GB2018345A – Clamp for fixing a semiconductor device to a heat sink
– Google Patents
GB2018345A – Clamp for fixing a semiconductor device to a heat sink
– Google Patents
Clamp for fixing a semiconductor device to a heat sink
Info
Publication number
GB2018345A
GB2018345A
GB7908391A
GB7908391A
GB2018345A
GB 2018345 A
GB2018345 A
GB 2018345A
GB 7908391 A
GB7908391 A
GB 7908391A
GB 7908391 A
GB7908391 A
GB 7908391A
GB 2018345 A
GB2018345 A
GB 2018345A
Authority
GB
United Kingdom
Prior art keywords
clamp
fixing
semiconductor device
heat sink
sink
Prior art date
1978-03-09
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7908391A
Other versions
GB2018345B
(en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
ATES Componenti Elettronici SpA
SGS ATES Componenti Elettronici SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1978-03-09
Filing date
1979-03-09
Publication date
1979-10-17
1979-03-09
Application filed by ATES Componenti Elettronici SpA, SGS ATES Componenti Elettronici SpA
filed
Critical
ATES Componenti Elettronici SpA
1979-10-17
Publication of GB2018345A
publication
Critical
patent/GB2018345A/en
1982-03-31
Application granted
granted
Critical
1982-03-31
Publication of GB2018345B
publication
Critical
patent/GB2018345B/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
H01L23/495—Lead-frames or other flat leads
H01L23/49541—Geometry of the lead-frame
H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4075—Mechanical elements
H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4075—Mechanical elements
H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, «first-level» interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
H01L2224/4805—Shape
H01L2224/4809—Loop shape
H01L2224/48091—Arched
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, «first-level» interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
H01L2224/481—Disposition
H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
GB7908391A
1978-03-09
1979-03-09
Clamp for fixing a semiconductor device to a heat sink
Expired
GB2018345B
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
IT7821073U
IT7821073V0
(en)
1978-03-09
1978-03-09
CLAMP FOR FIXING A SEMICONDUCTOR DEVICE TO A HEAT SINK.
Publications (2)
Publication Number
Publication Date
GB2018345A
true
GB2018345A
(en)
1979-10-17
GB2018345B
GB2018345B
(en)
1982-03-31
Family
ID=11176322
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB7908391A
Expired
GB2018345B
(en)
1978-03-09
1979-03-09
Clamp for fixing a semiconductor device to a heat sink
Country Status (5)
Country
Link
US
(1)
US4259685A
(en)
DE
(1)
DE7906405U1
(en)
FR
(1)
FR2419659A7
(en)
GB
(1)
GB2018345B
(en)
IT
(1)
IT7821073V0
(en)
Cited By (6)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
EP0102201A1
(en)
*
1982-08-02
1984-03-07
Medtronic, Inc.
In line and bifurcating cardiac pacing lead connector
GB2224068A
(en)
*
1988-10-20
1990-04-25
Stc Plc
Equipment mounting
DE19508340A1
(en)
*
1995-03-09
1996-09-12
Abb Management Ag
Fixing device for electronic components
DE29709210U1
(en)
*
1997-05-26
1997-07-31
Roland Man Druckmasch
Fastener combination
EP1708260A3
(en)
*
2005-03-31
2013-05-01
Hitachi Industrial Equipment Systems Co., Ltd.
Electric circuit module as well as power converter and vehicle-mounted electric system that include the module
EP3444839A1
(en)
*
2017-08-18
2019-02-20
Infineon Technologies Austria AG
Assembly and method for mounting an electronic component to a substrate
Families Citing this family (41)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US4530003A
(en)
*
1981-02-02
1985-07-16
Motorola, Inc.
Low-cost power device package with quick connect terminals and electrically isolated mounting means
WO1982003294A1
(en)
*
1981-03-23
1982-09-30
Inc Motorola
Semiconductor device including plateless package
US4460917A
(en)
*
1982-06-03
1984-07-17
Motorola, Inc.
Molded-in isolation bushing for semiconductor devices
US4611389A
(en)
*
1983-11-03
1986-09-16
Motorola, Inc.
Low-cost power device package with quick-connect terminals and electrically isolated mounting means
IT1213139B
(en)
*
1984-02-17
1989-12-14
Ates Componenti Elettron
SINGLE-IN-LINE INTEGRATED ELECTRONIC COMPONENT AND PROCEDURE FOR ITS MANUFACTURE.
DE3409037A1
(en)
*
1984-03-13
1985-09-19
Robert Bosch Gmbh, 7000 Stuttgart
ELECTRICAL SWITCHGEAR
US4604529A
(en)
*
1984-09-28
1986-08-05
Cincinnati Microwave, Inc.
Radar warning receiver with power plug
DE3440334A1
(en)
*
1984-11-05
1986-05-15
Siemens AG, 1000 Berlin und 8000 München
Device for mounting a semiconductor component on a heat sink
DE3505085A1
(en)
*
1985-02-14
1986-08-14
Brown, Boveri & Cie Ag, 6800 Mannheim
Power semiconductor module having a plastic housing
IT1215267B
(en)
*
1985-04-26
1990-01-31
Ates Componenti Elettron
APPARATUS AND METHOD FOR THE PERFECTED THERMAL COUPLING OF A SEMICONDUCTOR CONTAINER TO A COOLING PLATE AND THE INCREASED ELECTRICAL COUPLING OF CONTAINER CONDUCTORS ON MORE THAN ONE SIDE OF THE CONTAINER ON A CIRCUIT BOARD.
US4720771A
(en)
*
1985-07-05
1988-01-19
Chrysler Motors Corporation
Heat sink assembly for a circuit board mounted integrated circuit
US4729426A
(en)
*
1986-03-06
1988-03-08
Thermalloy Incorporated
Bonded clip heat sink
JPS62226647A
(en)
*
1986-03-24
1987-10-05
スア−マロイ、インコ−パレイテイド
Fixing device
US4990987A
(en)
*
1986-12-18
1991-02-05
Gte Products Corporation
Over-temperature sensor and protector for semiconductor devices
US4878108A
(en)
*
1987-06-15
1989-10-31
International Business Machines Corporation
Heat dissipation package for integrated circuits
US4845590A
(en)
*
1987-11-02
1989-07-04
Chrysler Motors Corporation
Heat sink for electrical components
US4891735A
(en)
*
1987-11-02
1990-01-02
Chrysler Motors Corporation
Heat sink for electrical components
US4922601A
(en)
*
1987-11-02
1990-05-08
Chrysler Corporation
Method of making a heat sink for electrical components
US4923179A
(en)
*
1987-11-02
1990-05-08
Chrysler Corporation
Spring panel heat sink for electrical components
US5019942A
(en)
*
1987-11-30
1991-05-28
Thermalloy Incorporated
Insulating apparatus for electronic device assemblies
US4888637A
(en)
*
1988-01-15
1989-12-19
Chrysler Motors Corporation
Multiple semiconductor heat sink/mounting assembly
US4970579A
(en)
*
1988-09-21
1990-11-13
International Business Machines Corp.
Integrated circuit package with improved cooling means
US5825088A
(en)
*
1991-05-01
1998-10-20
Spectrian, Inc.
Low thermal resistance semiconductor package and mounting structure
US5825089A
(en)
*
1991-05-01
1998-10-20
Spectrian, Inc.
Low thermal resistance spring biased RF semiconductor package mounting structure
FR2679729B1
(en)
*
1991-07-23
1994-04-29
Alcatel Telspace
HEATSINK.
DE59406013D1
(en)
*
1993-06-07
1998-06-25
Melcher Ag
FASTENING DEVICE FOR SEMICONDUCTOR SWITCHING ELEMENTS
DE4331377A1
(en)
*
1993-09-15
1995-03-16
Siemens Matsushita Components
Electrical component
US5396404A
(en)
*
1993-09-20
1995-03-07
Delco Electronics Corp.
Heat sinking assembly for electrical components
US5327324A
(en)
*
1993-11-05
1994-07-05
Ford Motor Company
Spring clip for a heat sink apparatus
DE4432057A1
(en)
*
1994-09-09
1996-03-14
Bosch Gmbh Robert
Device for deriving the thermal power loss of an electronic or electromechanical component
US5504653A
(en)
*
1994-11-21
1996-04-02
Delco Electronics Corp.
Heat sinking assembly for electrical components
US5592021A
(en)
*
1995-04-26
1997-01-07
Martin Marietta Corporation
Clamp for securing a power device to a heatsink
US5850104A
(en)
*
1997-01-06
1998-12-15
Spectrian, Inc.
Integral lid/clamp for high power transistor
US6348727B1
(en)
*
1998-12-15
2002-02-19
International Rectifier Corporation
High current semiconductor device package with plastic housing and conductive tab
US6597065B1
(en)
*
2000-11-03
2003-07-22
Texas Instruments Incorporated
Thermally enhanced semiconductor chip having integrated bonds over active circuits
JP4154325B2
(en)
*
2003-12-19
2008-09-24
株式会社日立産機システム
Electrical circuit module
TWI425907B
(en)
*
2010-09-21
2014-02-01
Delta Electronics Inc
Assembly structure of electronic device and heat sink and insulating device thereof
DE102014018821B4
(en)
2014-12-19
2019-07-25
Jenoptik Optical Systems Gmbh
diode laser attachment
CN105376998B
(en)
*
2015-11-19
2018-04-13
重庆华万伦电器有限公司
The clipping aluminum alloy heat sink of elastic clip
US11076477B2
(en)
*
2017-10-03
2021-07-27
Mks Instruments, Inc.
Cooling and compression clamp for short lead power devices
EP3709346B1
(en)
*
2019-03-15
2023-01-18
Infineon Technologies Austria AG
An electronic module comprising a semiconductor package with integrated clip and fastening element
Family Cites Families (6)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3548927A
(en)
*
1968-11-29
1970-12-22
Intern Electronic Research Co
Heat dissipating retainer for electronic component
US3694703A
(en)
*
1970-09-02
1972-09-26
Staver Co Inc The
Heat dissipator for encased semiconductor device having heat tab extending therefrom
US3786317A
(en)
*
1972-11-09
1974-01-15
Bell Telephone Labor Inc
Microelectronic circuit package
US4054901A
(en)
*
1975-10-14
1977-10-18
Thermalloy, Inc.
Index mounting unitary heat sink apparatus with apertured base
JPS5266376A
(en)
*
1975-11-29
1977-06-01
Hitachi Ltd
Device and manufacture of resin body type semiconductor
DE2712543C2
(en)
*
1976-03-24
1982-11-11
Hitachi, Ltd., Tokyo
Arrangement of a semiconductor component on a mounting plate
1978
1978-03-09
IT
IT7821073U
patent/IT7821073V0/en
unknown
1979
1979-02-27
FR
FR7904950A
patent/FR2419659A7/en
not_active
Expired
1979-03-08
US
US06/018,638
patent/US4259685A/en
not_active
Expired – Lifetime
1979-03-08
DE
DE19797906405U
patent/DE7906405U1/en
not_active
Expired
1979-03-09
GB
GB7908391A
patent/GB2018345B/en
not_active
Expired
Cited By (7)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
EP0102201A1
(en)
*
1982-08-02
1984-03-07
Medtronic, Inc.
In line and bifurcating cardiac pacing lead connector
GB2224068A
(en)
*
1988-10-20
1990-04-25
Stc Plc
Equipment mounting
DE19508340A1
(en)
*
1995-03-09
1996-09-12
Abb Management Ag
Fixing device for electronic components
DE29709210U1
(en)
*
1997-05-26
1997-07-31
Roland Man Druckmasch
Fastener combination
EP1708260A3
(en)
*
2005-03-31
2013-05-01
Hitachi Industrial Equipment Systems Co., Ltd.
Electric circuit module as well as power converter and vehicle-mounted electric system that include the module
EP3444839A1
(en)
*
2017-08-18
2019-02-20
Infineon Technologies Austria AG
Assembly and method for mounting an electronic component to a substrate
US11211304B2
(en)
2017-08-18
2021-12-28
Infineon Technologies Austria Ag
Assembly and method for mounting an electronic component to a substrate
Also Published As
Publication number
Publication date
GB2018345B
(en)
1982-03-31
DE7906405U1
(en)
1979-07-26
IT7821073V0
(en)
1978-03-09
FR2419659A7
(en)
1979-10-05
US4259685A
(en)
1981-03-31
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Legal Events
Date
Code
Title
Description
1999-03-31
PE20
Patent expired after termination of 20 years
Effective date:
19990308
