GB1462253A

GB1462253A – Methods of depositing silicon dioxide layers on silicon substrates
– Google Patents

GB1462253A – Methods of depositing silicon dioxide layers on silicon substrates
– Google Patents
Methods of depositing silicon dioxide layers on silicon substrates

Info

Publication number
GB1462253A

GB1462253A
GB2219974A
GB2219974A
GB1462253A
GB 1462253 A
GB1462253 A
GB 1462253A
GB 2219974 A
GB2219974 A
GB 2219974A
GB 2219974 A
GB2219974 A
GB 2219974A
GB 1462253 A
GB1462253 A
GB 1462253A
Authority
GB
United Kingdom
Prior art keywords
reaction mixture
silicon dioxide
silicon
depositing
methods
Prior art date
1973-06-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Application number
GB2219974A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

International Business Machines Corp

Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1973-06-29
Filing date
1974-05-17
Publication date
1977-01-19

1974-05-17
Application filed by International Business Machines Corp
filed
Critical
International Business Machines Corp

1977-01-19
Publication of GB1462253A
publication
Critical
patent/GB1462253A/en

Status
Expired
legal-status
Critical
Current

Links

Espacenet

Global Dossier

Discuss

Classifications

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

H01L21/02104—Forming layers

H01L21/02107—Forming insulating materials on a substrate

H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates

H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer

H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon

H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2

C—CHEMISTRY; METALLURGY

C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL

C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL

C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes

C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material

C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides

C23C16/40—Oxides

C23C16/401—Oxides containing silicon

C23C16/402—Silicon dioxide

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

H01L21/02104—Forming layers

H01L21/02107—Forming insulating materials on a substrate

H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates

H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition

H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si

H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

H01L21/02104—Forming layers

H01L21/02107—Forming insulating materials on a substrate

H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer

H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process

H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase

H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer

H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials

H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 – H01L21/26

H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 – H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers

H01L21/314—Inorganic layers

H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass

H01L21/31604—Deposition from a gas or vapour

H01L21/31608—Deposition of SiO2

H01L21/31612—Deposition of SiO2 on a silicon body

Abstract

1462253 Silicon dioxide deposition INTERNATIONAL BUSINESS MACHINES CORP 17 May 1974 [29 June 1973] 22199/74 Heading C1A A method of depositing a silicon dioxide film on a silicon substrate by deposition from the vapour phase, comprises heating the silicon substrate (preferably to a temperature of at least 700 C.) in a gaseous reaction mixture comprising an oxidizing agent, hydrogen chloride, and a compound of formula SiH n Cl 4-n , where n is an integer from 0 to 4. Preferably, the oxidising agent is carbon dioxide, the hydrogen chloride is present in a concentration of from 0À1 to 3À0 mole per cent of the reaction mixture, and the reaction mixture comprises additionally hydrogen as a carrier gas.

GB2219974A
1973-06-29
1974-05-17
Methods of depositing silicon dioxide layers on silicon substrates

Expired

GB1462253A
(en)

Applications Claiming Priority (1)

Application Number
Priority Date
Filing Date
Title

US375297A

US3887726A
(en)

1973-06-29
1973-06-29
Method of chemical vapor deposition to provide silicon dioxide films with reduced surface state charge on semiconductor substrates

Publications (1)

Publication Number
Publication Date

GB1462253A
true

GB1462253A
(en)

1977-01-19

Family
ID=23480303
Family Applications (1)

Application Number
Title
Priority Date
Filing Date

GB2219974A
Expired

GB1462253A
(en)

1973-06-29
1974-05-17
Methods of depositing silicon dioxide layers on silicon substrates

Country Status (7)

Country
Link

US
(1)

US3887726A
(en)

JP
(1)

JPS5240639B2
(en)

CA
(1)

CA1027024A
(en)

DE
(1)

DE2422970C3
(en)

FR
(1)

FR2235486B1
(en)

GB
(1)

GB1462253A
(en)

IT
(1)

IT1012363B
(en)

Cited By (4)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

GB2182061A
(en)

*

1985-10-24
1987-05-07
Rca Corp
Vapor deposition apparatus

GB2212173A
(en)

*

1987-11-11
1989-07-19
Sumitomo Chemical Co
Heated reactor for vapor-phase growth of films

GB2234264A
(en)

*

1989-06-19
1991-01-30
Glaverbel
Pyrolytically forming an oxide coating on a hot glass substrate by pre-mixing reactants

US5221352A
(en)

*

1989-06-19
1993-06-22
Glaverbel
Apparatus for pyrolytically forming an oxide coating on a hot glass substrate

Families Citing this family (4)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

JPS5922380B2
(en)

*

1975-12-03
1984-05-26
株式会社東芝

Handout Taisoshino Seizouhouhou

US4045594A
(en)

*

1975-12-31
1977-08-30
Ibm Corporation
Planar insulation of conductive patterns by chemical vapor deposition and sputtering

US4239811A
(en)

*

1979-08-16
1980-12-16
International Business Machines Corporation
Low pressure chemical vapor deposition of silicon dioxide with oxygen enhancement of the chlorosilane-nitrous oxide reaction

US4950977A
(en)

*

1988-12-21
1990-08-21
At&T Bell Laboratories
Method of measuring mobile ion concentration in semiconductor devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

US3511702A
(en)

*

1965-08-20
1970-05-12
Motorola Inc
Epitaxial growth process from an atmosphere composed of a hydrogen halide,semiconductor halide and hydrogen

US3556879A
(en)

*

1968-03-20
1971-01-19
Rca Corp
Method of treating semiconductor devices

US3692571A
(en)

*

1970-11-12
1972-09-19
Northern Electric Co
Method of reducing the mobile ion contamination in thermally grown silicon dioxide

1973

1973-06-29
US
US375297A
patent/US3887726A/en
not_active
Expired – Lifetime

1974

1974-04-29
FR
FR7415813A
patent/FR2235486B1/fr
not_active
Expired

1974-05-11
DE
DE2422970A
patent/DE2422970C3/en
not_active
Expired

1974-05-15
IT
IT22718/74A
patent/IT1012363B/en
active

1974-05-17
GB
GB2219974A
patent/GB1462253A/en
not_active
Expired

1974-05-17
JP
JP49054626A
patent/JPS5240639B2/ja
not_active
Expired

1974-06-04
CA
CA201,591A
patent/CA1027024A/en
not_active
Expired

Cited By (9)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

GB2182061A
(en)

*

1985-10-24
1987-05-07
Rca Corp
Vapor deposition apparatus

GB2182061B
(en)

*

1985-10-24
1990-02-21
Rca Corp
Substrate treatment apparatus

GB2212173A
(en)

*

1987-11-11
1989-07-19
Sumitomo Chemical Co
Heated reactor for vapor-phase growth of films

US4976216A
(en)

*

1987-11-11
1990-12-11
Sumitomo Chemical Co., Ltd.
Apparatus for vapor-phase growth

GB2212173B
(en)

*

1987-11-11
1991-10-16
Sumitomo Chemical Co
Heated reactor fo vapor-phase growth of films

GB2234264A
(en)

*

1989-06-19
1991-01-30
Glaverbel
Pyrolytically forming an oxide coating on a hot glass substrate by pre-mixing reactants

US5089039A
(en)

*

1989-06-19
1992-02-18
Glaverbel
Method for pyrolxtically forming a silicon oxide coating on a hot glass substrate

US5221352A
(en)

*

1989-06-19
1993-06-22
Glaverbel
Apparatus for pyrolytically forming an oxide coating on a hot glass substrate

GB2234264B
(en)

*

1989-06-19
1993-07-28
Glaverbel
Method of and apparatus for pyrolytically forming an oxide coating on a hot glass substrate

Also Published As

Publication number
Publication date

US3887726A
(en)

1975-06-03

JPS5240639B2
(en)

1977-10-13

JPS5023395A
(en)

1975-03-13

CA1027024A
(en)

1978-02-28

FR2235486A1
(en)

1975-01-24

FR2235486B1
(en)

1977-10-14

DE2422970B2
(en)

1980-09-04

DE2422970C3
(en)

1981-06-11

IT1012363B
(en)

1977-03-10

DE2422970A1
(en)

1975-01-23

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Legal Events

Date
Code
Title
Description

1977-06-01
PS
Patent sealed [section 19, patents act 1949]

1987-01-07
PCNP
Patent ceased through non-payment of renewal fee

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