GB1462241A – Thin film deposition apparatus using segmented target means
– Google Patents
GB1462241A – Thin film deposition apparatus using segmented target means
– Google Patents
Thin film deposition apparatus using segmented target means
Info
Publication number
GB1462241A
GB1462241A
GB64374A
GB64374A
GB1462241A
GB 1462241 A
GB1462241 A
GB 1462241A
GB 64374 A
GB64374 A
GB 64374A
GB 64374 A
GB64374 A
GB 64374A
GB 1462241 A
GB1462241 A
GB 1462241A
Authority
GB
United Kingdom
Prior art keywords
series
drum
arcuate
targets
cooled
Prior art date
1973-01-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB64374A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coulter Information Systems Inc
Original Assignee
Coulter Information Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1973-01-12
Filing date
1974-01-07
Publication date
1977-01-19
1974-01-07
Application filed by Coulter Information Systems Inc
filed
Critical
Coulter Information Systems Inc
1977-01-19
Publication of GB1462241A
publication
Critical
patent/GB1462241A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
H01J37/32—Gas-filled discharge tubes
H01J37/32431—Constructional details of the reactor
H01J37/32733—Means for moving the material to be treated
H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
H01J37/32761—Continuous moving
H01J37/3277—Continuous moving of continuous material
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
C23C14/34—Sputtering
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
C23C14/54—Controlling or regulating the coating process
C23C14/541—Heating or cooling of the substrates
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
H01J37/32—Gas-filled discharge tubes
H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
H01J37/32—Gas-filled discharge tubes
H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
Abstract
1462241 Sputtering apparatus COULTER INFORMATION SYSTEMS Inc 7 Jan 1974 [12 Jan 1973] 00643/74 Heading C7F Sputtering apparatus comprises a plurality of cooled arcuate targets 64 forming a cylinder around a rotating drum 46, the substrate 54 (e.g. of plastics) in strip form being guided round the drum by rollers 58, 60, and coated by passing through zones 57. To prevent heating of the substrate by impingement of secondary electrons, a magnetic field is created by magnets 74, 78. The targets may be arcuate plates as shown, or may take the form of series of spaced rods on a cooled arcuate holder, Fig. 7 (not shown), series of spaced tubes having coolant passed therethrough, Fig. 8 (not shown), or by series of adjacent rectangular bars on a cooled arcuate holder, Fig. 9 (not shown). The targets may be all of the same material or may comprise different materials depending upon the desired coating. A series of sensors 70 monitor the conditions within the sputtering chamber. In modifications, the last target may be arranged tangentially to the drum, Fig. 4 (not shown), and a narrow substrate may make more than one revolution around the drum, Fig. 14 (not shown).
GB64374A
1973-01-12
1974-01-07
Thin film deposition apparatus using segmented target means
Expired
GB1462241A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US00322968A
US3829373A
(en)
1973-01-12
1973-01-12
Thin film deposition apparatus using segmented target means
Publications (1)
Publication Number
Publication Date
GB1462241A
true
GB1462241A
(en)
1977-01-19
Family
ID=23257231
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB64374A
Expired
GB1462241A
(en)
1973-01-12
1974-01-07
Thin film deposition apparatus using segmented target means
Country Status (9)
Country
Link
US
(1)
US3829373A
(en)
JP
(1)
JPS5747266B2
(en)
BE
(1)
BE809466A
(en)
CA
(1)
CA1016496A
(en)
CH
(1)
CH588565A5
(en)
DE
(1)
DE2400510C2
(en)
FR
(1)
FR2322666A1
(en)
GB
(1)
GB1462241A
(en)
NL
(1)
NL180604C
(en)
Cited By (3)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB2119817A
(en)
*
1982-05-12
1983-11-23
Dowty Electronics Ltd
Vacuum deposition apparatus
GB2150600A
(en)
*
1983-12-05
1985-07-03
Pilkington Brothers Plc
Improvements in or relating to coating apparatus
GB2265635A
(en)
*
1992-03-31
1993-10-06
Commissariat Energie Atomique
Cathodic sputtering device comprising at least four targets using plasma produced by microwaves
Families Citing this family (39)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3901784A
(en)
*
1973-11-15
1975-08-26
United Aircraft Corp
Cylindrical rf sputtering apparatus
US4026787A
(en)
*
1974-01-25
1977-05-31
Coulter Information Systems, Inc.
Thin film deposition apparatus using segmented target means
US4166018A
(en)
*
1974-01-31
1979-08-28
Airco, Inc.
Sputtering process and apparatus
US3904503A
(en)
*
1974-05-31
1975-09-09
Western Electric Co
Depositing material on a substrate using a shield
JPS5252133A
(en)
*
1975-07-11
1977-04-26
Tokuda Seisakusho
Continuous film coating apparatus
MX145314A
(en)
*
1975-12-17
1982-01-27
Coulter Systems Corp
IMPROVEMENTS TO A SPARKLING DEVICE TO PRODUCE ELECTROPHOTOGRAPHIC FILM
US4137142A
(en)
*
1977-12-27
1979-01-30
Stork Brabant B.V.
Method and apparatus for sputtering photoconductive coating on endless flexible belts or cylinders
US4151064A
(en)
*
1977-12-27
1979-04-24
Coulter Stork U.S.A., Inc.
Apparatus for sputtering cylinders
DE2845401C2
(en)
*
1978-10-18
1980-10-02
Gao Gesellschaft Fuer Automation Und Organisation Mbh, 8000 Muenchen
Printed security with authenticity features and procedures for checking its authenticity
JPS55100980A
(en)
*
1979-01-23
1980-08-01
Coulter Systems Corp
Sputtering device
US4455039A
(en)
*
1979-10-16
1984-06-19
Coulter Systems Corporation
Encoded security document
US4305801A
(en)
*
1980-04-16
1981-12-15
The United States Of America As Represented By The United States Department Of Energy
Line-of-sight deposition method
US4457825A
(en)
*
1980-05-16
1984-07-03
Varian Associates, Inc.
Sputter target for use in a sputter coating source
US4673480A
(en)
*
1980-05-16
1987-06-16
Varian Associates, Inc.
Magnetically enhanced sputter source
CA1193227A
(en)
*
1982-11-18
1985-09-10
Kovilvila Ramachandran
Magnetron sputtering apparatus
US4443318A
(en)
*
1983-08-17
1984-04-17
Shatterproof Glass Corporation
Cathodic sputtering apparatus
US4491509A
(en)
*
1984-03-09
1985-01-01
At&T Technologies, Inc.
Methods of and apparatus for sputtering material onto a substrate
US4560462A
(en)
*
1984-06-22
1985-12-24
Westinghouse Electric Corp.
Apparatus for coating nuclear fuel pellets with a burnable absorber
DE3628950A1
(en)
*
1986-08-26
1988-03-03
Grundig Emv
METHOD FOR PRODUCING A MAGNETIC HEAD
US5225057A
(en)
*
1988-02-08
1993-07-06
Optical Coating Laboratory, Inc.
Process for depositing optical films on both planar and non-planar substrates
US4851095A
(en)
*
1988-02-08
1989-07-25
Optical Coating Laboratory, Inc.
Magnetron sputtering apparatus and process
US5798027A
(en)
*
1988-02-08
1998-08-25
Optical Coating Laboratory, Inc.
Process for depositing optical thin films on both planar and non-planar substrates
US5618388A
(en)
*
1988-02-08
1997-04-08
Optical Coating Laboratory, Inc.
Geometries and configurations for magnetron sputtering apparatus
US4879017A
(en)
*
1988-11-29
1989-11-07
Dae Ryung Vacumm Co. Ltd.
Multi-rod type magnetron sputtering apparatus
US6024843A
(en)
*
1989-05-22
2000-02-15
Novellus Systems, Inc.
Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
KR930700695A
(en)
*
1990-06-16
1993-03-15
원본미기재
Metallization
US5262032A
(en)
*
1991-05-28
1993-11-16
Leybold Aktiengesellschaft
Sputtering apparatus with rotating target and target cooling
US6217716B1
(en)
1998-05-06
2001-04-17
Novellus Systems, Inc.
Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
JP2924891B1
(en)
*
1998-05-15
1999-07-26
日本電気株式会社
Sputtering equipment
US6669824B2
(en)
2000-07-10
2003-12-30
Unaxis Usa, Inc.
Dual-scan thin film processing system
US6495010B2
(en)
2000-07-10
2002-12-17
Unaxis Usa, Inc.
Differentially-pumped material processing system
DE10202311B4
(en)
*
2002-01-23
2007-01-04
Schott Ag
Apparatus and method for the plasma treatment of dielectric bodies
US6906008B2
(en)
*
2003-06-26
2005-06-14
Superpower, Inc.
Apparatus for consecutive deposition of high-temperature superconducting (HTS) buffer layers
US7169232B2
(en)
*
2004-06-01
2007-01-30
Eastman Kodak Company
Producing repetitive coatings on a flexible substrate
US7601246B2
(en)
*
2004-09-29
2009-10-13
Lam Research Corporation
Methods of sputtering a protective coating on a semiconductor substrate
KR20140106753A
(en)
*
2012-01-16
2014-09-03
울박, 인크
Film-forming apparatus
CN104350173A
(en)
*
2012-05-29
2015-02-11
应用材料公司
Method for coating substrate and coater
JP5868309B2
(en)
*
2012-12-21
2016-02-24
株式会社神戸製鋼所
Substrate transport roll
ES2937385T3
(en)
*
2017-06-22
2023-03-28
Bobst Manchester Ltd
PEPVD machine
Family Cites Families (5)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB367074A
(en)
*
1930-12-04
1932-02-18
Max Knoll
Improvements in and relating to the coating of materials
FR707671A
(en)
*
1930-12-04
1931-07-10
Process for obtaining coatings by cathodic sputtering
US2925062A
(en)
*
1953-05-15
1960-02-16
Heraeus Gmbh W C
Coating apparatus
GB1284224A
(en)
*
1968-12-12
1972-08-02
Edwards High Vacuum Int Ltd
Radio frequency sputtering apparatus
JPS5523916Y2
(en)
*
1974-08-15
1980-06-07
1973
1973-01-12
US
US00322968A
patent/US3829373A/en
not_active
Expired – Lifetime
1974
1974-01-07
DE
DE2400510A
patent/DE2400510C2/en
not_active
Expired
1974-01-07
BE
BE139582A
patent/BE809466A/en
not_active
IP Right Cessation
1974-01-07
JP
JP49005001A
patent/JPS5747266B2/ja
not_active
Expired
1974-01-07
CA
CA189,572A
patent/CA1016496A/en
not_active
Expired
1974-01-07
CH
CH22574A
patent/CH588565A5/xx
not_active
IP Right Cessation
1974-01-07
NL
NLAANVRAGE7400145,A
patent/NL180604C/en
not_active
IP Right Cessation
1974-01-07
GB
GB64374A
patent/GB1462241A/en
not_active
Expired
1974-01-07
FR
FR7400466A
patent/FR2322666A1/en
active
Granted
Cited By (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB2119817A
(en)
*
1982-05-12
1983-11-23
Dowty Electronics Ltd
Vacuum deposition apparatus
GB2150600A
(en)
*
1983-12-05
1985-07-03
Pilkington Brothers Plc
Improvements in or relating to coating apparatus
GB2265635A
(en)
*
1992-03-31
1993-10-06
Commissariat Energie Atomique
Cathodic sputtering device comprising at least four targets using plasma produced by microwaves
GB2265635B
(en)
*
1992-03-31
1995-06-28
Commissariat Energie Atomique
Cathodic sputtering device using a plasma produced by microwaves
Also Published As
Publication number
Publication date
NL180604C
(en)
1987-03-16
DE2400510A1
(en)
1974-07-18
NL7400145A
(en)
1974-07-16
FR2322666B1
(en)
1979-01-26
FR2322666A1
(en)
1977-04-01
JPS49101273A
(en)
1974-09-25
CA1016496A
(en)
1977-08-30
US3829373A
(en)
1974-08-13
NL180604B
(en)
1986-10-16
CH588565A5
(en)
1977-06-15
BE809466A
(en)
1974-07-08
JPS5747266B2
(en)
1982-10-08
DE2400510C2
(en)
1985-05-23
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Legal Events
Date
Code
Title
Description
1977-06-01
PS
Patent sealed [section 19, patents act 1949]
1993-09-01
PCNP
Patent ceased through non-payment of renewal fee
Effective date:
19930107
