GB2012307B – Method of electrodepositing a thin copper foil
– Google Patents
GB2012307B – Method of electrodepositing a thin copper foil
– Google Patents
Method of electrodepositing a thin copper foil
Info
Publication number
GB2012307B
GB2012307B
GB79139A
GB7900139A
GB2012307B
GB 2012307 B
GB2012307 B
GB 2012307B
GB 79139 A
GB79139 A
GB 79139A
GB 7900139 A
GB7900139 A
GB 7900139A
GB 2012307 B
GB2012307 B
GB 2012307B
Authority
GB
United Kingdom
Prior art keywords
electrodepositing
copper foil
thin copper
thin
foil
Prior art date
1978-01-16
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB79139A
Other versions
GB2012307A
(en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Inc
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1978-01-16
Filing date
1979-01-03
Publication date
1982-06-30
1979-01-03
Application filed by Gould Inc
filed
Critical
Gould Inc
1979-07-25
Publication of GB2012307A
publication
Critical
patent/GB2012307A/en
1982-06-30
Application granted
granted
Critical
1982-06-30
Publication of GB2012307B
publication
Critical
patent/GB2012307B/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
C—CHEMISTRY; METALLURGY
C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
C25D3/00—Electroplating: Baths therefor
C25D3/02—Electroplating: Baths therefor from solutions
C25D3/38—Electroplating: Baths therefor from solutions of copper
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/01—Tools for processing; Objects used during processing
H05K2203/0147—Carriers and holders
H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/03—Metal processing
H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/03—Metal processing
H05K2203/0315—Oxidising metal
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
H05K2203/0703—Plating
H05K2203/0723—Electroplating, e.g. finish plating
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
H05K2203/0703—Plating
H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
GB79139A
1978-01-16
1979-01-03
Method of electrodepositing a thin copper foil
Expired
GB2012307B
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US05/869,687
US4169018A
(en)
1978-01-16
1978-01-16
Process for electroforming copper foil
Publications (2)
Publication Number
Publication Date
GB2012307A
GB2012307A
(en)
1979-07-25
GB2012307B
true
GB2012307B
(en)
1982-06-30
Family
ID=25354080
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB79139A
Expired
GB2012307B
(en)
1978-01-16
1979-01-03
Method of electrodepositing a thin copper foil
Country Status (11)
Country
Link
US
(1)
US4169018A
(en)
JP
(1)
JPS6030751B2
(en)
BR
(1)
BR7900244A
(en)
CA
(1)
CA1167406A
(en)
DE
(1)
DE2856682C2
(en)
FR
(1)
FR2414565B1
(en)
GB
(1)
GB2012307B
(en)
IT
(1)
IT1114330B
(en)
LU
(1)
LU80788A1
(en)
NL
(1)
NL185528C
(en)
SE
(1)
SE446348B
(en)
Families Citing this family (26)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US4468293A
(en)
*
1982-03-05
1984-08-28
Olin Corporation
Electrochemical treatment of copper for improving its bond strength
US4515671A
(en)
*
1983-01-24
1985-05-07
Olin Corporation
Electrochemical treatment of copper for improving its bond strength
US4565607A
(en)
*
1984-03-09
1986-01-21
Energy Conversion Devices, Inc.
Method of fabricating an electroplated substrate
US4530739A
(en)
*
1984-03-09
1985-07-23
Energy Conversion Devices, Inc.
Method of fabricating an electroplated substrate
KR100275899B1
(en)
*
1990-05-30
2000-12-15
마이클 에이. 센타니
Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
US5403465A
(en)
*
1990-05-30
1995-04-04
Gould Inc.
Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5431803A
(en)
*
1990-05-30
1995-07-11
Gould Electronics Inc.
Electrodeposited copper foil and process for making same
US5527998A
(en)
*
1993-10-22
1996-06-18
Sheldahl, Inc.
Flexible multilayer printed circuit boards and methods of manufacture
KR0157889B1
(en)
*
1995-07-24
1999-02-01
문정환
Method of depositing cu selectively
TW432124B
(en)
*
1996-05-13
2001-05-01
Mitsui Mining & Amp Smelting C
Electrolytic copper foil with high post heat tensile strength and its manufacturing method
AU6159898A
(en)
*
1997-02-14
1998-09-08
Dover Industrial Chrome, Inc.
Plating apparatus and method
SG101924A1
(en)
*
1998-10-19
2004-02-27
Mitsui Mining & Smelting Co
Composite material used in making printed wiring boards
EP0996318B1
(en)
*
1998-10-19
2006-04-19
Mitsui Mining & Smelting Co., Ltd.
Novel composite foil, process for producing the same and copper-clad laminate
SG100612A1
(en)
*
1998-10-21
2003-12-26
Mitsui Mining & Smelting Co
Novel composite foil, process for producing the same and copper-clad laminate
US6224737B1
(en)
1999-08-19
2001-05-01
Taiwan Semiconductor Manufacturing Company
Method for improvement of gap filling capability of electrochemical deposition of copper
US6354916B1
(en)
*
2000-02-11
2002-03-12
Nu Tool Inc.
Modified plating solution for plating and planarization and process utilizing same
US6350364B1
(en)
2000-02-18
2002-02-26
Taiwan Semiconductor Manufacturing Company
Method for improvement of planarity of electroplated copper
EP1225253A1
(en)
*
2001-01-22
2002-07-24
DSL Dresden Material-Innovation GmbH
A continuous electroforming process to form a strip for battery electrodes and a mandrel to be used in said electroforming process
US6893742B2
(en)
*
2001-02-15
2005-05-17
Olin Corporation
Copper foil with low profile bond enhancement
US7132158B2
(en)
*
2003-10-22
2006-11-07
Olin Corporation
Support layer for thin copper foil
EP1897973A1
(en)
*
2006-09-07
2008-03-12
Enthone, Inc.
Deposition of conductive polymer and metallization of non-conductive substrates
JP5236648B2
(en)
2006-09-07
2013-07-17
エンソン インコーポレイテッド
Method for metal wiring the surface of an insulating substrate with electroplated copper metal wiring
US7875900B2
(en)
*
2008-12-01
2011-01-25
Celsia Technologies Taiwan, Inc.
Thermally conductive structure of LED and manufacturing method thereof
US20130264214A1
(en)
*
2012-04-04
2013-10-10
Rohm And Haas Electronic Materials Llc
Metal plating for ph sensitive applications
US10131998B2
(en)
2015-10-02
2018-11-20
Global Solar Energy, Inc.
Metalization of flexible polymer sheets
US10040271B1
(en)
2015-10-02
2018-08-07
Global Solar Energy, Inc.
Metalization of flexible polymer sheets
Family Cites Families (7)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US2871172A
(en)
*
1955-11-02
1959-01-27
James T N Atkinson
Electro-plating of metals
US2882209A
(en)
*
1957-05-20
1959-04-14
Udylite Res Corp
Electrodeposition of copper from an acid bath
US3634205A
(en)
*
1968-09-27
1972-01-11
Bunker Ramo
Method of plating a uniform copper layer on an apertured printed circuit board
BE788117A
(en)
*
1971-08-30
1973-02-28
Perstorp Ab
PROCESS FOR THE PRODUCTION OF ELEMENTS FOR PRINTED CIRCUITS
US3998601A
(en)
*
1973-12-03
1976-12-21
Yates Industries, Inc.
Thin foil
CA1044636A
(en)
*
1974-01-07
1978-12-19
Betty L. Berdan
Method of nodularizing a metal surface
US3969199A
(en)
*
1975-07-07
1976-07-13
Gould Inc.
Coating aluminum with a strippable copper deposit
1978
1978-01-16
US
US05/869,687
patent/US4169018A/en
not_active
Expired – Lifetime
1978-12-19
CA
CA000318233A
patent/CA1167406A/en
not_active
Expired
1978-12-29
DE
DE2856682A
patent/DE2856682C2/en
not_active
Expired
1979
1979-01-03
GB
GB79139A
patent/GB2012307B/en
not_active
Expired
1979-01-12
FR
FR7900765A
patent/FR2414565B1/en
not_active
Expired
1979-01-12
IT
IT47609/79A
patent/IT1114330B/en
active
1979-01-15
BR
BR7900244A
patent/BR7900244A/en
unknown
1979-01-15
NL
NLAANVRAGE7900311,A
patent/NL185528C/en
not_active
IP Right Cessation
1979-01-15
LU
LU80788A
patent/LU80788A1/en
unknown
1979-01-15
SE
SE7900329A
patent/SE446348B/en
not_active
IP Right Cessation
1979-01-16
JP
JP54002309A
patent/JPS6030751B2/en
not_active
Expired
Also Published As
Publication number
Publication date
IT1114330B
(en)
1986-01-27
FR2414565A1
(en)
1979-08-10
SE446348B
(en)
1986-09-01
SE7900329L
(en)
1979-07-17
FR2414565B1
(en)
1985-06-28
DE2856682C2
(en)
1986-07-31
JPS6030751B2
(en)
1985-07-18
CA1167406A
(en)
1984-05-15
DE2856682A1
(en)
1979-07-19
JPS54101725A
(en)
1979-08-10
LU80788A1
(en)
1979-05-16
NL7900311A
(en)
1979-07-18
NL185528C
(en)
1990-05-01
US4169018A
(en)
1979-09-25
BR7900244A
(en)
1979-08-14
GB2012307A
(en)
1979-07-25
IT7947609D0
(en)
1979-01-12
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Legal Events
Date
Code
Title
Description
1994-04-27
732E
Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
1996-08-21
PCNP
Patent ceased through non-payment of renewal fee
Effective date:
19960103
