-07
1975-01-02
Method of electrolytically nodularizing a metal surface
Expired
GB1462001A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US43134274A
1974-01-07
1974-01-07
Publications (1)
Publication Number
Publication Date
GB1462001A
true
GB1462001A
(en)
1977-01-19
Family
ID=23711503
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB12675A
Expired
GB1462001A
(en)
1974-01-07
1975-01-02
Method of electrolytically nodularizing a metal surface
Country Status (6)
Country
Link
JP
(1)
JPS5756558B2
(en)
CA
(1)
CA1044636A
(en)
DE
(1)
DE2500160C2
(en)
GB
(1)
GB1462001A
(en)
LU
(1)
LU71602A1
(en)
SE
(1)
SE7500053L
(en)
Cited By (3)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US4846918A
(en)
*
1988-02-24
1989-07-11
Psi Star
Copper etching process and product with controlled nitrous acid reaction
EP0996318A2
(en)
*
1998-10-19
2000-04-26
Mitsui Mining & Smelting Co., Ltd.
Novel composite foil, process for producing the same and copper-clad laminate
EP0996319A2
(en)
*
1998-10-19
2000-04-26
Mitsui Mining & Smelting Co., Ltd.
Composite material used in making printed wiring boards
Families Citing this family (7)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US4169018A
(en)
*
1978-01-16
1979-09-25
Gould Inc.
Process for electroforming copper foil
US4468293A
(en)
*
1982-03-05
1984-08-28
Olin Corporation
Electrochemical treatment of copper for improving its bond strength
JPS58224059A
(en)
*
1982-06-22
1983-12-26
Tokai Rika Co Ltd
Die casting machine
US4515671A
(en)
*
1983-01-24
1985-05-07
Olin Corporation
Electrochemical treatment of copper for improving its bond strength
US5670033A
(en)
*
1993-04-19
1997-09-23
Electrocopper Products Limited
Process for making copper metal powder, copper oxides and copper foil
RU2126312C1
(en)
*
1993-04-19
1999-02-20
ЭлектроКуппер Продактс Лимитед
Method of producing metal powder, copper oxides and copper foil
US5366612A
(en)
*
1993-04-19
1994-11-22
Magma Copper Company
Process for making copper foil
Family Cites Families (1)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3857681A
(en)
*
1971-08-03
1974-12-31
Yates Industries
Copper foil treatment and products produced therefrom
1974
1974-12-18
CA
CA216,635A
patent/CA1044636A/en
not_active
Expired
1975
1975-01-02
GB
GB12675A
patent/GB1462001A/en
not_active
Expired
1975-01-03
DE
DE2500160A
patent/DE2500160C2/en
not_active
Expired
1975-01-03
SE
SE7500053A
patent/SE7500053L/xx
unknown
1975-01-07
JP
JP50004629A
patent/JPS5756558B2/ja
not_active
Expired
1975-01-07
LU
LU71602A
patent/LU71602A1/xx
unknown
Cited By (6)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US4846918A
(en)
*
1988-02-24
1989-07-11
Psi Star
Copper etching process and product with controlled nitrous acid reaction
EP0996318A2
(en)
*
1998-10-19
2000-04-26
Mitsui Mining & Smelting Co., Ltd.
Novel composite foil, process for producing the same and copper-clad laminate
EP0996319A2
(en)
*
1998-10-19
2000-04-26
Mitsui Mining & Smelting Co., Ltd.
Composite material used in making printed wiring boards
EP0996319A3
(en)
*
1998-10-19
2002-02-20
Mitsui Mining & Smelting Co., Ltd.
Composite material used in making printed wiring boards
EP0996318A3
(en)
*
1998-10-19
2002-02-20
Mitsui Mining & Smelting Co., Ltd.
Novel composite foil, process for producing the same and copper-clad laminate
US6548153B2
(en)
1998-10-19
2003-04-15
Mitsui Mining & Smelting Co., Ltd.
Composite material used in making printed wiring boards
Also Published As
Publication number
Publication date
DE2500160C2
(en)
1982-12-23
SE7500053L
(en)
1975-07-08
CA1044636A
(en)
1978-12-19
JPS50101234A
(en)
1975-08-11
JPS5756558B2
(en)
1982-11-30
DE2500160A1
(en)
1975-07-17
LU71602A1
(en)
1975-06-17
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Legal Events
Date
Code
Title
Description
1977-06-01
PS
Patent sealed [section 19, patents act 1949]
1994-08-31
PCNP
Patent ceased through non-payment of renewal fee
Effective date:
19940102
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