GB2016487A – Articles for electrical use and compositions useful therefor
– Google Patents
GB2016487A – Articles for electrical use and compositions useful therefor
– Google Patents
Articles for electrical use and compositions useful therefor
Info
Publication number
GB2016487A
GB2016487A
GB7904632A
GB7904632A
GB2016487A
GB 2016487 A
GB2016487 A
GB 2016487A
GB 7904632 A
GB7904632 A
GB 7904632A
GB 7904632 A
GB7904632 A
GB 7904632A
GB 2016487 A
GB2016487 A
GB 2016487A
Authority
GB
United Kingdom
Prior art keywords
polyamide
imide
weight
parts
electrical
Prior art date
1978-02-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7904632A
Other versions
GB2016487B
(en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1978-02-17
Filing date
1979-02-09
Publication date
1979-09-26
1978-02-17
Priority claimed from JP1661278A
external-priority
patent/JPS54110266A/en
1978-04-28
Priority claimed from JP5121478A
external-priority
patent/JPS54143462A/en
1978-05-25
Priority claimed from JP6163778A
external-priority
patent/JPS54153298A/en
1978-05-25
Priority claimed from JP6260578A
external-priority
patent/JPS54154071A/en
1978-05-25
Priority claimed from JP6260478A
external-priority
patent/JPS54154080A/en
1978-07-21
Priority claimed from JP8836578A
external-priority
patent/JPS6030353B2/en
1978-07-21
Priority claimed from JP8836778A
external-priority
patent/JPS5515827A/en
1978-07-21
Priority claimed from JP8836478A
external-priority
patent/JPS5516026A/en
1978-07-21
Priority claimed from JP8836378A
external-priority
patent/JPS5516319A/en
1978-07-24
Priority claimed from JP8939178A
external-priority
patent/JPS5516054A/en
1978-07-24
Priority claimed from JP8939278A
external-priority
patent/JPS6056622B2/en
1978-07-24
Priority claimed from JP53089393A
external-priority
patent/JPS6038011B2/en
1978-07-27
Priority claimed from JP9093478A
external-priority
patent/JPS5518426A/en
1978-07-27
Priority claimed from JP9093378A
external-priority
patent/JPS5518425A/en
1979-02-09
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK
filed
Critical
Asahi Chemical Industry Co Ltd
1979-09-26
Publication of GB2016487A
publication
Critical
patent/GB2016487A/en
1983-02-23
Publication of GB2016487B
publication
Critical
patent/GB2016487B/en
1983-02-23
Application granted
granted
Critical
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
H01B3/306—Polyimides or polyesterimides
C—CHEMISTRY; METALLURGY
C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
C08K3/00—Use of inorganic substances as compounding ingredients
C08K3/02—Elements
C08K3/08—Metals
C—CHEMISTRY; METALLURGY
C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
C08K3/00—Use of inorganic substances as compounding ingredients
C08K3/10—Metal compounds
C—CHEMISTRY; METALLURGY
C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
C08K5/00—Use of organic ingredients
C08K5/54—Silicon-containing compounds
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
H01B3/305—Polyamides or polyesteramides
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/02—Details
H05K1/03—Use of materials for the substrate
H05K1/0313—Organic insulating material
H05K1/032—Organic insulating material consisting of one material
H05K1/0346—Organic insulating material consisting of one material containing N
Abstract
An article for electrical use such as insulative substrates electrical circuit boards and electrical elements, wholly or partly consisting of an aromatic polyamide-imide having a reduced viscosity of from about 0.3 to 1.5, which polyamide-imide may contain a granular material dispersed therein, and a composition comprising 100 parts by weight of said polyamide-imide and additionally about 100 to 4,000 parts by weight of a granular material and optionally about 10 to 10,000 parts by weight of a polar organic solvent. The polyamide-imides are defined by a number of alternative general formulae the common features of which are that the only carboxylic acid residues are those of trimoellitic acid and that these are linked by one or two aromatic amines at least one of which has its linkages at the meta or 3,3′ positions. The resulting articles have reliable and accurate electrical characteristics.
GB7904632A
1978-02-17
1979-02-09
Articles for electrical use and compositions useful therefor
Expired
GB2016487B
(en)
Applications Claiming Priority (14)
Application Number
Priority Date
Filing Date
Title
JP1661278A
JPS54110266A
(en)
1978-02-17
1978-02-17
Heat resistant resin composition dispersed with fine metal powder
JP5121478A
JPS54143462A
(en)
1978-04-28
1978-04-28
Granule-containing polyamideimide composition
JP6260578A
JPS54154071A
(en)
1978-05-25
1978-05-25
Method of producing thick film resistance circuit
JP6260478A
JPS54154080A
(en)
1978-05-25
1978-05-25
Method of producing printed circuit board
JP6163778A
JPS54153298A
(en)
1978-05-25
1978-05-25
Heatproof resistance material composition
JP8836378A
JPS5516319A
(en)
1978-07-21
1978-07-21
Refractory organic electronic material
JP8836478A
JPS5516026A
(en)
1978-07-21
1978-07-21
Novel organic electronic material composition
JP8836578A
JPS6030353B2
(en)
1978-07-21
1978-07-21
Polyimide film with heat-resistant adhesive layer
JP8836778A
JPS5515827A
(en)
1978-07-21
1978-07-21
Heattproof substrate
JP8939178A
JPS5516054A
(en)
1978-07-24
1978-07-24
Heat-resistant coating composition
JP8939278A
JPS6056622B2
(en)
1978-07-24
1978-07-24
Aromatic polyamideimide laminate
JP53089393A
JPS6038011B2
(en)
1978-07-24
1978-07-24
Heat-resistant resistance material composition
JP9093478A
JPS5518426A
(en)
1978-07-27
1978-07-27
Heat-resistant flexible electronic parts
JP9093378A
JPS5518425A
(en)
1978-07-27
1978-07-27
Heat-resistant molded article and method for molding the same
Publications (2)
Publication Number
Publication Date
GB2016487A
true
GB2016487A
(en)
1979-09-26
GB2016487B
GB2016487B
(en)
1983-02-23
Family
ID=27584787
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB7904632A
Expired
GB2016487B
(en)
1978-02-17
1979-02-09
Articles for electrical use and compositions useful therefor
Country Status (5)
Country
Link
US
(1)
US4377652A
(en)
CA
(1)
CA1123981A
(en)
DE
(1)
DE2905857C2
(en)
GB
(1)
GB2016487B
(en)
NL
(1)
NL181739C
(en)
Cited By (5)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
FR2546704A1
(en)
*
1983-05-27
1984-11-30
Rhone Poulenc Sa
METALLIZABLE SUBSTRATES FOR PRINTED CIRCUITS AND PROCESS FOR PREPARING THE SAME
EP0171157A2
(en)
*
1984-07-06
1986-02-12
National Starch and Chemical Investment Holding Corporation
Solventless, polyimide-modified epoxy composition
FR2622892A1
(en)
*
1987-11-10
1989-05-12
Alsthom
MODIFIED POLYAMIDE-IMIDE-BASED VARNISH, METHOD FOR PRODUCING THE SAME, AND INSULATED ELECTRICAL CONDUCTOR USING SUCH VARNISH
EP0543409A2
(en)
*
1991-11-22
1993-05-26
Sumitomo Electric Industries, Ltd
Insulated wire
GB2332910A
(en)
*
1997-12-31
1999-07-07
Samsung Electronics Co Ltd
Polyamideimide for optical communications
Families Citing this family (27)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US4447574A
(en)
*
1982-06-29
1984-05-08
Standard Oil Company (Indiana)
Injection moldable amide-imide polymers containing calcium moieties
JPS60137092A
(en)
*
1983-12-19
1985-07-20
株式会社東芝
Circuit board
US4679122A
(en)
*
1984-10-09
1987-07-07
General Electric Company
Metal core printed circuit board
JPH072843B2
(en)
*
1985-07-15
1995-01-18
三菱油化株式会社
Aromatic thioetheramide imide polymer
US4898754A
(en)
*
1986-09-30
1990-02-06
The Boeing Company
Poly(amide-imide) prepreg and composite processing
US5296074A
(en)
*
1987-03-30
1994-03-22
E. I. Du Pont De Nemours And Company
Method for bonding small electronic components
GB2207439B
(en)
*
1987-07-27
1992-02-12
Metal Box Plc
Improvements in and relating to packaging
DE3829712A1
(en)
*
1988-09-01
1990-03-15
Basf Ag
TEMPERATURE-RESISTANT THERMOPLASTIC MOLDS
US5270371A
(en)
*
1992-10-02
1993-12-14
General Electric Company
Adhesive compositions for electronic packages
US5468798A
(en)
*
1994-02-18
1995-11-21
Whitford Corporation
Basecoat for a coating system
DE69619484D1
(en)
*
1995-12-12
2002-04-04
Sumitomo Metal Mining Co
Coating solution for forming a heat radiation shielding film and method for producing a heat radiation shielding film using the same
KR100307509B1
(en)
*
1998-07-21
2001-11-30
김충섭
Ceramic-Containing Carbon / Carbon Composites and Manufacturing Method Thereof
US6319604B1
(en)
*
1999-07-08
2001-11-20
Phelps Dodge Industries, Inc.
Abrasion resistant coated wire
KR100917101B1
(en)
*
2000-08-04
2009-09-15
도요 보세키 가부시키가이샤
Flexible metal laminate and production method thereof
DE10121270A1
(en)
*
2001-04-30
2003-02-06
Epcos Ag
Passivation material for an electrical component as well as piezoelectric component in multilayer construction
US6914093B2
(en)
2001-10-16
2005-07-05
Phelps Dodge Industries, Inc.
Polyamideimide composition
US7973122B2
(en)
*
2004-06-17
2011-07-05
General Cable Technologies Corporation
Polyamideimide compositions having multifunctional core structures
US7382627B2
(en)
*
2004-10-18
2008-06-03
E.I. Du Pont De Nemours And Company
Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
US7430128B2
(en)
*
2004-10-18
2008-09-30
E.I. Du Pont De Nemours And Company
Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
US7436678B2
(en)
*
2004-10-18
2008-10-14
E.I. Du Pont De Nemours And Company
Capacitive/resistive devices and printed wiring boards incorporating such devices and methods of making thereof
US20080193637A1
(en)
*
2006-01-03
2008-08-14
Murray Thomas J
Abrasion resistant coated wire
US20070151743A1
(en)
*
2006-01-03
2007-07-05
Murray Thomas J
Abrasion resistant coated wire
US20080200084A1
(en)
*
2007-02-16
2008-08-21
Angus Richard O
Compositions for thin circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
EP2440895B1
(en)
*
2009-06-10
2014-07-30
BERNS Engineering Consulting GmbH
Fast response temperature measurement within a gas turbine
CN110014715A
(en)
*
2012-11-15
2019-07-16
艾伦塔斯Pdg股份有限公司
Insulation film
CN107848260B
(en)
*
2015-07-23
2020-10-30
三井金属矿业株式会社
Copper foil with resin, copper-clad laminate, and printed wiring board
US20170174937A1
(en)
*
2015-12-20
2017-06-22
Ryan David Allmandinger
Electrically Conductive Polyamide-imide Mixture for the Purpose of Creating Electrical Circuits.
Citations (6)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB1032649A
(en)
*
1963-12-12
1966-06-15
Westinghouse Electric Corp
Aromatic amide-imide polymers
GB1175555A
(en)
*
1966-01-25
1969-12-23
Sumitomo Electrical Ind Ltd
Polyamideimides and the process for preparing them
GB1181446A
(en)
*
1966-07-22
1970-02-18
Hitachi Chemical Co Ltd
Process for producing Amide-Imide Resins
GB1220590A
(en)
*
1966-12-29
1971-01-27
Sumitomo Electric Industries
Soluble polyamideimide resins
GB1444676A
(en)
*
1973-04-09
1976-08-04
Standard Oil Co
Polyamid-imide polymers and processes for their production
GB1473055A
(en)
*
1974-09-12
1977-05-11
Bayer Ag
Process for the production of polycondensate containing cyclic imide groups
Family Cites Families (20)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
FR1386617A
(en)
*
1963-01-21
1965-01-22
Standard Oil Co
Improvements to polyamides derived from trimellitic anhydride, to processes for their preparation, and to articles comprising such polyamides
US3513134A
(en)
*
1966-11-23
1970-05-19
Anaconda Wire & Cable Co
Polyamide-imide enamel containing (1) dicyandiamide or (2) dicyandiamide and triphenyl phosphite
AT270224B
(en)
*
1967-03-20
1969-04-25
Beck & Co Ag Dr
Process for the production of new, thermally stable, linear polyamide-imides
US3472815A
(en)
*
1967-06-02
1969-10-14
Standard Oil Co
Novel polyimide-imines and polyamide-imines
GB1213327A
(en)
*
1968-05-09
1970-11-25
Hawker Siddeley Dynamics Ltd
Improved apparatus for transferring fluid coolant from a fluid reservoir to a vessel of use
GB1363448A
(en)
*
1970-10-05
1974-08-14
Fuji Photo Film Co Ltd
Magnetic recording material
US3726712A
(en)
*
1971-05-26
1973-04-10
Standard Oil Co
Double coated electrical conductor
DE2202145C3
(en)
*
1972-01-18
1979-12-20
Basf Ag, 6700 Ludwigshafen
Process for the production of polyamide-imides
US3753998A
(en)
*
1972-04-24
1973-08-21
Standard Oil Co
Composition and process for producing polyamide-imide and polyamide polymers
JPS5129257B2
(en)
*
1972-06-02
1976-08-24
US3975345A
(en)
*
1972-06-23
1976-08-17
General Electric Company
Polyamideimides and method for making
JPS5218854B2
(en)
*
1972-07-13
1977-05-24
JPS5429648B2
(en)
*
1972-07-21
1979-09-25
JPS5549274B2
(en)
*
1972-08-03
1980-12-11
JPS5130637B2
(en)
*
1972-09-01
1976-09-02
US3926916A
(en)
*
1972-12-22
1975-12-16
Du Pont
Dielectric composition capable of electrical activation
US3860559A
(en)
*
1973-02-22
1975-01-14
Toray Industries
Method of preparing a soluble high molecular weight aromatic polyamide imide composition
DE2441020C3
(en)
1974-08-27
1982-01-07
Basf Ag, 6700 Ludwigshafen
Process for the production of viscosity-stable polyamide-imide solutions
US4066631A
(en)
*
1975-05-19
1978-01-03
Pennwalt Corporation
Process for preparation of linear polyamide-imides from aromatic tricarboxylic acid anhydrides and diamines
US4167620A
(en)
*
1978-02-01
1979-09-11
Standard Oil Company (Indiana)
Method for heat treating shaped articles of amide-imide or amic acid polymers
1979
1979-02-08
US
US06/010,290
patent/US4377652A/en
not_active
Expired – Lifetime
1979-02-09
GB
GB7904632A
patent/GB2016487B/en
not_active
Expired
1979-02-15
DE
DE2905857A
patent/DE2905857C2/en
not_active
Expired
1979-02-16
CA
CA321,623A
patent/CA1123981A/en
not_active
Expired
1979-02-16
NL
NLAANVRAGE7901256,A
patent/NL181739C/en
not_active
IP Right Cessation
Patent Citations (6)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB1032649A
(en)
*
1963-12-12
1966-06-15
Westinghouse Electric Corp
Aromatic amide-imide polymers
GB1175555A
(en)
*
1966-01-25
1969-12-23
Sumitomo Electrical Ind Ltd
Polyamideimides and the process for preparing them
GB1181446A
(en)
*
1966-07-22
1970-02-18
Hitachi Chemical Co Ltd
Process for producing Amide-Imide Resins
GB1220590A
(en)
*
1966-12-29
1971-01-27
Sumitomo Electric Industries
Soluble polyamideimide resins
GB1444676A
(en)
*
1973-04-09
1976-08-04
Standard Oil Co
Polyamid-imide polymers and processes for their production
GB1473055A
(en)
*
1974-09-12
1977-05-11
Bayer Ag
Process for the production of polycondensate containing cyclic imide groups
Cited By (13)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
FR2546704A1
(en)
*
1983-05-27
1984-11-30
Rhone Poulenc Sa
METALLIZABLE SUBSTRATES FOR PRINTED CIRCUITS AND PROCESS FOR PREPARING THE SAME
EP0128843A1
(en)
*
1983-05-27
1984-12-19
Ciba-Geigy Ag
Metallizable substrates for printed circuits, and process for their production
EP0171157A2
(en)
*
1984-07-06
1986-02-12
National Starch and Chemical Investment Holding Corporation
Solventless, polyimide-modified epoxy composition
EP0171157A3
(en)
*
1984-07-06
1987-09-30
Stauffer Chemical Company
Solventless, polyimide-modified epoxy composition
FR2622892A1
(en)
*
1987-11-10
1989-05-12
Alsthom
MODIFIED POLYAMIDE-IMIDE-BASED VARNISH, METHOD FOR PRODUCING THE SAME, AND INSULATED ELECTRICAL CONDUCTOR USING SUCH VARNISH
EP0315925A1
(en)
*
1987-11-10
1989-05-17
Gec Alsthom Sa
Varnish based on a modified polyamide-imide and process for its preparation
EP0543409A2
(en)
*
1991-11-22
1993-05-26
Sumitomo Electric Industries, Ltd
Insulated wire
EP0543409A3
(en)
*
1991-11-22
1993-10-13
Sumitomo Electric Industries, Ltd
Insulated wire
US5356708A
(en)
*
1991-11-22
1994-10-18
Sumitomo Electric Industries, Ltd.
Insulated wire
CN1073264C
(en)
*
1991-11-22
2001-10-17
住友电气工业株式会社
Insulated wire
GB2332910A
(en)
*
1997-12-31
1999-07-07
Samsung Electronics Co Ltd
Polyamideimide for optical communications
US6028159A
(en)
*
1997-12-31
2000-02-22
Samsung Electronics Co., Ltd.
Polyamideimide for optical communications and method for preparing the same
GB2332910B
(en)
*
1997-12-31
2000-03-08
Samsung Electronics Co Ltd
Polyamideimide for optical communications and method for preparing the same
Also Published As
Publication number
Publication date
GB2016487B
(en)
1983-02-23
DE2905857A1
(en)
1979-08-30
NL7901256A
(en)
1979-08-21
NL181739C
(en)
1987-10-16
CA1123981A
(en)
1982-05-18
DE2905857C2
(en)
1986-09-25
NL181739B
(en)
1987-05-18
US4377652A
(en)
1983-03-22
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Legal Events
Date
Code
Title
Description
1995-10-04
PCNP
Patent ceased through non-payment of renewal fee
Effective date:
19950209
