GB1501388A – Mounting assemblies for electronic components
– Google Patents
GB1501388A – Mounting assemblies for electronic components
– Google Patents
Mounting assemblies for electronic components
Info
Publication number
GB1501388A
GB1501388A
GB3354474A
GB3354474A
GB1501388A
GB 1501388 A
GB1501388 A
GB 1501388A
GB 3354474 A
GB3354474 A
GB 3354474A
GB 3354474 A
GB3354474 A
GB 3354474A
GB 1501388 A
GB1501388 A
GB 1501388A
Authority
GB
United Kingdom
Prior art keywords
recessed
thyristor
insulant
discs
plate
Prior art date
1974-07-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3354474A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AEI Semiconductors Ltd
Original Assignee
AEI Semiconductors Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1974-07-30
Filing date
1974-07-30
Publication date
1978-02-15
1974-07-30
Application filed by AEI Semiconductors Ltd
filed
Critical
AEI Semiconductors Ltd
1974-07-30
Priority to GB3354474A
priority
Critical
patent/GB1501388A/en
1974-09-27
Priority to DE19742446235
priority
patent/DE2446235C3/en
1978-02-15
Publication of GB1501388A
publication
Critical
patent/GB1501388A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
H01L23/3731—Ceramic materials or glass
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4075—Mechanical elements
H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4075—Mechanical elements
H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
1501388 Thyristor mountings AEI SEMICONDUCTORS Ltd 20 May 1975 [30 July 1974] 33544/74 Heading H1K An electric component, e.g. a thyristor 1, is mounted on a flat base-plate 2 with an array of cooling fins 3 on its rear surface; the thyristor 1 being sandwiched between a pair of copper bodies 4, 5 and electrically and thermally conductive thrust plates being interposed if necessary between opposing faces of the copper bodies and the contact faces of the thyristor. The terminal members 8, 9 are retained against the copper bodies by studs 10 recessed to accommodate pairs of discs 11, 12; the latter being recessed into an insulant bush 13; the assembly being compressed by a dished spring 14 located by retaining block 16 recessed into the bush and by clamp 15 screwed at 21 to block 16 and secured by tie-rods within insulant tubes 18 to pillars 17 upstanding from the baseplate. A clamping plate 19 screwed to pillars 17 is screwed against spring 22 to retaining block 23 recessed into insulant bush 25 in turn recessed to locate a pair of discs 26, 27 of which the latter is recessed into body 4 or 5; whereby the latter are resiliently clamped against insulant thermally conductive discs 28 of boron nitride resting on bosses 29 apertured into the base-plate 2 and located by rim 29. The retaining pressures of the springs are adjustable, and a direct control connection is made to the thyristor over a flexible cable, not shown. Thermal expansion or contraction is taken up by the springs and the slidable interface between discs 10, 11 and 26, 27. The assembly may be enclosed by a box with a rim secured to the base-plate, and this may be flameproof.
GB3354474A
1974-07-30
1974-07-30
Mounting assemblies for electronic components
Expired
GB1501388A
(en)
Priority Applications (2)
Application Number
Priority Date
Filing Date
Title
GB3354474A
GB1501388A
(en)
1974-07-30
1974-07-30
Mounting assemblies for electronic components
DE19742446235
DE2446235C3
(en)
1974-07-30
1974-09-27
Mounting kit for electronic components
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
GB3354474A
GB1501388A
(en)
1974-07-30
1974-07-30
Mounting assemblies for electronic components
Publications (1)
Publication Number
Publication Date
GB1501388A
true
GB1501388A
(en)
1978-02-15
Family
ID=10354327
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB3354474A
Expired
GB1501388A
(en)
1974-07-30
1974-07-30
Mounting assemblies for electronic components
Country Status (2)
Country
Link
DE
(1)
DE2446235C3
(en)
GB
(1)
GB1501388A
(en)
Cited By (2)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
FR2459552A1
(en)
*
1979-06-19
1981-01-09
Aei Semiconductors Ltd
SUPPORT FOR ELECTRICAL COMPONENTS
US9398723B2
(en)
2013-08-29
2016-07-19
Eaton Corporation
Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat
Families Citing this family (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
EP0168456B1
(en)
*
1984-01-23
1988-06-08
Telemecanique
Mounting and connection device for power semi-conductors
DE3703873A1
(en)
*
1987-02-07
1988-08-18
Sueddeutsche Kuehler Behr
HEAT SINK, ESPECIALLY FOR COOLING ELECTRONIC COMPONENTS
DE3704015C2
(en)
*
1987-02-10
1996-02-22
Hess Joachim
Protective housing made of plastic for repeatedly tightly lockable holding of measuring, switching, monitoring and similar devices
DE10131332A1
(en)
*
2001-06-28
2003-01-23
Hella Kg Hueck & Co
Electrical circuit arrangement with heat-sink, has liner provided between heat -sink contact surface and contact surface of part over which heat-conducting connection is made
1974
1974-07-30
GB
GB3354474A
patent/GB1501388A/en
not_active
Expired
1974-09-27
DE
DE19742446235
patent/DE2446235C3/en
not_active
Expired
Cited By (2)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
FR2459552A1
(en)
*
1979-06-19
1981-01-09
Aei Semiconductors Ltd
SUPPORT FOR ELECTRICAL COMPONENTS
US9398723B2
(en)
2013-08-29
2016-07-19
Eaton Corporation
Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat
Also Published As
Publication number
Publication date
DE2446235C3
(en)
1978-12-14
DE2446235B2
(en)
1977-03-10
DE2446235A1
(en)
1976-02-19
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Legal Events
Date
Code
Title
Description
1978-06-28
PS
Patent sealed
1993-01-20
PCNP
Patent ceased through non-payment of renewal fee
Effective date:
19920520
